公开(公告)号：US20170345982A1

公开(公告)日：2017-11-30

申请号：US15609028

申请日：2017-05-31

Applicant: NICHIA CORPORATION

Inventor： Koji ABE ,  Yasushi OKAMOTO

IPC: H01L33/58 ,  H01L25/075 ,  H01L33/56 ,  H01L33/62 ,  H01L33/48 ,  H01L33/50

CPC classification number: H01L33/58 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/502 ,  H01L33/54 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A light-emitting device includes a package, a light-emitting element disposed on the package, and a light-transmissive member over the light-emitting element. An upper surface of the light-transmissive member and an upper surface of the package each have a plurality of projections. The light-transmissive member contains particles of light-transmissive first fillers having refractive indices smaller than the refractive index of a matrix of the light-transmissive member. Part of the particles of the first fillers is exposed to the air from the matrix of the light-transmissive member on the upper surface of the light-transmissive member.

公开(公告)号：US20190207065A1

公开(公告)日：2019-07-04

申请号：US16299138

申请日：2019-03-12

Applicant: NICHIA CORPORATION

Inventor： Koji ABE ,  Yasushi OKAMOTO

IPC: H01L33/50 ,  H01L33/56 ,  H01L33/00 ,  H01L33/60 ,  F21K9/60 ,  H01L33/54 ,  F21K9/90

CPC classification number: H01L33/504 ,  F21K9/60 ,  F21K9/90 ,  F21Y2115/10 ,  H01L33/005 ,  H01L33/44 ,  H01L33/508 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L2933/005 ,  H01L2933/0091

Abstract: A light emitting device includes a package having a recess, a light emitting element disposed in the recess, a translucent sealing material provided in the recess to encapsulate the light emitting element, and a film provided on the translucent sealing material. The film has a contact surface to contact the translucent sealing material and an outer surface opposite to the contact surface. The film includes a translucent base material and two or more layers of particles stacked in the translucent base material between the contact surface and the outer surface. At least one of the particles is exposed in a vicinity of the outer surface of the film.

公开(公告)号：US20230013159A1

公开(公告)日：2023-01-19

申请号：US17864066

申请日：2022-07-13

Applicant: NICHIA CORPORATION

Inventor： Satoshi YOSHINAGA ,  Takuya NAKABAYASHI ,  Yuki SHIBUTANI ,  Yoichi BANDO ,  Yasushi OKAMOTO

IPC: F21V8/00

Abstract: A planar light source includes: a light guide member, a light source including a light-emitting element and a first light adjustment member and being disposed in a first hole of the light guide member, a first light-transmissive member disposed in the first hole between a lateral surface of the light source and the light guide member and on the light source, and a second light adjustment member disposed on the first light-transmissive member. A transmittance of the first light-transmissive member is higher than a transmittance of the first light adjustment member and a transmittance of the second light adjustment member with respect to light emitted from the light source. The first light-transmissive member includes a first light-transmissive portion 1ocated between the first light adjustment member and the second light adjustment member, and a second light-transmissive portion 1ocated between the lateral surface of the light source and the light guide member.

公开(公告)号：US20180182933A1

公开(公告)日：2018-06-28

申请号：US15853962

申请日：2017-12-26

Applicant: NICHIA CORPORATION

Inventor： Koji ABE ,  Yasushi OKAMOTO

IPC: H01L33/50 ,  H01L33/44 ,  F21K9/90 ,  F21K9/60 ,  H01L33/56 ,  H01L33/60 ,  H01L33/00

CPC classification number: H01L33/504 ,  F21K9/60 ,  F21K9/90 ,  F21Y2115/10 ,  H01L33/005 ,  H01L33/44 ,  H01L33/508 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60

Abstract: A method for manufacturing a light emitting device includes providing a package having a recess in which a light emitting element is disposed. A translucent sealing material is provided in the recess to encapsulate the light emitting element. A film is provided on the translucent sealing material. The film includes a translucent base material and particles disposed in the translucent base material. The film has a contact surface to contact the translucent sealing material and an outer surface opposite to the contact surface. Abrasive is blasted onto the outer surface of the film to roughen the outer surface so as to expose at least one of the particles.