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公开(公告)号：US20190221509A1
公开(公告)日：2019-07-18
申请号：US16359485
申请日：2019-03-20
发明人： Eiji HAYASHI , Kyo GO , Kozo HARADA , Shinji BABA
IPC分类号： H01L23/498 , H01L23/373 , H01L23/31 , H01L23/00 , H05K3/46 , H01L23/36 , H01L21/683 , H01L21/56 , H01L21/48
摘要： Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.
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公开(公告)号：US20130037947A1
公开(公告)日：2013-02-14
申请号：US13648876
申请日：2012-10-10
发明人： Eiji HAYASHI , Kyo GO , Kozo HARADA , Shinji BABA
IPC分类号： H01L23/48
CPC分类号： H01L23/49827 , H01L21/4853 , H01L21/563 , H01L21/6835 , H01L23/3142 , H01L23/3157 , H01L23/36 , H01L23/373 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L23/49838 , H01L23/49894 , H01L23/562 , H01L24/11 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/743 , H01L24/81 , H01L2021/6015 , H01L2224/05001 , H01L2224/05008 , H01L2224/05009 , H01L2224/05022 , H01L2224/05023 , H01L2224/05024 , H01L2224/05025 , H01L2224/05124 , H01L2224/05572 , H01L2224/056 , H01L2224/11003 , H01L2224/13099 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/81193 , H01L2224/81205 , H01L2224/81801 , H01L2224/81909 , H01L2224/83102 , H01L2224/92125 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/0133 , H01L2924/014 , H01L2924/12042 , H01L2924/12044 , H01L2924/1306 , H01L2924/13091 , H01L2924/15174 , H01L2924/15184 , H01L2924/15311 , H01L2924/15312 , H01L2924/15724 , H01L2924/15747 , H01L2924/1579 , H01L2924/351 , H05K1/0366 , H05K3/4602 , H05K2201/029 , H01L2924/0132 , H01L2924/01014 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2924/0665 , H01L2924/00014
摘要： Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained.As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.
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公开(公告)号：US20170117216A1
公开(公告)日：2017-04-27
申请号：US15398444
申请日：2017-01-04
发明人： Eiji HAYASHI , Kyo GO , Kozo HARADA , Shinji BABA
IPC分类号： H01L23/498 , H01L21/56 , H01L23/373 , H01L23/31
CPC分类号： H01L23/49827 , H01L21/4853 , H01L21/563 , H01L21/6835 , H01L23/3142 , H01L23/3157 , H01L23/36 , H01L23/373 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L23/49838 , H01L23/49894 , H01L23/562 , H01L24/11 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/743 , H01L24/81 , H01L2021/6015 , H01L2224/05001 , H01L2224/05008 , H01L2224/05009 , H01L2224/05022 , H01L2224/05023 , H01L2224/05024 , H01L2224/05025 , H01L2224/05124 , H01L2224/05572 , H01L2224/056 , H01L2224/11003 , H01L2224/13099 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/81193 , H01L2224/81205 , H01L2224/81801 , H01L2224/81909 , H01L2224/83102 , H01L2224/92125 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/0133 , H01L2924/014 , H01L2924/12042 , H01L2924/12044 , H01L2924/1306 , H01L2924/13091 , H01L2924/15174 , H01L2924/15184 , H01L2924/15311 , H01L2924/15312 , H01L2924/15724 , H01L2924/15747 , H01L2924/1579 , H01L2924/351 , H05K1/0366 , H05K3/4602 , H05K2201/029 , H01L2924/0132 , H01L2924/01014 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2924/0665 , H01L2924/00014
摘要： Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.
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公开(公告)号：US20150118801A1
公开(公告)日：2015-04-30
申请号：US14590804
申请日：2015-01-06
发明人： Kozo HARADA , Shinji BABA , Masaki WATANABE , Satoshi YAMADA
CPC分类号： H01L24/81 , H01L21/56 , H01L21/563 , H01L23/3677 , H01L23/49811 , H01L23/49827 , H01L23/49838 , H01L23/50 , H01L24/13 , H01L24/14 , H01L24/16 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/14152 , H01L2224/14154 , H01L2224/16225 , H01L2224/16227 , H01L2224/16237 , H01L2224/16238 , H01L2224/32225 , H01L2224/73204 , H01L2224/81801 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15311 , H01L2924/351 , H01L2924/00 , H01L2924/00014 , H01L2924/014
摘要： To provide a semiconductor device characterized in that lands for mounting thereon solder balls placed in an inner area of a chip mounting area have an NSMD structure. This means that lands for mounting thereon solder balls placed in an area of the back surface of a through-hole wiring board overlapping with a chip mounting area in a plan view have an NSMD structure. According to the invention, a semiconductor device to be mounted on a mounting substrate with balls has improved reliability.
摘要翻译： 为了提供一种半导体器件，其特征在于用于安装在芯片安装区域的内部区域中的焊球上的焊盘具有NSMD结构。 这意味着在平面图中与芯片安装区域重叠的通孔布线板的背面的区域中放置有焊球的焊盘具有NSMD结构。 根据本发明，用球安装在安装基板上的半导体器件具有改进的可靠性。
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公开(公告)号：US20130299970A1
公开(公告)日：2013-11-14
申请号：US13872012
申请日：2013-04-26
发明人： Kozo HARADA , Shinji BABA , Masaki WATANABE , Satoshi YAMADA
IPC分类号： H01L23/498
CPC分类号： H01L24/81 , H01L21/56 , H01L21/563 , H01L23/3677 , H01L23/49811 , H01L23/49827 , H01L23/49838 , H01L23/50 , H01L24/13 , H01L24/14 , H01L24/16 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/14152 , H01L2224/14154 , H01L2224/16225 , H01L2224/16227 , H01L2224/16237 , H01L2224/16238 , H01L2224/32225 , H01L2224/73204 , H01L2224/81801 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15311 , H01L2924/351 , H01L2924/00 , H01L2924/00014 , H01L2924/014
摘要： To provide a semiconductor device characterized in that lands for mounting thereon solder balls placed in an inner area of a chip mounting area have an NSMD structure. This means that lands for mounting thereon solder balls placed in an area of the back surface of a through-hole wiring board overlapping with a chip mounting area in a plan view have an NSMD structure. According to the invention, a semiconductor device to be mounted on a mounting substrate with balls has improved reliability.
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公开(公告)号：US20180068936A1
公开(公告)日：2018-03-08
申请号：US15796746
申请日：2017-10-27
发明人： Eiji HAYASHI , Kyo GO , Kozo HARADA , Shinji BABA
IPC分类号： H01L23/498 , H01L21/56 , H01L23/373 , H01L23/31
CPC分类号： H01L23/49827 , H01L21/4853 , H01L21/563 , H01L21/6835 , H01L23/3142 , H01L23/3157 , H01L23/36 , H01L23/373 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L23/49838 , H01L23/49894 , H01L23/562 , H01L24/11 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/743 , H01L24/81 , H01L2021/6015 , H01L2224/05001 , H01L2224/05008 , H01L2224/05009 , H01L2224/05022 , H01L2224/05023 , H01L2224/05024 , H01L2224/05025 , H01L2224/05124 , H01L2224/05572 , H01L2224/056 , H01L2224/11003 , H01L2224/13099 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/81193 , H01L2224/81205 , H01L2224/81801 , H01L2224/81909 , H01L2224/83102 , H01L2224/92125 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/0133 , H01L2924/014 , H01L2924/12042 , H01L2924/12044 , H01L2924/1306 , H01L2924/13091 , H01L2924/15174 , H01L2924/15184 , H01L2924/15311 , H01L2924/15312 , H01L2924/15724 , H01L2924/15747 , H01L2924/1579 , H01L2924/351 , H05K1/0366 , H05K3/4602 , H05K2201/029 , H01L2924/0132 , H01L2924/01014 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2924/0665 , H01L2924/00014
摘要： Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.
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公开(公告)号：US20150099331A1
公开(公告)日：2015-04-09
申请号：US14569423
申请日：2014-12-12
发明人： Eiji HAYASHI , Kyo GO , Kozo HARADA , Shinji BABA
CPC分类号： H01L23/49827 , H01L21/4853 , H01L21/563 , H01L21/6835 , H01L23/3142 , H01L23/3157 , H01L23/36 , H01L23/373 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L23/49838 , H01L23/49894 , H01L23/562 , H01L24/11 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/743 , H01L24/81 , H01L2021/6015 , H01L2224/05001 , H01L2224/05008 , H01L2224/05009 , H01L2224/05022 , H01L2224/05023 , H01L2224/05024 , H01L2224/05025 , H01L2224/05124 , H01L2224/05572 , H01L2224/056 , H01L2224/11003 , H01L2224/13099 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/81193 , H01L2224/81205 , H01L2224/81801 , H01L2224/81909 , H01L2224/83102 , H01L2224/92125 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/0133 , H01L2924/014 , H01L2924/12042 , H01L2924/12044 , H01L2924/1306 , H01L2924/13091 , H01L2924/15174 , H01L2924/15184 , H01L2924/15311 , H01L2924/15312 , H01L2924/15724 , H01L2924/15747 , H01L2924/1579 , H01L2924/351 , H05K1/0366 , H05K3/4602 , H05K2201/029 , H01L2924/0132 , H01L2924/01014 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2924/0665 , H01L2924/00014
摘要： Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained.As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.
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公开(公告)号：US20130228913A1
公开(公告)日：2013-09-05
申请号：US13863241
申请日：2013-04-15
发明人： Eiji HAYASHI , Kyo GO , Kozo HARADA , Shinji BABA
IPC分类号： H01L23/00
CPC分类号： H01L23/49827 , H01L21/4853 , H01L21/563 , H01L21/6835 , H01L23/3142 , H01L23/3157 , H01L23/36 , H01L23/373 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L23/49838 , H01L23/49894 , H01L23/562 , H01L24/11 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/743 , H01L24/81 , H01L2021/6015 , H01L2224/05001 , H01L2224/05008 , H01L2224/05009 , H01L2224/05022 , H01L2224/05023 , H01L2224/05024 , H01L2224/05025 , H01L2224/05124 , H01L2224/05572 , H01L2224/056 , H01L2224/11003 , H01L2224/13099 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/81193 , H01L2224/81205 , H01L2224/81801 , H01L2224/81909 , H01L2224/83102 , H01L2224/92125 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/0133 , H01L2924/014 , H01L2924/12042 , H01L2924/12044 , H01L2924/1306 , H01L2924/13091 , H01L2924/15174 , H01L2924/15184 , H01L2924/15311 , H01L2924/15312 , H01L2924/15724 , H01L2924/15747 , H01L2924/1579 , H01L2924/351 , H05K1/0366 , H05K3/4602 , H05K2201/029 , H01L2924/0132 , H01L2924/01014 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2924/0665 , H01L2924/00014
摘要： Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained.As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.
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公开(公告)号：US20160358846A1
公开(公告)日：2016-12-08
申请号：US15241777
申请日：2016-08-19
发明人： Eiji HAYASHI , Kyo GO , Kozo HARADA , Shinji BABA
IPC分类号： H01L23/498 , H01L21/56 , H01L23/373 , H01L23/31
CPC分类号： H01L23/49827 , H01L21/4853 , H01L21/563 , H01L21/6835 , H01L23/3142 , H01L23/3157 , H01L23/36 , H01L23/373 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L23/49838 , H01L23/49894 , H01L23/562 , H01L24/11 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/743 , H01L24/81 , H01L2021/6015 , H01L2224/05001 , H01L2224/05008 , H01L2224/05009 , H01L2224/05022 , H01L2224/05023 , H01L2224/05024 , H01L2224/05025 , H01L2224/05124 , H01L2224/05572 , H01L2224/056 , H01L2224/11003 , H01L2224/13099 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/81193 , H01L2224/81205 , H01L2224/81801 , H01L2224/81909 , H01L2224/83102 , H01L2224/92125 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/0133 , H01L2924/014 , H01L2924/12042 , H01L2924/12044 , H01L2924/1306 , H01L2924/13091 , H01L2924/15174 , H01L2924/15184 , H01L2924/15311 , H01L2924/15312 , H01L2924/15724 , H01L2924/15747 , H01L2924/1579 , H01L2924/351 , H05K1/0366 , H05K3/4602 , H05K2201/029 , H01L2924/0132 , H01L2924/01014 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2924/0665 , H01L2924/00014
摘要： Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained.As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.
摘要翻译： 对于具有布线基板的半导体器件，通过其与布线基板进行倒装芯片接合的半导体芯片和粘附到半导体芯片的背面的散热器，并且省略了用于加强布线的加强件 基板并且保持散热器的表面平滑度，布线基板具有分别形成直径不同的通孔的多个绝缘基板，并且每个绝缘基板包含玻璃布。
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公开(公告)号：US20160196987A1
公开(公告)日：2016-07-07
申请号：US15045978
申请日：2016-02-17
发明人： Eiji HAYASHI , Kyo GO , Kozo HARADA , Shinji BABA
CPC分类号： H01L23/49827 , H01L21/4853 , H01L21/563 , H01L21/6835 , H01L23/3142 , H01L23/3157 , H01L23/36 , H01L23/373 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L23/49838 , H01L23/49894 , H01L23/562 , H01L24/11 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/743 , H01L24/81 , H01L2021/6015 , H01L2224/05001 , H01L2224/05008 , H01L2224/05009 , H01L2224/05022 , H01L2224/05023 , H01L2224/05024 , H01L2224/05025 , H01L2224/05124 , H01L2224/05572 , H01L2224/056 , H01L2224/11003 , H01L2224/13099 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/81193 , H01L2224/81205 , H01L2224/81801 , H01L2224/81909 , H01L2224/83102 , H01L2224/92125 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/0133 , H01L2924/014 , H01L2924/12042 , H01L2924/12044 , H01L2924/1306 , H01L2924/13091 , H01L2924/15174 , H01L2924/15184 , H01L2924/15311 , H01L2924/15312 , H01L2924/15724 , H01L2924/15747 , H01L2924/1579 , H01L2924/351 , H05K1/0366 , H05K3/4602 , H05K2201/029 , H01L2924/0132 , H01L2924/01014 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2924/0665 , H01L2924/00014
摘要： Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained.As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.
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