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公开(公告)号：US20170117216A1
公开(公告)日：2017-04-27
申请号：US15398444
申请日：2017-01-04
发明人： Eiji HAYASHI , Kyo GO , Kozo HARADA , Shinji BABA
IPC分类号： H01L23/498 , H01L21/56 , H01L23/373 , H01L23/31
CPC分类号： H01L23/49827 , H01L21/4853 , H01L21/563 , H01L21/6835 , H01L23/3142 , H01L23/3157 , H01L23/36 , H01L23/373 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L23/49838 , H01L23/49894 , H01L23/562 , H01L24/11 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/743 , H01L24/81 , H01L2021/6015 , H01L2224/05001 , H01L2224/05008 , H01L2224/05009 , H01L2224/05022 , H01L2224/05023 , H01L2224/05024 , H01L2224/05025 , H01L2224/05124 , H01L2224/05572 , H01L2224/056 , H01L2224/11003 , H01L2224/13099 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/81193 , H01L2224/81205 , H01L2224/81801 , H01L2224/81909 , H01L2224/83102 , H01L2224/92125 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/0133 , H01L2924/014 , H01L2924/12042 , H01L2924/12044 , H01L2924/1306 , H01L2924/13091 , H01L2924/15174 , H01L2924/15184 , H01L2924/15311 , H01L2924/15312 , H01L2924/15724 , H01L2924/15747 , H01L2924/1579 , H01L2924/351 , H05K1/0366 , H05K3/4602 , H05K2201/029 , H01L2924/0132 , H01L2924/01014 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2924/0665 , H01L2924/00014
摘要： Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.
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公开(公告)号：US20190221509A1
公开(公告)日：2019-07-18
申请号：US16359485
申请日：2019-03-20
发明人： Eiji HAYASHI , Kyo GO , Kozo HARADA , Shinji BABA
IPC分类号： H01L23/498 , H01L23/373 , H01L23/31 , H01L23/00 , H05K3/46 , H01L23/36 , H01L21/683 , H01L21/56 , H01L21/48
摘要： Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.
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公开(公告)号：US20130037947A1
公开(公告)日：2013-02-14
申请号：US13648876
申请日：2012-10-10
发明人： Eiji HAYASHI , Kyo GO , Kozo HARADA , Shinji BABA
IPC分类号： H01L23/48
CPC分类号： H01L23/49827 , H01L21/4853 , H01L21/563 , H01L21/6835 , H01L23/3142 , H01L23/3157 , H01L23/36 , H01L23/373 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L23/49838 , H01L23/49894 , H01L23/562 , H01L24/11 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/743 , H01L24/81 , H01L2021/6015 , H01L2224/05001 , H01L2224/05008 , H01L2224/05009 , H01L2224/05022 , H01L2224/05023 , H01L2224/05024 , H01L2224/05025 , H01L2224/05124 , H01L2224/05572 , H01L2224/056 , H01L2224/11003 , H01L2224/13099 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/81193 , H01L2224/81205 , H01L2224/81801 , H01L2224/81909 , H01L2224/83102 , H01L2224/92125 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/0133 , H01L2924/014 , H01L2924/12042 , H01L2924/12044 , H01L2924/1306 , H01L2924/13091 , H01L2924/15174 , H01L2924/15184 , H01L2924/15311 , H01L2924/15312 , H01L2924/15724 , H01L2924/15747 , H01L2924/1579 , H01L2924/351 , H05K1/0366 , H05K3/4602 , H05K2201/029 , H01L2924/0132 , H01L2924/01014 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2924/0665 , H01L2924/00014
摘要： Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained.As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.
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公开(公告)号：US20180068936A1
公开(公告)日：2018-03-08
申请号：US15796746
申请日：2017-10-27
发明人： Eiji HAYASHI , Kyo GO , Kozo HARADA , Shinji BABA
IPC分类号： H01L23/498 , H01L21/56 , H01L23/373 , H01L23/31
CPC分类号： H01L23/49827 , H01L21/4853 , H01L21/563 , H01L21/6835 , H01L23/3142 , H01L23/3157 , H01L23/36 , H01L23/373 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L23/49838 , H01L23/49894 , H01L23/562 , H01L24/11 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/743 , H01L24/81 , H01L2021/6015 , H01L2224/05001 , H01L2224/05008 , H01L2224/05009 , H01L2224/05022 , H01L2224/05023 , H01L2224/05024 , H01L2224/05025 , H01L2224/05124 , H01L2224/05572 , H01L2224/056 , H01L2224/11003 , H01L2224/13099 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/81193 , H01L2224/81205 , H01L2224/81801 , H01L2224/81909 , H01L2224/83102 , H01L2224/92125 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/0133 , H01L2924/014 , H01L2924/12042 , H01L2924/12044 , H01L2924/1306 , H01L2924/13091 , H01L2924/15174 , H01L2924/15184 , H01L2924/15311 , H01L2924/15312 , H01L2924/15724 , H01L2924/15747 , H01L2924/1579 , H01L2924/351 , H05K1/0366 , H05K3/4602 , H05K2201/029 , H01L2924/0132 , H01L2924/01014 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2924/0665 , H01L2924/00014
摘要： Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.
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公开(公告)号：US20150099331A1
公开(公告)日：2015-04-09
申请号：US14569423
申请日：2014-12-12
发明人： Eiji HAYASHI , Kyo GO , Kozo HARADA , Shinji BABA
CPC分类号： H01L23/49827 , H01L21/4853 , H01L21/563 , H01L21/6835 , H01L23/3142 , H01L23/3157 , H01L23/36 , H01L23/373 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L23/49838 , H01L23/49894 , H01L23/562 , H01L24/11 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/743 , H01L24/81 , H01L2021/6015 , H01L2224/05001 , H01L2224/05008 , H01L2224/05009 , H01L2224/05022 , H01L2224/05023 , H01L2224/05024 , H01L2224/05025 , H01L2224/05124 , H01L2224/05572 , H01L2224/056 , H01L2224/11003 , H01L2224/13099 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/81193 , H01L2224/81205 , H01L2224/81801 , H01L2224/81909 , H01L2224/83102 , H01L2224/92125 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/0133 , H01L2924/014 , H01L2924/12042 , H01L2924/12044 , H01L2924/1306 , H01L2924/13091 , H01L2924/15174 , H01L2924/15184 , H01L2924/15311 , H01L2924/15312 , H01L2924/15724 , H01L2924/15747 , H01L2924/1579 , H01L2924/351 , H05K1/0366 , H05K3/4602 , H05K2201/029 , H01L2924/0132 , H01L2924/01014 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2924/0665 , H01L2924/00014
摘要： Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained.As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.
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公开(公告)号：US20130228913A1
公开(公告)日：2013-09-05
申请号：US13863241
申请日：2013-04-15
发明人： Eiji HAYASHI , Kyo GO , Kozo HARADA , Shinji BABA
IPC分类号： H01L23/00
CPC分类号： H01L23/49827 , H01L21/4853 , H01L21/563 , H01L21/6835 , H01L23/3142 , H01L23/3157 , H01L23/36 , H01L23/373 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L23/49838 , H01L23/49894 , H01L23/562 , H01L24/11 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/743 , H01L24/81 , H01L2021/6015 , H01L2224/05001 , H01L2224/05008 , H01L2224/05009 , H01L2224/05022 , H01L2224/05023 , H01L2224/05024 , H01L2224/05025 , H01L2224/05124 , H01L2224/05572 , H01L2224/056 , H01L2224/11003 , H01L2224/13099 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/81193 , H01L2224/81205 , H01L2224/81801 , H01L2224/81909 , H01L2224/83102 , H01L2224/92125 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/0133 , H01L2924/014 , H01L2924/12042 , H01L2924/12044 , H01L2924/1306 , H01L2924/13091 , H01L2924/15174 , H01L2924/15184 , H01L2924/15311 , H01L2924/15312 , H01L2924/15724 , H01L2924/15747 , H01L2924/1579 , H01L2924/351 , H05K1/0366 , H05K3/4602 , H05K2201/029 , H01L2924/0132 , H01L2924/01014 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2924/0665 , H01L2924/00014
摘要： Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained.As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.
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公开(公告)号：US20160358846A1
公开(公告)日：2016-12-08
申请号：US15241777
申请日：2016-08-19
发明人： Eiji HAYASHI , Kyo GO , Kozo HARADA , Shinji BABA
IPC分类号： H01L23/498 , H01L21/56 , H01L23/373 , H01L23/31
CPC分类号： H01L23/49827 , H01L21/4853 , H01L21/563 , H01L21/6835 , H01L23/3142 , H01L23/3157 , H01L23/36 , H01L23/373 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L23/49838 , H01L23/49894 , H01L23/562 , H01L24/11 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/743 , H01L24/81 , H01L2021/6015 , H01L2224/05001 , H01L2224/05008 , H01L2224/05009 , H01L2224/05022 , H01L2224/05023 , H01L2224/05024 , H01L2224/05025 , H01L2224/05124 , H01L2224/05572 , H01L2224/056 , H01L2224/11003 , H01L2224/13099 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/81193 , H01L2224/81205 , H01L2224/81801 , H01L2224/81909 , H01L2224/83102 , H01L2224/92125 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/0133 , H01L2924/014 , H01L2924/12042 , H01L2924/12044 , H01L2924/1306 , H01L2924/13091 , H01L2924/15174 , H01L2924/15184 , H01L2924/15311 , H01L2924/15312 , H01L2924/15724 , H01L2924/15747 , H01L2924/1579 , H01L2924/351 , H05K1/0366 , H05K3/4602 , H05K2201/029 , H01L2924/0132 , H01L2924/01014 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2924/0665 , H01L2924/00014
摘要： Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained.As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.
摘要翻译： 对于具有布线基板的半导体器件，通过其与布线基板进行倒装芯片接合的半导体芯片和粘附到半导体芯片的背面的散热器，并且省略了用于加强布线的加强件 基板并且保持散热器的表面平滑度，布线基板具有分别形成直径不同的通孔的多个绝缘基板，并且每个绝缘基板包含玻璃布。
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公开(公告)号：US20160196987A1
公开(公告)日：2016-07-07
申请号：US15045978
申请日：2016-02-17
发明人： Eiji HAYASHI , Kyo GO , Kozo HARADA , Shinji BABA
CPC分类号： H01L23/49827 , H01L21/4853 , H01L21/563 , H01L21/6835 , H01L23/3142 , H01L23/3157 , H01L23/36 , H01L23/373 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L23/49838 , H01L23/49894 , H01L23/562 , H01L24/11 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/743 , H01L24/81 , H01L2021/6015 , H01L2224/05001 , H01L2224/05008 , H01L2224/05009 , H01L2224/05022 , H01L2224/05023 , H01L2224/05024 , H01L2224/05025 , H01L2224/05124 , H01L2224/05572 , H01L2224/056 , H01L2224/11003 , H01L2224/13099 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/81193 , H01L2224/81205 , H01L2224/81801 , H01L2224/81909 , H01L2224/83102 , H01L2224/92125 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/0133 , H01L2924/014 , H01L2924/12042 , H01L2924/12044 , H01L2924/1306 , H01L2924/13091 , H01L2924/15174 , H01L2924/15184 , H01L2924/15311 , H01L2924/15312 , H01L2924/15724 , H01L2924/15747 , H01L2924/1579 , H01L2924/351 , H05K1/0366 , H05K3/4602 , H05K2201/029 , H01L2924/0132 , H01L2924/01014 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2924/0665 , H01L2924/00014
摘要： Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained.As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.
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公开(公告)号：US20140327137A1
公开(公告)日：2014-11-06
申请号：US14338175
申请日：2014-07-22
发明人： Eiji HAYASHI , Kyo GO , Kozo HARADA , Shinji BABA
IPC分类号： H01L23/498
CPC分类号： H01L23/49827 , H01L21/4853 , H01L21/563 , H01L21/6835 , H01L23/3142 , H01L23/3157 , H01L23/36 , H01L23/373 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L23/49838 , H01L23/49894 , H01L23/562 , H01L24/11 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/743 , H01L24/81 , H01L2021/6015 , H01L2224/05001 , H01L2224/05008 , H01L2224/05009 , H01L2224/05022 , H01L2224/05023 , H01L2224/05024 , H01L2224/05025 , H01L2224/05124 , H01L2224/05572 , H01L2224/056 , H01L2224/11003 , H01L2224/13099 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/81193 , H01L2224/81205 , H01L2224/81801 , H01L2224/81909 , H01L2224/83102 , H01L2224/92125 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/0133 , H01L2924/014 , H01L2924/12042 , H01L2924/12044 , H01L2924/1306 , H01L2924/13091 , H01L2924/15174 , H01L2924/15184 , H01L2924/15311 , H01L2924/15312 , H01L2924/15724 , H01L2924/15747 , H01L2924/1579 , H01L2924/351 , H05K1/0366 , H05K3/4602 , H05K2201/029 , H01L2924/0132 , H01L2924/01014 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2924/0665 , H01L2924/00014
摘要： Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substract, a semiconductor chip by which the flip chip was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth
摘要翻译： 即使省略了加强件，也可以获得能够防止布线基板发生扭曲和变形的半导体装置。 对于具有布线基底的半导体器件，制作倒装芯片的布线基板的半导体芯片和附着在半导体芯片背面的散热器，省略了用于加强布线基板的加强板 并且保持散热器的表面平滑度，布线基板具有分别形成直径不同的通孔的多个绝缘基板，并且每个绝缘基板包含玻璃布
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公开(公告)号：US20140038361A1
公开(公告)日：2014-02-06
申请号：US14044497
申请日：2013-10-02
发明人： Eiji HAYASHI , Kyo GO , Kozo HARADA , Shinji BABA
IPC分类号： H01L21/56
CPC分类号： H01L23/49827 , H01L21/4853 , H01L21/563 , H01L21/6835 , H01L23/3142 , H01L23/3157 , H01L23/36 , H01L23/373 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L23/49838 , H01L23/49894 , H01L23/562 , H01L24/11 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/743 , H01L24/81 , H01L2021/6015 , H01L2224/05001 , H01L2224/05008 , H01L2224/05009 , H01L2224/05022 , H01L2224/05023 , H01L2224/05024 , H01L2224/05025 , H01L2224/05124 , H01L2224/05572 , H01L2224/056 , H01L2224/11003 , H01L2224/13099 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/81193 , H01L2224/81205 , H01L2224/81801 , H01L2224/81909 , H01L2224/83102 , H01L2224/92125 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/0133 , H01L2924/014 , H01L2924/12042 , H01L2924/12044 , H01L2924/1306 , H01L2924/13091 , H01L2924/15174 , H01L2924/15184 , H01L2924/15311 , H01L2924/15312 , H01L2924/15724 , H01L2924/15747 , H01L2924/1579 , H01L2924/351 , H05K1/0366 , H05K3/4602 , H05K2201/029 , H01L2924/0132 , H01L2924/01014 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2924/0665 , H01L2924/00014
摘要： Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained.As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.
摘要翻译： 即使省略了加强件，也可以获得能够防止布线基板发生扭曲和变形的半导体装置。 对于具有布线基板的半导体器件，通过其与布线基板进行倒装芯片接合的半导体芯片和粘附到半导体芯片的背面的散热器，并且省略了用于加强布线的加强件 基板并且保持散热器的表面平滑度，布线基板具有分别形成直径不同的通孔的多个绝缘基板，并且每个绝缘基板包含玻璃布。
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