公开(公告)号：US20220102592A1

公开(公告)日：2022-03-31

申请号：US17548691

申请日：2021-12-13

Applicant: Nichia Corporation

Inventor： Koji ABE ,  Yuki SHIOTA

IPC: H01L33/48 ,  H01L33/00 ,  H01L33/56 ,  H01L33/50 ,  H01L21/56 ,  H01L23/31

Abstract: A package for mounting a light emitting element includes: a first lead electrode defining a portion of a bottom of a recess and comprising a base member and a plating disposed on the base member, and wherein the first lead electrode comprises, in a plan view: a first region, a second region surrounding a periphery of the first region, wherein, in a height direction, an upper surface of the base member in an entirety of the second region is higher than an upper surface of the base member in the first region, and a third region surrounding at least a portion of a periphery of the second region, wherein, in the height direction, an upper surface of the base member in the third region is lower than the upper surface of the base member in the entirety of the second region; a second lead electrode; and a resin molded body.

公开(公告)号：US20190207065A1

公开(公告)日：2019-07-04

申请号：US16299138

申请日：2019-03-12

Applicant: NICHIA CORPORATION

Inventor： Koji ABE ,  Yasushi OKAMOTO

IPC: H01L33/50 ,  H01L33/56 ,  H01L33/00 ,  H01L33/60 ,  F21K9/60 ,  H01L33/54 ,  F21K9/90

CPC classification number: H01L33/504 ,  F21K9/60 ,  F21K9/90 ,  F21Y2115/10 ,  H01L33/005 ,  H01L33/44 ,  H01L33/508 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L2933/005 ,  H01L2933/0091

Abstract: A light emitting device includes a package having a recess, a light emitting element disposed in the recess, a translucent sealing material provided in the recess to encapsulate the light emitting element, and a film provided on the translucent sealing material. The film has a contact surface to contact the translucent sealing material and an outer surface opposite to the contact surface. The film includes a translucent base material and two or more layers of particles stacked in the translucent base material between the contact surface and the outer surface. At least one of the particles is exposed in a vicinity of the outer surface of the film.

公开(公告)号：US20170162770A1

公开(公告)日：2017-06-08

申请号：US15437997

申请日：2017-02-21

Applicant: NICHIA CORPORATION

Inventor： Koji ABE ,  Yuki SHIOTA

IPC: H01L33/62 ,  H01L33/48 ,  H01L33/52 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L33/62 ,  H01L21/4846 ,  H01L21/565 ,  H01L33/486 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A package for mounting a light emitting element includes a recess; a pair of lead electrodes exposed at a bottom surface of the recess; a plating layer covering a surface of each of the pair of lead electrodes; and a resin molded body retaining the pair of lead electrodes, and forming an area between the pair of lead electrodes at the bottom surface of the recess and a lateral surface of the recess. At least one of the lead electrodes has a front surface protrusion that is linearly formed along the resin molded body at the bottom surface of the recess and along a periphery of the bottom surface of the recess, and a back surface protrusion that is formed at a position at a back surface opposite to a position of the front surface protrusion, and at least a tip of each of the front surface protrusion and the back surface protrusion is exposed outside the plating layer.

公开(公告)号：US20170092816A1

公开(公告)日：2017-03-30

申请号：US15278724

申请日：2016-09-28

Applicant: NICHIA CORPORATION

Inventor： Tadaaki IKEDA ,  Masaki HAYASHI ,  Koji ABE ,  Kimihiro MIYAMOTO

IPC: H01L33/46 ,  H01L33/62 ,  H01L33/48

CPC classification number: H01L33/465 ,  H01L33/44 ,  H01L33/483 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A method of manufacturing a package, the method comprising the steps of: preparing a resin compact having a recess, and including a pair of leads arranged at a bottom surface of the recess, a first resin body forming a lateral wall of the recess, and a second resin body arranged between the pair of leads; forming a reflective film entirely on at least the bottom surface of the recess and an inner surface of the lateral wall of the recess; and removing the reflective film formed on the pair of leads in the recess in the resin compact on which the reflective film has been formed.

公开(公告)号：US20180182933A1

公开(公告)日：2018-06-28

申请号：US15853962

申请日：2017-12-26

Applicant: NICHIA CORPORATION

Inventor： Koji ABE ,  Yasushi OKAMOTO

IPC: H01L33/50 ,  H01L33/44 ,  F21K9/90 ,  F21K9/60 ,  H01L33/56 ,  H01L33/60 ,  H01L33/00

CPC classification number: H01L33/504 ,  F21K9/60 ,  F21K9/90 ,  F21Y2115/10 ,  H01L33/005 ,  H01L33/44 ,  H01L33/508 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60

Abstract: A method for manufacturing a light emitting device includes providing a package having a recess in which a light emitting element is disposed. A translucent sealing material is provided in the recess to encapsulate the light emitting element. A film is provided on the translucent sealing material. The film includes a translucent base material and particles disposed in the translucent base material. The film has a contact surface to contact the translucent sealing material and an outer surface opposite to the contact surface. Abrasive is blasted onto the outer surface of the film to roughen the outer surface so as to expose at least one of the particles.

公开(公告)号：US20160190399A1

公开(公告)日：2016-06-30

申请号：US14978670

申请日：2015-12-22

Applicant: Nichia Corporation

Inventor： Koji ABE ,  Yuki SHIOTA

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/56 ,  H01L33/00

CPC classification number: H01L33/486 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/3142 ,  H01L33/005 ,  H01L33/502 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2933/0016 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A package for mounting a light emitting element includes: a first lead electrode having, in a plan view, a first region, a second region surrounding a periphery of the first region having a width of 110 μm or more and a thickness greater than that of the first region, and a third region partially surrounding a periphery of the second region and having a thickness smaller than that of the second region; a second lead electrode spaced apart from the first lead electrode; and a resin molded body fixing a portion of each of the first and second lead electrodes. A portion of each of the first and second lead electrodes and a portion of the resin molded body exposed therebetween form a bottom surface of a recess.

Abstract translation: 用于安装发光元件的封装包括：第一引线电极，在平面图中具有第一区域，围绕第一区域的周边的第二区域，宽度为110μm以上，厚度大于 所述第一区域和第三区域部分地围绕所述第二区域的周边并且具有比所述第二区域的厚度小的厚度; 与所述第一引线电极间隔开的第二引线电极; 以及固定所述第一和第二引线电极中的每一个的一部分的树脂成型体。 第一和第二引线电极中的每一个的一部分和暴露在其间的树脂成型体的一部分形成凹部的底表面。

公开(公告)号：US20160118558A1

公开(公告)日：2016-04-28

申请号：US14921706

申请日：2015-10-23

Applicant: Nichia Corporation

Inventor： Koji ABE

IPC: H01L33/60 ,  H01L33/62 ,  H01L33/50 ,  H01L33/56

CPC classification number: H01L33/60 ,  H01L33/62 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A light emitting device includes a package including a resin member having an inner side surface defining a recess, and a lead frame supported by the resin member and arranged at a bottom surface of the recess; and a light emitting element electrically connected to the lead frame. An outer side surface of the resin member at a portion corresponding to the recess is at least partially covered with a reflective film.

Abstract translation: 发光装置包括：包括具有限定凹部的内侧表面的树脂构件和由所述树脂构件支撑并布置在所述凹部的底表面处的引线框架的封装; 以及电连接到引线框架的发光元件。 树脂构件的与凹部对应的部分的外侧表面至少部分被反射膜覆盖。

公开(公告)号：US20250072198A1

公开(公告)日：2025-02-27

申请号：US18947811

申请日：2024-11-14

Applicant: NICHIA CORPORATION

Inventor： Koji ABE

IPC: H01L27/15 ,  H01L33/10 ,  H01L33/50 ,  H01L33/56 ,  H01L33/62

Abstract: A light emitting device includes: a first substrate; a light emitting element disposed on a first region of an upper surface of the first substrate; a light-transmissive member including disposed as a layer including a first portion that is located on an upper surface of the light emitting element and a second portion that is continuous with the first portion and is located on a second region of the upper surface of the first substrate; and a protrusion extending around the light emitting element. Part of the second portion of the light-transmissive member is located between the protrusion and the second region of the upper surface of the first substrate.

公开(公告)号：US20220384519A1

公开(公告)日：2022-12-01

申请号：US17828490

申请日：2022-05-31

Applicant: NICHIA CORPORATION

Inventor： Koji ABE

IPC: H01L27/15 ,  H01L33/10 ,  H01L33/50 ,  H01L33/62 ,  H01L33/56

Abstract: Alight emitting device includes: a light emitting element; a first substrate having an upper surface comprising an element placement region on which the light emitting element is disposed; a light-transmissive member with a sheet-like shape that covers the light emitting element, wherein an outer edge of a lower surface of the light-transmissive member contacts an outer side of the upper surface of the element placement region of the first substrate; and a first protrusion portion disposed along an outer edge of an upper surface of the light-transmissive member and extending across an upper surface of the first substrate and the upper surface of the light-transmissive member, wherein the first protrusion portion comprises a top portion located higher than an upper surface of the light emitting element.

公开(公告)号：US20180019384A1

公开(公告)日：2018-01-18

申请号：US15649149

申请日：2017-07-13

Applicant: NICHIA CORPORATION

Inventor： Koji ABE

IPC: H01L33/60 ,  H01L21/66 ,  H01L33/54 ,  G02B5/28 ,  H01L33/50 ,  H01L33/62 ,  G02B5/20

Abstract: A light emitting device includes a light emitting element, a light-transmissive member covering the light emitting element, a fluorescent material contained in the light-transmissive member, and a multilayer film disposed on the light-transmissive member and including alternatively layered two types of films of different refractive indices, in which the two types of films are aggregated nano-particles of TiO2 and aggregated nano-particles of SiO2.