公开(公告)号：US20060289733A1

公开(公告)日：2006-12-28

申请号：US11226223

申请日：2005-09-15

申请人： Peter Zung ,  Tzu-Han Lin ,  Fang-Chang Liu

发明人： Peter Zung ,  Tzu-Han Lin ,  Fang-Chang Liu

IPC分类号： H01J5/02

CPC分类号： H01L27/14618 ,  H01L24/20 ,  H01L24/24 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/32145 ,  H01L2224/73267

摘要： An image sensor module includes an image-sensing unit having a first surface, a second surface and a plurality of first conductive contacts arranged at the second surface, a signal processing unit mounted on the first surface of the image-sensing unit and provided with a plurality of second conductive contacts respectively electrically connected to the first conductive contacts of the image-sensing unit, a plurality of solder balls respectively electrically connected to the second conductive contacts of the signal processing unit for mounting in an external circuit board, and a lens set mounted on the second surface of the image-sensing unit and covering the first conductive contacts of the image-sensing unit.

摘要翻译： 图像传感器模块包括具有第一表面，第二表面和布置在第二表面处的多个第一导电触点的图像感测单元，信号处理单元安装在图像感测单元的第一表面上并且具有 分别电连接到图像感测单元的第一导电触点的多个第二导电触点，分别电连接到信号处理单元的第二导电触点的多个焊球，用于安装在外部电路板中，以及透镜组 安装在图像感测单元的第二表面上并且覆盖图像感测单元的第一导电触点。

公开(公告)号：US07833810B2

公开(公告)日：2010-11-16

申请号：US12493758

申请日：2009-06-29

申请人： Tzu-Han Lin ,  Tzy-Ying Lin ,  Fang-Chang Liu ,  Kai-Chih Wang

发明人： Tzu-Han Lin ,  Tzy-Ying Lin ,  Fang-Chang Liu ,  Kai-Chih Wang

IPC分类号： H01L21/00 ,  H01L23/544

CPC分类号： H01L27/14618 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2924/01078 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/00

摘要： Isolation structure for CMOS image sensor device chip scale packages and fabrication methods thereof. A CMOS image sensor chip scale package includes a transparent substrate configured as a support structure for the package. The transparent substrate includes a first cutting edge and a second cutting edge. A CMOS image sensor die with a die circuitry is mounted on the transparent substrate. An encapsulant is disposed on the substrate encapsulating the CMOS image sensor die. A connection extends from the die circuitry to a plurality of terminal contacts for the package on the encapsulant, wherein the connection is exposed by the first cutting edge. An isolation structure is disposed on the first cutting edge passivating the exposed connection and co-planed with the second cutting edge.

摘要翻译： CMOS图像传感器芯片级封装的隔离结构及其制造方法。 CMOS图像传感器芯片级封装包括被配置为用于封装的支撑结构的透明衬底。 透明基板包括第一切削刃和第二切削刃。 具有裸片电路的CMOS图像传感器芯片安装在透明基板上。 密封剂设置在封装有CMOS图像传感器芯片的基板上。 连接从管芯电路延伸到密封剂上的封装的多个端子触头，其中连接由第一切削刃暴露。 隔离结构设置在第一切削刃上，钝化暴露的连接并与第二切削刃共同设计。

公开(公告)号：US07569409B2

公开(公告)日：2009-08-04

申请号：US11649242

申请日：2007-01-04

申请人： Tzu-Han Lin ,  Tzy-Ying Lin ,  Fang-Chang Liu ,  Kai-Chih Wang

发明人： Tzu-Han Lin ,  Tzy-Ying Lin ,  Fang-Chang Liu ,  Kai-Chih Wang

IPC分类号： H01L21/00 ,  H01L23/544

CPC分类号： H01L27/14618 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2924/01078 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/00

摘要： Isolation structure for CMOS image sensor device chip scale packages and fabrication methods thereof. A CMOS image sensor chip scale package includes a transparent substrate configured as a support structure for the package. The transparent substrate includes a first cutting edge and a second cutting edge. A CMOS image sensor die with a die circuitry is mounted on the transparent substrate. An encapsulant is disposed on the substrate encapsulating the CMOS image sensor die. A connection extends from the die circuitry to a plurality of terminal contacts for the package on the encapsulant, wherein the connection is exposed by the first cutting edge. An isolation structure is disposed on the first cutting edge passivating the exposed connection and co-planed with the second cutting edge.

摘要翻译： CMOS图像传感器芯片级封装的隔离结构及其制造方法。 CMOS图像传感器芯片级封装包括被配置为用于封装的支撑结构的透明衬底。 透明基板包括第一切削刃和第二切削刃。 具有裸片电路的CMOS图像传感器芯片安装在透明基板上。 密封剂设置在封装有CMOS图像传感器芯片的基板上。 连接从管芯电路延伸到密封剂上的封装的多个端子触头，其中连接由第一切削刃暴露。 隔离结构设置在第一切削刃上，钝化暴露的连接并与第二切削刃共同设计。

公开(公告)号：US20080164553A1

公开(公告)日：2008-07-10

申请号：US11649242

申请日：2007-01-04

申请人： Tzu-Han Lin ,  Tzy-Ying Lin ,  Fang-Chang Liu ,  Kai-Chih Wang

发明人： Tzu-Han Lin ,  Tzy-Ying Lin ,  Fang-Chang Liu ,  Kai-Chih Wang

IPC分类号： H01L31/0203 ,  H01L31/18

CPC分类号： H01L27/14618 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2924/01078 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/00

摘要： Isolation structure for CMOS image sensor device chip scale packages and fabrication methods thereof. A CMOS image sensor chip scale package includes a transparent substrate configured as a support structure for the package. The transparent substrate includes a first cutting edge and a second cutting edge. A CMOS image sensor die with a die circuitry is mounted on the transparent substrate. An encapsulant is disposed on the substrate encapsulating the CMOS image sensor die. A connection extends from the die circuitry to a plurality of terminal contacts for the package on the encapsulant, wherein the connection is exposed by the first cutting edge. An isolation structure is disposed on the first cutting edge passivating the exposed connection and co-planed with the second cutting edge.

摘要翻译： CMOS图像传感器芯片级封装的隔离结构及其制造方法。 CMOS图像传感器芯片级封装包括被配置为用于封装的支撑结构的透明衬底。 透明基板包括第一切削刃和第二切削刃。 具有裸片电路的CMOS图像传感器芯片安装在透明基板上。 密封剂设置在封装有CMOS图像传感器芯片的基板上。 连接从管芯电路延伸到密封剂上的封装的多个端子触头，其中连接由第一切削刃暴露。 隔离结构设置在第一切削刃上，钝化暴露的连接并与第二切削刃共同设计。

公开(公告)号：US07679167B2

公开(公告)日：2010-03-16

申请号：US11707110

申请日：2007-02-16

申请人： Teng-Sheng Chen ,  Pai-Chun Peter Zung ,  Tzu-Han Lin ,  Shin-Chang Shiung

发明人： Teng-Sheng Chen ,  Pai-Chun Peter Zung ,  Tzu-Han Lin ,  Shin-Chang Shiung

IPC分类号： H01L23/552

CPC分类号： H04N5/335 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/10 ,  H01L2924/00014 ,  H04N5/2254 ,  H04N5/2257 ,  H01L2224/05599 ,  H01L2224/05099

摘要： A package module for an image sensor device is disclosed. The package module comprises a device chip disposed between lower and upper substrates. A first conductive layer is over a first sidewall of the lower substrate and insulated from the device chip. A first protective layer is on the first conductive layer and exposes a portion of the first conductive layer over the first sidewall of the lower substrate. A first pad is on the bottom surface of the lower substrate and is electrically connected to the first conductive layer. The invention also discloses an electronic assembly for an image sensor device and a fabrication method thereof.

摘要翻译： 公开了一种用于图像传感器装置的封装模块。 封装模块包括设置在下基板和上基板之间的器件芯片。 第一导电层在下基板的第一侧壁上方并且与器件芯片绝缘。 第一保护层在第一导电层上，并且将第一导电层的一部分暴露在下基板的第一侧壁上。 第一焊盘在下基板的底表面上并且电连接到第一导电层。 本发明还公开了一种用于图像传感器装置的电子组件及其制造方法。

公开(公告)号：US20090309178A1

公开(公告)日：2009-12-17

申请号：US12543804

申请日：2009-08-19

申请人： Jui-Ping Weng ,  Jang-Cheng Hsieh ,  Tzu-Han Lin ,  Pai-Chun Peter Zung

发明人： Jui-Ping Weng ,  Jang-Cheng Hsieh ,  Tzu-Han Lin ,  Pai-Chun Peter Zung

IPC分类号： H01L31/02

CPC分类号： H01L27/14618 ,  H01L27/14683 ,  H01L2224/10

摘要： The invention provides an image sensor package and method for fabricating the same. The image sensor package comprises a first substrate comprising a sensor device thereon and a hole therein. A bonding pad comprising a first opening is formed on an upper surface of the first substrate. A second substrate comprising a spacer element with a second opening therein is disposed on the first substrate. A conductive plug is formed in the hole and passes through the first and second openings to the second substrate to electrically contact with the bonding pad. A conductive layer is formed on a lower surface of the first substrate and electrically connects to the conductive plug. A solder ball is formed on the conductive layer and electrically connects to the bonding pad by the conductive plug. The image sensor package further comprises a second substrate bonding to the first substrate. The image sensor package is relatively less thick, thus, the dimensions thereof are relatively reduced.

摘要翻译： 本发明提供一种图像传感器封装及其制造方法。 图像传感器封装包括其上包括传感器装置的第一基板和其中的孔。 包括第一开口的焊盘形成在第一基板的上表面上。 包括其中具有第二开口的间隔元件的第二基板设置在第一基板上。 导电插塞形成在孔中，并通过第一和第二开口到第二基板，以与接合焊盘电接触。 导电层形成在第一基板的下表面上并电连接到导电插塞。 在导电层上形成焊球，并通过导电插塞与焊盘电连接。 图像传感器封装还包括与第一基板结合的第二基板。 图像传感器封装相对较薄，因此其尺寸相对减小。

公开(公告)号：US07528420B2

公开(公告)日：2009-05-05

申请号：US11752427

申请日：2007-05-23

申请人： Jui-Peng Weng ,  Tzu-Han Lin ,  Pai-Chun Peter Zung

发明人： Jui-Peng Weng ,  Tzu-Han Lin ,  Pai-Chun Peter Zung

IPC分类号： H01L29/22 ,  H01L29/227 ,  H01L33/00 ,  H01L27/15 ,  H01L29/267 ,  H01L31/12 ,  H01L29/417 ,  H01L29/74 ,  H01L31/111 ,  H01L27/148 ,  H01L29/768 ,  H01L31/0203 ,  H01L31/00

CPC分类号： H01L27/14687 ,  H01L27/14618 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05147 ,  H01L2224/05184 ,  H01L2224/05548 ,  H01L2224/0557 ,  H01L2224/10 ,  H01L2924/00014 ,  Y10S257/911 ,  H01L2224/05599

摘要： Image sensing devices and methods for fabricating the same are provided. An exemplary image sensing device includes a first substrate having a first side and a second side opposing each other. A plurality of image sensing elements is formed in the first substrate at the first side. A conductive via is formed through the first substrate, having a first surface exposed by the first substrate at the first side and a second surface exposed by the first substrate at the second side. A conductive pad overlies the conductive via at the first side and is electrically connecting the image sensing elements. A conductive layer overlies the conductive via at the second side and electrically connects with the conductive pad. A conductive bump is formed over a portion of the conductive layer. A second substrate is bonded with the first substrate at the first side.

摘要翻译： 提供了图像感测装置及其制造方法。 示例性的图像感测装置包括具有相对的第一侧和第二侧的第一基板。 在第一侧的第一基板中形成多个图像感测元件。 通过第一基板形成导电通孔，其具有在第一侧被第一基板暴露的第一表面和在第二侧被第一基板暴露的第二表面。 导电焊盘在第一侧覆盖导电通孔并且电连接图像感测元件。 导电层位于第二侧的导电通孔上，并与导电焊盘电连接。 在导电层的一部分上形成导电凸块。 第二衬底在第一侧与第一衬底结合。

公开(公告)号：US08153458B2

公开(公告)日：2012-04-10

申请号：US12407115

申请日：2009-03-19

申请人： Jui-Ping Weng ,  Tzu-Han Lin ,  Pai-Chun Peter Zung

发明人： Jui-Ping Weng ,  Tzu-Han Lin ,  Pai-Chun Peter Zung

IPC分类号： H01L21/70 ,  H01L31/0232 ,  H01L31/14

CPC分类号： H01L27/14687 ,  H01L27/14618 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05147 ,  H01L2224/05184 ,  H01L2224/05548 ,  H01L2224/0557 ,  H01L2224/10 ,  H01L2924/00014 ,  Y10S257/911 ,  H01L2224/05599

摘要： Image sensing devices and methods for fabricating the same are provided. An exemplary image sensing device comprises a first substrate having a first side and a second side opposing each other. A plurality of image sensing elements is formed in the first substrate at the first side. A conductive via is formed through the first substrate, having a first surface exposed by the first substrate at the first side and a second surface exposed by the first substrate at the second side. A conductive pad overlies the conductive via at the first side and is electrically connecting the image sensing elements. A conductive layer overlies the conductive via at the second side and electrically connects with the conductive pad. A conductive bump is formed over a portion of the conductive layer. A second substrate is bonded with the first substrate at the first side.

摘要翻译： 提供了图像感测装置及其制造方法。 示例性图像感测装置包括具有彼此相对的第一侧和第二侧的第一基板。 在第一侧的第一基板中形成多个图像感测元件。 通过第一基板形成导电通孔，其具有在第一侧被第一基板暴露的第一表面和在第二侧被第一基板暴露的第二表面。 导电焊盘在第一侧覆盖导电通孔并且电连接图像感测元件。 导电层位于第二侧的导电通孔上，并与导电焊盘电连接。 在导电层的一部分上形成导电凸块。 第二衬底在第一侧与第一衬底结合。

公开(公告)号：US07595220B2

公开(公告)日：2009-09-29

申请号：US11822011

申请日：2007-06-29

申请人： Jui-Ping Weng ,  Jang-Cheng Hsieh ,  Tzu-Han Lin ,  Pai-Chun Peter Zung

发明人： Jui-Ping Weng ,  Jang-Cheng Hsieh ,  Tzu-Han Lin ,  Pai-Chun Peter Zung

IPC分类号： H01L21/00 ,  H01L23/02

CPC分类号： H01L27/14618 ,  H01L27/14683 ,  H01L2224/10

摘要： The invention provides an image sensor package and method for fabricating the same. The image sensor package comprises a first substrate comprising a sensor device thereon and a hole therein. A bonding pad comprising a first opening is formed on an upper surface of the first substrate. A second substrate comprising a spacer element with a second opening therein is disposed on the first substrate. A conductive plug is formed in the hole and passes through the first and second openings to the second substrate to electrically contact with the bonding pad. A conductive layer is formed on a lower surface of the first substrate and electrically connects to the conductive plug. A solder ball is formed on the conductive layer and electrically connects to the bonding pad by the conductive plug. The image sensor package further comprises a second substrate bonding to the first substrate. The image sensor package is relatively less thick, thus, the dimensions thereof are relatively reduced.

摘要翻译： 本发明提供一种图像传感器封装及其制造方法。 图像传感器封装包括其上包括传感器装置的第一基板和其中的孔。 包括第一开口的焊盘形成在第一基板的上表面上。 包括其中具有第二开口的间隔元件的第二基板设置在第一基板上。 导电插塞形成在孔中，并通过第一和第二开口到第二基板，以与接合焊盘电接触。 导电层形成在第一基板的下表面上并电连接到导电插塞。 在导电层上形成焊球，并通过导电插塞与焊盘电连接。 图像传感器封装还包括与第一基板结合的第二基板。 图像传感器封装相对较薄，因此其尺寸相对减小。

公开(公告)号：US20090032893A1

公开(公告)日：2009-02-05

申请号：US11882441

申请日：2007-08-01

申请人： Jui-Ping Weng ,  Jang-Cheng Hsieh ,  Tzu-Han Lin ,  Pai-Chung Peter Zung

发明人： Jui-Ping Weng ,  Jang-Cheng Hsieh ,  Tzu-Han Lin ,  Pai-Chung Peter Zung

IPC分类号： H01L31/0203 ,  H01L31/0232 ,  H01L31/18

CPC分类号： H01L27/14683 ,  H01L21/304 ,  H01L21/76898 ,  H01L24/06 ,  H01L24/11 ,  H01L24/17 ,  H01L24/81 ,  H01L25/50 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/1469 ,  H01L2224/10

摘要： An image sensor package and method for fabricating the same is provided. The image sensor package includes a first substrate comprising a via hole therein, a driving circuit and a first conductive pad thereon. A second substrate comprising a photosensitive device and a second conductive pad thereon is bonded to the first substrate, so that the driving circuit, formed on the first substrate, can electrically connect to and further control the photosensitive device, formed on the second substrate. A solder ball is formed on a backside of the first substrate and electrically connects to the via hole for transmitting a signal from the driving circuit. Because the photosensitive device and the driving circuit are fabricated individually on the different substrates, fabrication and design thereof is more flexible. Moreover, the image sensor package is relatively less thick, thus, the dimensions thereof are reduced.

摘要翻译： 提供了一种图像传感器封装及其制造方法。 图像传感器封装包括其中包括通孔的第一基板，驱动电路和其上的第一导电焊盘。 包括其上的光敏器件和第二导电焊盘的第二衬底被结合到第一衬底，使得形成在第一衬底上的驱动电路可以电连接到并进一步控制形成在第二衬底上的光敏器件。 在第一基板的背面上形成焊球，并且电连接到用于传输来自驱动电路的信号的通孔。 由于感光装置和驱动电路分别制造在不同的基板上，所以其制造和设计更灵活。 此外，图像传感器封装相对较薄，因此其尺寸减小。