公开(公告)号：US20160079489A1

公开(公告)日：2016-03-17

申请号：US14785620

申请日：2014-04-14

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Markus RICHTER ,  Alexander BAUMGARTNER ,  Hans-Christoph GALLMEIER ,  Tony ALBRECHT

IPC: H01L33/50 ,  H01L33/60 ,  H01L33/54 ,  H01L33/56

CPC classification number: H01L33/507 ,  H01L33/0095 ,  H01L33/508 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058

Abstract: A method is provided for producing a plurality of radiation-emitting semiconductor chips, having the following steps:providing a plurality of semiconductor bodies (1) which are suitable for emitting electromagnetic radiation from a radiation exit face (3),applying the semiconductor bodies (1) to a carrier (2),applying a first mask layer (4) to regions of the carrier (2) between the semiconductor bodies (1),applying a conversion layer (5) to the entire surface of the semiconductor bodies (1) and the first mask layer (4) using a spray coating method, andremoving the first mask layer (4), such that in each case a conversion layer (5) arises on the radiation exit faces (3) of the semiconductor bodies (1).

Abstract translation: 提供了一种用于制造多个辐射发射半导体芯片的方法，具有以下步骤：提供适于从辐射出射面（3）发射电磁辐射的多个半导体本体（1），施加半导体本体（ 1）到载体（2）上，在半导体体（1）之间的载体（2）的区域上施加第一掩模层（4），在半导体本体（1）的整个表面上施加转换层 ）和第一掩模层（4），并且去除第一掩模层（4），使得在每种情况下，在半导体主体的辐射出射面（3）上出现转换层（5） 1）。

公开(公告)号：US20150008471A1

公开(公告)日：2015-01-08

申请号：US14493257

申请日：2014-09-22

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Hans-Christoph GALLMEIER ,  Michael Kruppa ,  Raimund Schwarz ,  Guenter Spath

IPC: H01L33/50 ,  H01L33/62

CPC classification number: H01L33/507 ,  H01L33/38 ,  H01L33/50 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method for manufacturing an optoelectronic semiconductor component, comprising: providing a semiconductor chip in a composite wafer, comprising an active side for emitting a primary radiation and a contact terminal which is arranged on the active side; depositing a coupling element on the active side; attaching a luminescence conversion element, for converting part of the primary radiation into a secondary radiation, to the coupling element.

Abstract translation: 一种制造光电子半导体部件的方法，包括：在复合晶片中提供半导体芯片，其包括用于发射初级辐射的有源侧和布置在所述有源侧的接触端子; 在活动侧上沉积耦合元件; 附接用于将一次辐射的一部分转换成二次辐射的发光转换元件连接到耦合元件。