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公开(公告)号：US20180332258A1
公开(公告)日：2018-11-15
申请号：US15956420
申请日：2018-04-18
发明人： SHINNOSUKE AKIYAMA , MASATO MORI , KEI TOYOTA
CPC分类号： H04N9/3111 , G02B26/008 , G03B21/204
摘要： A phosphor wheel capable of suppressing reduction in fluorescence output, which responds to irradiation of laser light with high output density. The phosphor wheel having a plate shape includes a substrate having light transmission properties and a phosphor layer stacked on the substrate and emitting fluorescence by irradiation of excitation light, in which the substrate and the phosphor layer are interlaced with each other at a contact portion between the substrate and the phosphor layer.
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公开(公告)号：US20160039052A1
公开(公告)日：2016-02-11
申请号：US14920772
申请日：2015-10-22
发明人： AKIO FURUSAWA , KIYOHIRO HINE , MASATO MORI , TAICHI NAKAMURA
CPC分类号： B23K35/262 , B23K35/0222 , B23K35/26 , B23K35/40 , C22C13/00 , H05K1/11 , H05K1/111 , H05K1/18 , H05K3/244 , H05K3/3463 , H05K2201/0338 , H05K2201/10909
摘要： Solder material used in soldering of an Au electrode including Ni plating containing P includes Ag satisfying 0.3≦[Ag]≦4.0, Bi satisfying 0≦[Bi]≦1.0, and Cu satisfying 0
摘要翻译： 包含含有含有Ni的Au电极的Au电极的焊接中使用的焊料包括满足0.3＆nlE的Ag; [Ag]和nlE; 4.0，满足0＆nlE的Bi; [Bi]＆nlE; 1.0，满足0 <[Cu] 其中焊料中Ag，Bi，Cu和In的含量（质量％）分别由[Ag]，[Bi]，[Cu]和[In]表示。 当[Cu]在0 <[Cu] <0.5的范围内时，焊料材料包括In的范围为6.0＆nlE; [In]＆nlE; 6.8; In为5.2+（6-（1.55×[Cu 当Cu [Cu]在[Cu]的范围内时，[Cu]和nlE; 1.0，In的范围为5.2＆nlE; [In]＆nlE; 6.8当[Cu] 落在1.0 <[Cu]和nlE的范围内。 余量仅包括不少于87质量％的Sn。
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公开(公告)号：US20200013557A1
公开(公告)日：2020-01-09
申请号：US16574511
申请日：2019-09-18
发明人： TAKAYUKI MATSUMOTO , HONAMI NISHINO , SHIN FUJITA , TOMOYUKI TASHIRO , MASATO MORI , HIROHISA HINO
摘要： An electrolytic capacitor includes a capacitor element, a case housing the capacitor element, and a first heat radiation layer having an insulating property. The first heat radiation layer covers at least part of the capacitor element. A thermal conductivity λC of the case in a thickness direction is greater than or equal to 1 W/m·K. A thermal emissivity ε1 of the first heat radiation layer is greater than or equal to 0.7.
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公开(公告)号：US20190120568A1
公开(公告)日：2019-04-25
申请号：US16149359
申请日：2018-10-02
发明人： RYOU KUWABARA , NAOMI NISHIKI , MASATO MORI , TAKESHI NISHIKAWA
摘要： A graphite heat sink with light weight and high mechanical strength includes graphite fins and a metal press-fitted and fixed to a part of a surface of the graphite fin.
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公开(公告)号：US20160163668A1
公开(公告)日：2016-06-09
申请号：US14880942
申请日：2015-10-12
CPC分类号： H01L24/17 , B23K35/0244 , B23K35/262 , C22C13/00 , H01B1/02 , H01L24/14 , H01L2924/01029 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01083 , H01L2924/0135 , H01L2924/014
摘要： A mounting structure includes a BGA including a BGA electrode, a circuit board including a circuit board electrode, and a solder joining portion which is arranged on the circuit board electrode and is connected to the BGA electrode. The solder joining portion is formed of Cu having a content ratio in a range from 0.6 mass % to 1.2 mass %, inclusive, Ag having a content ratio in a range from 3.0 mass % to 4.0 mass %, inclusive, Bi having a content ratio in a range from 0 mass % to 1.0 mass %, inclusive, In, and Sn. A range of the content ratio of In is different according to the content ratio of Cu.
摘要翻译： 安装结构包括BGA，其包括BGA电极，包括电路板电极的电路板和布置在电路板电极上并连接到BGA电极的焊料接合部分。 焊料接合部由含有率在0.6质量％〜1.2质量％的范围的Cu构成，包括在3.0质量％〜4.0质量％范围内的含有Ag的Ag，含有比例为 在0质量％至1.0质量％的范围内，包括In和Sn。 根据Cu的含量比，In的含量比范围不同。
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公开(公告)号：US20200185571A1
公开(公告)日：2020-06-11
申请号：US16691527
申请日：2019-11-21
发明人： KEI TOYOTA , SHINNOSUKE AKIYAMA , RIHO MORIYAMA , MASATO MORI
摘要： A phosphor according to the present disclosure has excellent light emission properties in a blue-green region and high color rendering properties. The phosphor is represented by a chemical formula of Lu(3-x-y-z)MgxZnyAl5O12:Cez, in which when z is in a range of 0.01≤z≤0.03, then 0≤x≤1.4 and 0≤y≤1.4, excluding x=0 and y=0; when z is in a range of is 0.03
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公开(公告)号：US20180198014A1
公开(公告)日：2018-07-12
申请号：US15846167
申请日：2017-12-18
发明人： KEI TOYOTA , MASATO MORI , SHINNOSUKE AKIYAMA
IPC分类号： H01L31/055 , H01L31/049 , H01L31/048 , H01L31/05
CPC分类号： H01L31/055 , H01L31/0481 , H01L31/049 , H01L31/0504 , Y02E10/52
摘要： A solar cell module having an extended lifetime and improved efficiency achieved by improved solar cell efficiency, and reduced UV damage to the photoelectric conversion device. The solar cell module has a structure in which a back sheet, a first encapsulant layer, a photoelectric conversion device electrically connected to an electrode, a second encapsulant layer, and a protective glass are stacked in that order. The second encapsulant layer is a sheet configured from a resin containing a UV absorber, and the sheet contains phosphors that are concentrated on the side of the protective glass, as opposed to the side of the first encapsulant layer.
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公开(公告)号：US20180175257A1
公开(公告)日：2018-06-21
申请号：US15825058
申请日：2017-11-28
发明人： SHINNOSUKE AKIYAMA , KEI TOYOTA , MASATO MORI
CPC分类号： H01L33/54 , C01F7/02 , C01F17/0025 , H01L33/26 , H01L33/50 , H01L33/56 , H01L33/58 , H01L2933/0058 , Y02B20/181
摘要： A light emitting element includes a light emitting member that is formed of at least two kinds of an oxide material and has a plate shape; and a light transmitting member that collimates a light emitted from the light emitting member and has a plano-convex shape, in which a contact portion between the light transmitting member and the light emitting member is continuous.
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公开(公告)号：US20170120396A1
公开(公告)日：2017-05-04
申请号：US15265336
申请日：2016-09-14
发明人： NAOMICHI OHASHI , YUKI YOSHIOKA , YASUHIRO SUZUKI , HIROHISA HINO , MASATO MORI , KAZUHIRO NISHIKAWA
IPC分类号： B23K35/362 , B23K35/02 , B23K35/26 , H01L21/56 , H05K1/18 , H05K3/34 , H01L23/00 , H01L23/31 , B23K1/00 , B23K35/36
CPC分类号： B23K35/362 , B23K1/0016 , B23K35/025 , B23K35/264 , B23K35/3612 , B23K35/3613 , B23K35/3615 , B23K35/3618 , H01L21/563 , H01L23/3142 , H01L24/17 , H01L24/81 , H01L2224/16227 , H01L2224/81411 , H01L2224/81413 , H01L2224/81815 , H01L2924/0665 , H01L2924/20102 , H05K1/181 , H05K3/3436 , H05K3/3457 , H05K3/3489 , H05K3/3494 , H05K2201/10734 , H05K2203/048 , Y02P70/613
摘要： A solder paste having improved self alignment for soldering is provided. The solder paste includes a solder powder; a composite epoxy resin containing a first epoxy resin that is solid at 25° C., and a second epoxy resin that is liquid at 25° C.; and a curing agent, wherein the first epoxy resin has a softening point that is at least 10° C. lower than the melting point of the solder powder, and is contained in a range of 10 weight parts to 75 weight parts with respect to the total 100 weight parts of the composite epoxy resin.
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公开(公告)号：US20220039286A1
公开(公告)日：2022-02-03
申请号：US17367279
申请日：2021-07-02
发明人： RYOU KUWABARA , MOTONORI SHIMAMURA , NAOMI NISHIKI , MASATO MORI
摘要： A heat sink includes a graphite plate, two base materials each of which is disposed adjacent to the graphite plate, and a fixing member, in which the graphite plate has a strip shape and includes a fin portion and a base portion provided at one end of the fin portion, the base material includes a hole into which the fixing member can be inserted, the fixing member is inserted into the holes of the two base materials so that the two base materials are disposed to be adjacent to both sides of the base portion in a thickness direction, the base portion is in close contact with the base material adjacent to each other on both sides of the base portion in the thickness direction, the adjacent base materials are crimped and fixed by the fixing member in a state of being in close contact with each other, and in a case where a surface roughness of the fin portion is defined as Ra1, a surface roughness of the base material is defined as Ra2, and a surface roughness of the base portion is defined as Ra3, a relationship of Ra1>Ra2≥Ra3 is satisfied.
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