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公开(公告)号：US20170015084A1
公开(公告)日：2017-01-19
申请号：US15206264
申请日：2016-07-09
Inventor： KAZUHIRO NISHIKAWA , NAOMI NISHIKI , HIDETOSHI KITAURA , ATSUSHI TANAKA , KIMIAKI NAKAYA
CPC classification number: B32B9/04 , B32B7/10 , B32B9/007 , B32B9/041 , B32B9/045 , B32B15/04 , B32B27/28 , B32B37/06 , B32B37/10 , B32B2255/205 , B32B2307/30 , B32B2307/302 , B32B2307/538 , B32B2307/54 , B32B2307/704 , B32B2307/732 , B32B2309/02 , B32B2309/12 , B32B2309/60 , B32B2313/00 , B32B2313/04 , B32B2457/00 , B32B2551/00
Abstract: A graphite-silicon composite, including: graphite; silicon; and an intermediate layer that is located between the graphite and the silicon, wherein the intermediate layer includes oxygen, carbon and silicon. Furthermore, provided is a method for producing a graphite-silicon composite, including: layering graphite and silicon; and heating the layered graphite and silicon while applying pressure to them, wherein, during heating the layered graphite and silicon while applying pressure to them, an oxygen concentration in the atmosphere is adjusted to 0.2 vol %, the applied pressure is adjusted to 24.5 MPa or higher, and the heating temperature is adjusted to 1260° C. or higher.
Abstract translation: 石墨 - 硅复合材料，包括：石墨; 硅; 以及位于石墨和硅之间的中间层，其中中间层包括氧，碳和硅。 此外，提供了一种生产石墨 - 硅复合材料的方法，包括：分层石墨和硅; 在对它们施加压力的同时对层状石墨和硅进行加热，其中，在对层叠的石墨和硅进行加压的同时向其施加压力时，将大气中的氧浓度调整为0.2体积％，将施加的压力调整为24.5MPa， 加热温度调节至1260℃以上。
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公开(公告)号：US20170334026A1
公开(公告)日：2017-11-23
申请号：US15582507
申请日：2017-04-28
Inventor： SHINNOSUKE AKIYAMA , KIYOHIRO HINE , HIDETOSHI KITAURA , AKIO FURUSAWA
CPC classification number: B23K35/262 , C22C13/00 , H05K1/182 , H05K2201/10022
Abstract: There is provided a solder alloy in which 0.5 mass % or more and 1.25 mass % or less of Sb, In satisfying the following formula (I) or (II) when [Sb] is set as a Sb content percentage (mass %) and [In] is set as an In content percentage (mass %): in a case of 0.5≦[Sb]≦1.0, 5.5≦[In]≦5.50+1.06[Sb] . . . (I), in a case of 1.0
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公开(公告)号：US20170275515A1
公开(公告)日：2017-09-28
申请号：US15458947
申请日：2017-03-14
Inventor： ATSUSHI TANAKA , NAOMI NISHIKI , HIDETOSHI KITAURA , KIMIAKI NAKAYA
IPC: C09K5/14
CPC classification number: C09K5/14 , B32B5/142 , B32B5/147 , B32B2264/108 , B32B2305/02 , B32B2307/302 , C01B32/20 , C01B32/205 , C01P2006/32 , C01P2006/90
Abstract: A graphite material has a flexible part and can be utilized as a heat-conveying material in a narrow space. The graphite material, includes: at least one heat-conveying part; and a flexible part. A method for producing a graphite material, includes: (i) subjecting at least one film serving as a material to a heat treatment to obtain at least one carbonaceous film; (ii) providing a monolayer or multilayer structure including the at least one carbonaceous film; and (iii) applying heat and pressure to at least one part of the monolayer or multilayer structure in an inert atmosphere.
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公开(公告)号：US20180326542A1
公开(公告)日：2018-11-15
申请号：US15949360
申请日：2018-04-10
Inventor： KAZUKI SAKAI , AKIO FURUSAWA , HIDETOSHI KITAURA , KIYOHIRO HINE
CPC classification number: B23K35/262 , C22C13/00 , C22C13/02 , H01L24/26 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/29083 , H01L2224/29111 , H01L2224/29117 , H01L2224/2912 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29155 , H01L2224/32225 , H01L2924/01052 , H01L2924/014 , H01L2924/3512 , H05K3/34
Abstract: A solder alloy of the disclosure includes Sb of which a content is in a range of 3 wt % to 30 wt %, Te of which a content is in a range of 0.01 wt % to 1.5 wt %, Au of which a content is in a range of 0.005 wt % to 1 wt %, at least one of Ag and Cu, wherein a content rate of at least one of Ag and Cu in the solder alloy is in a range of 0.1 wt % to 20 wt %; and a content rate of a sum of Ag and Cu in the solder alloy is in a range of 0.1 wt % to 20 wt %; and a balance of Sn.
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公开(公告)号：US20180218920A1
公开(公告)日：2018-08-02
申请号：US15866018
申请日：2018-01-09
Inventor： RYOU KUWABARA , NAOMI NISHIKI , HIDETOSHI KITAURA , ATSUSHI TANAKA , TAKESHI NISHIKAWA
CPC classification number: H01L21/4882 , B23K1/0008 , B32B3/14 , B32B7/12 , B32B9/007 , B32B2307/302 , B32B2457/14 , F28F21/02 , H01L23/373 , H01L23/3735
Abstract: A graphite heat sink that is light in weight, excellent in thermal conductivity and high in mechanical strength. A graphite heat sink includes two or more graphite joined plates and solder joining layers which are alternately stacked, in which each graphite joined plate includes plural pieces of graphite plates and a solder joining portion, surfaces of the plural pieces of graphite plates parallel to a thickness direction and the solder joining portion are joined to one another, and the solder joining layer and the solder joining portion are formed of the same solder material.
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Patent Agency Ranking
公开(公告)号：US20170282305A1
公开(公告)日：2017-10-05
申请号：US15511231
申请日：2016-04-26
Inventor： KIYOHIRO HINE , AKIO FURUSAWA , HIDETOSHI KITAURA
Abstract: A solder alloy contains 0.5 mass % or more and 1.25 mass % or less of Sb, In which satisfies 5.5≦[In]≦5.50+1.06[Sb] in a case of 0.5≦[Sb]≦1.0; and 5.5≦[In]≦6.35+0.212[Sb] in a case of 1.0
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公开(公告)号：US20190099840A1
公开(公告)日：2019-04-04
申请号：US16137108
申请日：2018-09-20
Inventor： HIDETOSHI KITAURA , AKIO FURUSAWA , KIYOHIRO HINE
Abstract: A solder alloy, includes: about 3 wt % to about 15 wt % of Sb; about 0.01 wt % to about 1.5 wt % of Te; and about 0.005 wt % to about 1 wt % of at least one element selected from the group consisting of Zn, Co, and Cr; and a balance of Sn.
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公开(公告)号：US20170320740A1
公开(公告)日：2017-11-09
申请号：US15485763
申请日：2017-04-12
Inventor： HIDETOSHI KITAURA , NAOMI NISHIKI , ATSUSHI TANAKA , KIMIAKI NAKAYA
CPC classification number: C01B32/22 , C01B32/20 , C01P2002/70 , C01P2006/32 , C09K5/14
Abstract: Provided is a graphite plate, consisting essentially of: graphite; and pores, wherein said graphite plate has a porosity from 1% to 30%. Further provided is a method for producing a graphite plate, including: applying welding pressure to at least one glass-like carbon material in a state in which said at least one glass-like carbon material is maintained in an inert atmosphere under heating conditions, to produce a graphite plate having a porosity from 1% to 30%.
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公开(公告)号：US20160163668A1
公开(公告)日：2016-06-09
申请号：US14880942
申请日：2015-10-12
Inventor： KIYOHIRO HINE , AKIO FURUSAWA , MASATO MORI , TAICHI NAKAMURA , HIDETOSHI KITAURA
CPC classification number: H01L24/17 , B23K35/0244 , B23K35/262 , C22C13/00 , H01B1/02 , H01L24/14 , H01L2924/01029 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01083 , H01L2924/0135 , H01L2924/014
Abstract: A mounting structure includes a BGA including a BGA electrode, a circuit board including a circuit board electrode, and a solder joining portion which is arranged on the circuit board electrode and is connected to the BGA electrode. The solder joining portion is formed of Cu having a content ratio in a range from 0.6 mass % to 1.2 mass %, inclusive, Ag having a content ratio in a range from 3.0 mass % to 4.0 mass %, inclusive, Bi having a content ratio in a range from 0 mass % to 1.0 mass %, inclusive, In, and Sn. A range of the content ratio of In is different according to the content ratio of Cu.
Abstract translation: 安装结构包括BGA，其包括BGA电极，包括电路板电极的电路板和布置在电路板电极上并连接到BGA电极的焊料接合部分。 焊料接合部由含有率在0.6质量％〜1.2质量％的范围的Cu构成，包括在3.0质量％〜4.0质量％范围内的含有Ag的Ag，含有比例为 在0质量％至1.0质量％的范围内，包括In和Sn。 根据Cu的含量比，In的含量比范围不同。
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公开(公告)号：US20240072476A1
公开(公告)日：2024-02-29
申请号：US18503268
申请日：2023-11-07
Inventor： HIDETOSHI KITAURA , HIROSHI OGURA , MOTOHIKO FUJIMURA , KAZUHIRO NISHIKAWA , YOSHIHIRO KAWAKITA
IPC: H01R13/187 , H01R12/71 , H01R13/11
CPC classification number: H01R13/187 , H01R12/716 , H01R13/113
Abstract: An electric power converter includes a first board, a second board, and a first board-to-board connector that electrically and mechanically connects the first board and the second board. The first board-to-board connector includes a male fitting member and a female fitting member. Each of a first clamp portion and a second clamp portion of the female fitting member includes a first contact forming portion and a second contact forming portion that are curved in a protruding shape, and a first spring portion and a second spring portion that are connected to the first contact forming portion and the second contact portion, respectively, and that are curved in corrugated shapes. An insert clamped between the first contact forming portion and the second contact forming portion forms an electrical contact, and the first spring portion and the second spring portion are independently deformable.
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