公开(公告)号：US20180122752A1

公开(公告)日：2018-05-03

申请号：US15854456

申请日：2017-12-26

Applicant: STMicroelectronics S.r.I.

Inventor： Alberto Pagani ,  Giovanni Girlando ,  Federico Giovanni Ziglioli ,  Alessandro Finocchiaro

IPC: H01L23/00 ,  H01L23/58 ,  G01R31/28 ,  H01L21/66

CPC classification number: H01L23/562 ,  G01R31/2872 ,  H01L21/76224 ,  H01L22/14 ,  H01L23/585 ,  H01L2924/0002 ,  H02J50/20 ,  H01L2924/00

Abstract: A method of making an integrated circuit (IC) includes forming circuitry over a top surface of a semiconductor substrate having the top surface and an opposite bottom surface. An antenna is formed in an interconnect layer formed above the semiconductor substrate, where the antenna is coupled to circuitry. A seal ring is formed around a periphery of the interconnect layer. The seal ring is disposed around the antenna and the circuitry. A trench with a solid-state insulating material is formed. The trench extends vertically into the semiconductor substrate and extends laterally across the IC.

公开(公告)号：US20150294946A1

公开(公告)日：2015-10-15

申请号：US14752006

申请日：2015-06-26

Applicant: STMicroelectronics S.r.I.

Inventor： Alberto Pagani ,  Giovanni Girlando

IPC: H01L23/64 ,  H01L23/66 ,  H01L23/522

CPC classification number: H01L25/0657 ,  G01R1/07314 ,  G01R31/3025 ,  H01L23/48 ,  H01L23/481 ,  H01L23/5227 ,  H01L23/645 ,  H01L23/66 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L25/16 ,  H01L28/10 ,  H01L29/82 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/0557 ,  H01L2224/13025 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29199 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/293 ,  H01L2224/29399 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06531 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01059 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19042 ,  H01L2924/207 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/2283 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q7/00 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05552

Abstract: An embodiment of an integrated electronic device having a body, made at least partially of semiconductor material and having a top surface, a bottom surface, and a side surface, and a first antenna, which is integrated in the body and enables magnetic or electromagnetic coupling of the integrated electronic device with a further antenna. The integrated electronic device moreover has a coupling region made of magnetic material, which provides, in use, a communication channel between the first antenna and the further antenna.

Abstract translation: 具有至少部分由半导体材料制成且具有顶表面，底表面和侧表面的主体的集成电子设备的实施例和集成在主体中并且能够进行磁耦合或电磁耦合的第一天线 具有另外的天线的集成电子设备。 集成电子设备还具有由磁性材料制成的耦合区域，其在使用中提供第一天线和另外的天线之间的通信信道。

公开(公告)号：US20150253268A1

公开(公告)日：2015-09-10

申请号：US14670613

申请日：2015-03-27

Applicant: STMICROELECTRONICS S.r.I.

Inventor： Giovanni Girlando ,  Michele Calabretta ,  Francesco Pappalardo

IPC: G01N27/00 ,  G01M5/00

CPC classification number: G01N27/02 ,  G01M5/0033 ,  G01M5/0083 ,  G01N27/00 ,  H04Q9/00 ,  H04Q2209/88

Abstract: A monitoring device is for a block of building material. The monitoring device may include an electric supply line configured to be buried in the block of building material and having a flexible main cable, and flexible jumper cables coupled to the flexible main cable and extending outwardly. The monitoring device may include sensor devices configured to be buried in the block of building material and coupled to respective ones of the flexible jumper cables. Each sensor device may include a primary inductor coupled to the electric supply line at a position based upon peaks of a stationary waveform when the electric supply line is alternating current (AC) powered, and a monitoring circuit. The monitoring circuit may include an integrated sensor, and a secondary inductor magnetically coupled to the primary inductor and configured to supply the integrated sensor, and communicate through the electric supply line.

Abstract translation: 监测装置用于建筑材料块。 监测装置可以包括被配置为埋在建筑材料块中并具有柔性主电缆的电源线，以及耦合到柔性主电缆并向外延伸的柔性跳线。 监测装置可以包括被配置为埋在建筑材料块中并耦合到柔性跳线电缆中相应的一个的传感器装置。 每个传感器装置可以包括在电源线是交流（AC）供电时基于静止波形的峰值的位置处耦合到电源线的主电感器和监视电路。 监控电路可以包括集成传感器，以及次级电感器，其磁耦合到主电感器并且被配置为提供集成传感器，并且通过电源线进行通信。