公开(公告)号：US20180190838A1

公开(公告)日：2018-07-05

申请号：US15689976

申请日：2017-08-29

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine Saxod ,  Alexandre Mas ,  Eric Saugier ,  Gaetan Lobascio ,  Benoit Besancon

IPC: H01L31/0203 ,  H01L31/18 ,  H01L31/0232 ,  H01L31/02 ,  H01L31/12 ,  B29C45/14

CPC classification number: H01L31/0203 ,  B29C45/14065 ,  B29C45/14639 ,  B29C45/14778 ,  B29K2995/0026 ,  B29L2031/3481 ,  H01L31/02002 ,  H01L31/02325 ,  H01L31/02327 ,  H01L31/12 ,  H01L31/18 ,  H01L33/483

Abstract: A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.

公开(公告)号：US20180033710A1

公开(公告)日：2018-02-01

申请号：US15728969

申请日：2017-10-10

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Benoit Besancon ,  Luc Petit

IPC: H01L23/31 ,  H01L23/498 ,  H01L21/78 ,  H01L23/00 ,  H01L21/56

CPC classification number: H01L23/3128 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/49838 ,  H01L23/562 ,  H01L24/17 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/351 ,  H01L2224/81

Abstract: An electronic device includes a carrier substrate with at least one integrated-circuit chip mounted on a front face of the carrier substrate. An encapsulation block on the front face and embedding the integrated-circuit chip has a periphery with corners. The encapsulating block further has, in at least one local zone located in at least one corner and from the front face of the carrier substrate, a smaller thickness than a thickness of the encapsulation block at least in a surrounding zone. The electronic device is manufactured by a process in which the zone of smaller thickness is obtained by molding or by machining.

公开(公告)号：US11114312B2

公开(公告)日：2021-09-07

申请号：US16394925

申请日：2019-04-25

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Benoit Besancon ,  Alexandre Mas ,  Karine Saxod

IPC: H01L21/56 ,  H01L23/31 ,  H01L23/552 ,  H01L23/053 ,  H01L23/06 ,  H01L23/10 ,  H01L23/24 ,  H01L23/42 ,  H01L23/433 ,  H01L21/52 ,  H01L23/04 ,  H01L21/48

Abstract: A method for manufacturing a cover for an electronic package includes placing an insert having opposite faces between opposite faces of a cavity of a mold. A coating material is injected in the mold cavity around the insert. The coating material is then set to form a substrate that is overmolded around the insert and produce the cover.

公开(公告)号：US20180190512A1

公开(公告)日：2018-07-05

申请号：US15685552

申请日：2017-08-24

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Benoit Besancon ,  Alexandre Mas ,  Karine Saxod

IPC: H01L21/56 ,  H01L23/31 ,  H01L23/552

CPC classification number: H01L21/565 ,  H01L21/4803 ,  H01L21/52 ,  H01L23/04 ,  H01L23/053 ,  H01L23/06 ,  H01L23/10 ,  H01L23/24 ,  H01L23/315 ,  H01L23/3192 ,  H01L23/42 ,  H01L23/4334 ,  H01L23/552

Abstract: A method for manufacturing a cover for an electronic package includes placing an insert having opposite faces between opposite faces of a cavity of a mold. A coating material is injected in the mold cavity around the insert. The coating material is then set to form a substrate that is overmolded around the insert and produce the cover.

公开(公告)号：US20180190511A1

公开(公告)日：2018-07-05

申请号：US15685285

申请日：2017-08-24

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Alexandre Mas ,  Benoit Besancon ,  Karine Saxod

IPC: H01L21/56 ,  H01L23/28 ,  H01L23/02

Abstract: A method for manufacturing a cover for an electronic package includes placing an electrically conductive insert (including an electrical contact surface) inside a cavity of a mold in a position such that the electrical contact surface is in contact with a face of the cavity of the mold. A coating material is injected into said cavity and set so as to produce a substrate that is overmolded around the insert and forms the cover where the electrical contact surface of the overmolded substrate is not covered by the coating material. An electronic package is then formed from a chip mounted on a carrier substrate that is covered by the cover. The electrical contact surface is located above and electrically connected to an electrical connection pad of either the chip or the carrier substrate.

公开(公告)号：US11688815B2

公开(公告)日：2023-06-27

申请号：US17081299

申请日：2020-10-27

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine Saxod ,  Alexandre Mas ,  Eric Saugier ,  Gaetan Lobascio ,  Benoit Besancon

IPC: H01L31/02 ,  H01L31/0203 ,  H01L31/18 ,  H01L31/0232 ,  H01L31/12 ,  B29C45/14 ,  H01L33/48 ,  B29L31/34

CPC classification number: H01L31/0203 ,  B29C45/14065 ,  B29C45/14639 ,  H01L31/02002 ,  H01L31/02325 ,  H01L31/02327 ,  H01L31/12 ,  H01L31/18 ,  H01L33/483 ,  B29C45/14778 ,  B29K2995/0026 ,  B29L2031/3481

Abstract: A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.

公开(公告)号：US20170317059A1

公开(公告)日：2017-11-02

申请号：US15364452

申请日：2016-11-30

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Benoit Besancon ,  Norbert Chevrier ,  Jean-Michel Riviere

IPC: H01L25/065 ,  H01L23/367

CPC classification number: H01L25/0657 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/4334 ,  H01L23/49833 ,  H01L2224/04105 ,  H01L2224/16227 ,  H01L2224/18 ,  H01L2224/73259 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06558 ,  H01L2225/06575 ,  H01L2225/06582 ,  H01L2225/06589

Abstract: An electronic device includes a first support platelet and a second support platelet that is disposed opposite and at a distance from the first support platelet. At least one first electronic chip is mounted on the first support platelet on a side facing the second support platelet. A second electronic chip is mounted on the second support platelet on a side facing the first support platelet. A heat sink that includes at least one interposition plate is interposed between the first and second electronic chips.

公开(公告)号：US20170250119A1

公开(公告)日：2017-08-31

申请号：US15240482

申请日：2016-08-18

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Benoit Besancon ,  Luc Petit

IPC: H01L23/31 ,  H01L23/00 ,  H01L21/78 ,  H01L23/498 ,  H01L21/56

CPC classification number: H01L23/3128 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/49838 ,  H01L23/562 ,  H01L24/17 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/351 ,  H01L2224/81

Abstract: An electronic device includes a carrier substrate with at least one electronic-circuit chip mounted on a front face of the carrier substrate. An encapsulation block on the front face and embedding the electronic-circuit chip has a periphery with corners. The encapsulating block further has, in at least one local zone located in at least one corner and from the front face of the carrier substrate, a smaller thickness than a thickness of the encapsulation block at least in a surrounding zone. The electronic device is manufactured by a process in which the zone of smaller thickness is obtained by molding or by machining.

公开(公告)号：US10483408B2

公开(公告)日：2019-11-19

申请号：US15689976

申请日：2017-08-29

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine Saxod ,  Alexandre Mas ,  Eric Saugier ,  Gaetan Lobascio ,  Benoit Besancon

IPC: H01L31/0203 ,  H01L31/18 ,  H01L31/0232 ,  H01L31/02 ,  H01L31/12 ,  B29C45/14 ,  H01L33/48 ,  B29L31/34

Abstract: A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.

公开(公告)号：US10186466B2

公开(公告)日：2019-01-22

申请号：US15728969

申请日：2017-10-10

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Benoit Besancon ,  Luc Petit

IPC: H01L21/48 ,  H01L21/52 ,  H01L21/58 ,  H01L21/78 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L23/498

Abstract: An electronic device includes a carrier substrate with at least one integrated-circuit chip mounted on a front face of the carrier substrate. An encapsulation block on the front face and embedding the integrated-circuit chip has a periphery with corners. The encapsulating block further has, in at least one local zone located in at least one corner and from the front face of the carrier substrate, a smaller thickness than a thickness of the encapsulation block at least in a surrounding zone. The electronic device is manufactured by a process in which the zone of smaller thickness is obtained by molding or by machining.