公开(公告)号：US06825063B2

公开(公告)日：2004-11-30

申请号：US10612744

申请日：2003-06-30

申请人： Quat T. Vu ,  Jian Li ,  Qing Ma ,  Maria V. Henao ,  Chun Mu

发明人： Quat T. Vu ,  Jian Li ,  Qing Ma ,  Maria V. Henao ,  Chun Mu

IPC分类号： H01L2144

CPC分类号： H01L24/19 ,  H01L21/568 ,  H01L23/532 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/20 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/19041 ,  Y10T29/4935 ,  H01L2224/96 ,  H01L2224/82 ,  H01L2924/00

摘要： A microelectronic package including a microelectronic die disposed within an opening in a microelectronic packaging core, wherein an encapsulation material is disposed within portions of the opening not occupied by the microelectronic die. Build-up layers of dielectric materials and conductive traces are then fabricated on the microelectronic die, the encapsulant material, and the microelectronic package core to form the microelectronic package.

摘要翻译： 一种微电子封装，包括设置在微电子封装芯中的开口内的微电子管芯，其中封装材料设置在不被微电子管芯占据的开口部分内。 然后在微电子管芯，密封剂材料和微电子封装芯上制造介电材料和导电迹线的堆积层以形成微电子封装。

公开(公告)号：US06586822B1

公开(公告)日：2003-07-01

申请号：US09658819

申请日：2000-09-08

申请人： Quat T. Vu ,  Jian Li ,  Qing Ma ,  Maria V. Henao ,  Xiao-Chun Mu

发明人： Quat T. Vu ,  Jian Li ,  Qing Ma ,  Maria V. Henao ,  Xiao-Chun Mu

IPC分类号： H01L2302

CPC分类号： H01L24/19 ,  H01L21/568 ,  H01L23/532 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/20 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/19041 ,  Y10T29/4935 ,  H01L2224/96 ,  H01L2224/82 ,  H01L2924/00

摘要： A microelectronic package including a microelectronic die disposed within an opening in a microelectronic packaging core, wherein an encapsulation material is disposed within portions of the opening not occupied by the microelectronic die. Build-up layers of dielectric materials and conductive traces are then fabricated on the microelectronic die, the encapsulant material, and the microelectronic package core to form the microelectronic package.

摘要翻译： 一种微电子封装，包括设置在微电子封装芯中的开口内的微电子管芯，其中封装材料设置在不被微电子管芯占据的开口部分内。 然后在微电子管芯，密封剂材料和微电子封装芯上制造介电材料和导电迹线的堆积层以形成微电子封装。

公开(公告)号：US06964889B2

公开(公告)日：2005-11-15

申请号：US10137081

申请日：2002-05-01

申请人： Qing Ma ,  Xiao-Chun Mu ,  Quat T. Vu

发明人： Qing Ma ,  Xiao-Chun Mu ,  Quat T. Vu

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/16 ,  H01L23/31 ,  H01L23/538 ,  H01L21/44

CPC分类号： H01L24/97 ,  H01L21/561 ,  H01L21/568 ,  H01L23/16 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/274 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/9222 ,  H01L2224/97 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2224/82 ,  H01L2924/00

摘要： A microelectronic package including a microelectronic die having an active surface and at least one side. An encapsulation material is disposed adjacent the microelectronic die side(s). A portion of the encapsulation material is removed to expose a back surface of the microelectronic die which has a metallization layer disposed thereon. A protective layer is disposed on the metallization layer prior to encapsulation, such that when the portion of the encapsulation material is removed, the protective layer prevents the metallization layer from being damaged. After the portion of the encapsulation material is removed, the protective layer is removed and the metallization layer is exposed. A heat spreader may then be attached to the microelectronic die by abutting the heat spreader against the metallization layer and reflowing the metallization layer.

公开(公告)号：US06902950B2

公开(公告)日：2005-06-07

申请号：US10143340

申请日：2002-05-10

申请人： Qing Ma ,  Xiao-Chun Mu ,  Quat T. Vu

发明人： Qing Ma ,  Xiao-Chun Mu ,  Quat T. Vu

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/16 ,  H01L23/31 ,  H01L23/538 ,  H01L21/44

CPC分类号： H01L24/97 ,  H01L21/561 ,  H01L21/568 ,  H01L23/16 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/274 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/9222 ,  H01L2224/97 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2224/82 ,  H01L2924/00

摘要： A microelectronic package including a microelectronic die having an active surface and at least one side. An encapsulation material is disposed adjacent the microelectronic die side(s). A portion of the encapsulation material is removed to expose a back surface of the microelectronic die which has a metallization layer disposed thereon. A protective layer is disposed on the metallization layer prior to encapsulation, such that when the portion of the encapsulation material is removed, the protective layer prevents the metallization layer from being damaged. After the portion of the encapsulation material is removed, the protective layer is removed and the metallization layer is exposed. A heat spreader may then be attached to the microelectronic die by abutting the heat spreader against the metallization layer and reflowing the metallization layer.

摘要翻译： 一种微电子封装，其包括具有活性表面和至少一个侧面的微电子管芯。 封装材料邻近微电子管芯侧设置。 去除包封材料的一部分以露出其上设置有金属化层的微电子管芯的背面。 在封装之前，保护层设置在金属化层上，使得当去除封装材料的部分时，保护层防止金属化层被损坏。 在去除封装材料的部分之后，去除保护层并暴露金属化层。 然后可以通过使散热器抵靠金属化层并且回流金属化层而将散热器附接到微电子管芯。

公开(公告)号：US06423570B1

公开(公告)日：2002-07-23

申请号：US09691738

申请日：2000-10-18

申请人： Qing Ma ,  Xiao-Chun Mu ,  Quat T. Vu

发明人： Qing Ma ,  Xiao-Chun Mu ,  Quat T. Vu

IPC分类号： H01L2144

CPC分类号： H01L24/97 ,  H01L21/561 ,  H01L21/568 ,  H01L23/16 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/274 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/9222 ,  H01L2224/97 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2224/82 ,  H01L2924/00

摘要： A microelectronic package including a microelectronic die having an active surface and at least one side. An encapsulation material is disposed adjacent the microelectronic die side(s). A portion of the encapsulation material is removed to expose a back surface of the microelectronic die which has a metallization layer disposed thereon. A protective layer is disposed on the metallization layer prior to encapsulation, such that when the portion of the encapsulation material is removed, the protective layer prevents the metallization layer from being damaged. After the portion of the encapsulation material is removed, the protective layer is removed and the metallization layer is exposed. A heat spreader may then be attached to the microelectronic die by abutting the heat spreader against the metallization layer and reflowing the metallization layer.

摘要翻译： 一种微电子封装，其包括具有活性表面和至少一个侧面的微电子管芯。 封装材料邻近微电子管芯侧设置。 去除包封材料的一部分以露出其上设置有金属化层的微电子管芯的背面。 在封装之前，保护层设置在金属化层上，使得当去除封装材料的部分时，保护层防止金属化层被损坏。 在去除封装材料的部分之后，去除保护层并暴露金属化层。 然后可以通过使散热器抵靠金属化层并且回流金属化层而将散热器附接到微电子管芯。

公开(公告)号：US06737754B2

公开(公告)日：2004-05-18

申请号：US09777833

申请日：2001-02-05

申请人： Qing Ma ,  Jin Lee ,  Chun Mu ,  Quat Vu ,  Jian Li ,  Larry Mosley

发明人： Qing Ma ,  Jin Lee ,  Chun Mu ,  Quat Vu ,  Jian Li ,  Larry Mosley

IPC分类号： H01L2328

CPC分类号： H01L23/3121 ,  H01L23/4334 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

摘要： A semiconductor device having a multilayer laminate that includes a thermally stable, flexible polymer film, a semiconductor die, a molding compound, and a heat dissipation member. The die has an active surface and an inactive surface, in which the active surface includes a plurality of contacts. The molding compound contacts both the laminate and the die, but does not contact the die's active or inactive surfaces. The heat dissipation member contacts the die's inactive surface.

摘要翻译： 一种具有多层叠层的半导体器件，其包括热稳定的，柔性的聚合物膜，半导体管芯，模塑料和散热构件。 模具具有活性表面和非活性表面，其中活性表面包括多个触点。 模塑料与层压体和模具接触，但不接触模具的活性或非活性表面。 散热构件接触模具的非活性表面。

公开(公告)号：US06238954B1

公开(公告)日：2001-05-29

申请号：US09407801

申请日：1999-09-28

申请人： Qing Ma ,  Jin Lee ,  Chun Mu ,  Quat Vu ,  Jian Li ,  Larry Mosley

发明人： Qing Ma ,  Jin Lee ,  Chun Mu ,  Quat Vu ,  Jian Li ,  Larry Mosley

IPC分类号： H01L2182

CPC分类号： H01L23/3121 ,  H01L23/4334 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

摘要： A semiconductor device having a multilayer laminate that includes a thermally stable, flexible polymer film, a semiconductor die, a molding compound, and a heat dissipation member. The die has an active surface and an inactive surface, in which the active surface includes a plurality of contacts. The molding compound contacts both the laminate and the die, but does not contact the die's active or inactive surfaces. The heat dissipation member contacts the die's inactive surface.

摘要翻译： 一种具有多层叠层的半导体器件，其包括热稳定的，柔性的聚合物膜，半导体管芯，模塑料和散热构件。 模具具有活性表面和非活性表面，其中活性表面包括多个触点。 模塑料与层压体和模具接触，但不接触模具的活性或非活性表面。 散热构件接触模具的非活性表面。

公开(公告)号：US6154366A

公开(公告)日：2000-11-28

申请号：US448066

申请日：1999-11-23

申请人： Qing Ma ,  Chun Mu ,  Harry Fujimoto ,  John Carruthers ,  Jian Li ,  Chuanbin Pan

发明人： Qing Ma ,  Chun Mu ,  Harry Fujimoto ,  John Carruthers ,  Jian Li ,  Chuanbin Pan

IPC分类号： H01L21/60 ,  H01L23/538 ,  H05K7/20

CPC分类号： H01L23/5389 ,  H01L23/3135 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311

摘要： A chip-on-flex package which includes at least one moisture barrier layer to prevent metal corrosion and delamination of flex component layers. An exemplary microelectronic package includes a microelectronic die having an active surface and at least one side, wherein the microelectronic die active surface includes at least one contact. A flex component is attached by a first surface to the microelectronic die active surface. At least one conductive trace is disposed on a second surface of the flex component and extends through the flex component to contact at least one of the contacts. An encapsulation material is adjacent the microelectronic die side and a bottom surface of the flex component. A moisture barrier is disposed on the flex component and the conductive trace(s). A second moisture barrier may be disposed on the encapsulation material. A heat dissipation device may also be incorporated into the chip-on-flex package.

摘要翻译： 一种芯片上柔性包装，其包括至少一个防潮层，以防止金属腐蚀和挠曲组分层的分层。 示例性微电子封装包括具有有源表面和至少一个侧面的微电子管芯，其中所述微电子管芯有源表面包括至少一个触点。 柔性部件通过第一表面附接到微电子管芯有源表面。 至少一个导电迹线设置在柔性部件的第二表面上并且延伸穿过柔性部件以接触至少一个触头。 封装材料邻近微电子管芯侧面和柔性部件的底部表面。 防潮层设置在柔性部件和导电迹线上。 第二湿气屏障可以设置在包封材料上。 散热装置也可以并入到芯片上的柔性封装中。

公开(公告)号：US06271469B1

公开(公告)日：2001-08-07

申请号：US09438221

申请日：1999-11-12

申请人： Qing Ma ,  Chun Mu ,  Harry Fujimoto

发明人： Qing Ma ,  Chun Mu ,  Harry Fujimoto

IPC分类号： H01L2302

CPC分类号： H01L21/561 ,  H01L21/56 ,  H01L21/568 ,  H01L23/3114 ,  H01L23/4334 ,  H01L23/485 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/20 ,  H01L2224/211 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/00

摘要： A microelectronic package including a microelectronic die having an active surface and at least one side. An encapsulation material is disposed adjacent the microelectronic die side(s), wherein the encapsulation material includes at least one surface substantially planar to the microelectronic die active surface. A first dielectric material layer may be disposed on at least a portion of the microelectronic die active surface and the encapsulation material surface. At least one conductive trace is then disposed on the first dielectric material layer. The conductive trace(s) is in electrical contact with the microelectronic die active surface. At least one conductive trace extends vertically adjacent the microelectronic die active surface and vertically adjacent the encapsulation material surface.

摘要翻译： 一种微电子封装，其包括具有活性表面和至少一个侧面的微电子管芯。 封装材料邻近微电子管芯侧设置，其中封装材料包括至少一个与微电子管芯有效表面平面的表面。 第一介电材料层可以设置在微电子管芯有源表面和封装材料表面的至少一部分上。 然后至少一个导电迹线设置在第一介电材料层上。 导电迹线与微电子管芯有源表面电接触。 至少一个导电迹线垂直邻近微电子管芯有源表面并垂直邻近封装材料表面延伸。

公开(公告)号：US06586836B1

公开(公告)日：2003-07-01

申请号：US09516652

申请日：2000-03-01

申请人： Qing Ma ,  Xiao-Chun Mu ,  Quat Vu ,  Steve Towle

发明人： Qing Ma ,  Xiao-Chun Mu ,  Quat Vu ,  Steve Towle

IPC分类号： H01L2348

CPC分类号： H01L24/19 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/96 ,  H01L25/0652 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/20 ,  H01L2224/92 ,  H01L2224/92144 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2224/96 ,  H01L2224/82 ,  H01L2924/00

摘要： A method of fabricating microelectronic dice by providing or forming a first encapsulated die assembly and a second encapsulated die assembly. Each of the encapsulated die assemblies includes at least one microelectronic die disposed in an encapsulation material. Each of the encapsulated die assemblies has an active surface and a back surface. The encapsulated die assemblies are attached together in a back surface-to-back surface arrangement. Build-up layers are then formed on the active surfaces of the first and second encapsulated assemblies, preferably, simultaneously. Thereafter, the microelectronic dice are singulated, if required, and the microelectronic dice of the first encapsulated die assembly are separated from the microelectronic dice of the second encapsulated die assembly.

摘要翻译： 一种通过提供或形成第一封装模具组件和第二封装模具组件来制造微电子模具的方法。 每个封装的管芯组件包括设置在封装材料中的至少一个微电子管芯。 每个封装的模具组件具有活性表面和后表面。 封装的模头组件以后表面对背表面布置连接在一起。 然后，优选地，同时地，在第一和第二封装组件的活性表面上形成积层。 此后，如果需要，微电子骰子是单切的，并且第一封装模具组件的微电子骰子与第二封装模具组件的微电子骰子分开。