公开(公告)号：US20190189646A1

公开(公告)日：2019-06-20

申请号：US16301067

申请日：2017-03-28

Applicant: SONY CORPORATION

Inventor： Toshihiko WATANABE ,  Akiyoshi AOYAGI ,  Hirokazu NAKAYAMA

IPC: H01L27/12 ,  H05K1/11 ,  H05K3/42

CPC classification number: H01L27/1244 ,  G09F9/30 ,  H01L23/12 ,  H01L27/1259 ,  H05K1/112 ,  H05K1/18 ,  H05K3/34 ,  H05K3/422 ,  H05K3/423 ,  H05K3/46 ,  H05K2201/09609 ,  H05K2203/072 ,  H05K2203/0723

Abstract: To provide a display device and an electronic apparatus that prevent the occurrence of failure in the connection between a mounting substrate and an electronic component. The display device includes: an interconnection layer (111) provided on a support substrate (10); a plurality of insulating layers (121 and 122) provided above the interconnection layer (111); an opening (140) provided in parts of the insulating layers (121 and 122); and a metal layer (130) electrically connected to the interconnection layer (111) and filling the opening (140) up to a height below a layer surface of the insulating layer.

公开(公告)号：US20170019996A1

公开(公告)日：2017-01-19

申请号：US15124499

申请日：2015-02-27

Applicant: SONY CORPORATION

Inventor： Toshihiko WATANABE

IPC: H05K1/11 ,  H05K3/34 ,  H05K3/40 ,  H05K3/00 ,  H05K3/42

CPC classification number: H05K1/116 ,  H01L21/486 ,  H01L23/49827 ,  H01L33/48 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2924/1531 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K1/112 ,  H05K1/115 ,  H05K3/0094 ,  H05K3/3436 ,  H05K3/3447 ,  H05K3/3489 ,  H05K3/4007 ,  H05K3/42 ,  H05K2201/09154 ,  H05K2201/0959 ,  H05K2201/09863 ,  H05K2201/10106 ,  H05K2201/10484 ,  H05K2203/1383 ,  H05K2203/1394 ,  Y02P70/613

Abstract: A mounting substrate includes a through-hole 13 formed in a substrate 10, a first land part 21, a second land part 31, a first component attaching part 22, a second component attaching part 32, a conductive layer 14, and a filling member 15 filled into a part of the through-hole 13. A shortest distance allowable value L0 from the center of the first land part 21 to a component 51 is determined on the basis of the volume Vh of a part of the through-hole 15 positioned above a top surface of the filling member 15 on the side of the first land part 21, the length L1 of the component 51 to be mounted to the first component attaching part 22, and the maximum allowable value of the inclination of the component 51 to be mounted to the first component attaching part 22 relative to the first surface 11 of the substrate 10.

Abstract translation: 安装基板包括形成在基板10中的通孔13，第一接地部21，第二接地部31，第一部件安装部22，第二部件安装部32，导电层14和填充部件 15被填充到通孔13的一部分中。从第一陆部21的中心到部件51的最短距离允许值L0基于定位的通孔15的一部分的体积Vh来确定 在第一接地部21侧的填充部件15的上表面上，要安装到第一部件安装部22的部件51的长度L1和部件51的倾斜度的最大允许值为 相对于基板10的第一表面11安装到第一部件安装部22。