Abstract:
A phase change memory has an array formed by a plurality of cells, each including a memory element of calcogenic material and a selection element connected in series to the memory element; a plurality of address lines connected to the cells; a write stage and a reading stage connected to the array. The write stage is formed by current generators, which supply preset currents to the selected cells so as to modify the resistance of the memory element. Reading takes place in voltage, by appropriately biasing the selected cell and comparing the current flowing therein with a reference value.
Abstract:
A nonvolatile memory device is described comprising a memory array, a row decoder and a column selector for addressing the memory cells of the memory array, and a biasing stage for biasing the array access device terminal of the addressed memory cell. The biasing stage is arranged between the column selector and the memory array and comprises a biasing transistor having a drain terminal connected to the column selector, a source terminal connected to the array access device terminal of the addressed memory cell, and a gate terminal receiving a logic driving signal, the logic levels of which are defined by precise and stable voltages and are generated by a logic block and an output buffer cascaded together. The output buffer may be supplied with either a read voltage or a program voltage supplied by a multiplexer. The biasing transistor may be either included as part of the column selector and formed by the selection transistor which is closest to the addressed memory cell or distinct from the selection transistors of the column selector.
Abstract:
A contact structure for a PCM device is formed by an elongated formation having a longitudinal extension parallel to the upper surface of the body and an end face extending in a vertical plane. The end face is in contact with a bottom portion of an active region of chalcogenic material so that the dimensions of the contact area defined by the end face are determined by the thickness of the elongated formation and by the width thereof.
Abstract:
The phase-change nonvolatile memory array is formed by a plurality of memory cells extending in a first and in a second direction orthogonal to each other. A plurality of column-selection lines extend parallel to the first direction. A plurality of word-selection lines extend parallel to the second direction. Each memory cell includes a PCM storage element and a selection transistor. A first terminal of the selection transistor is connected to a first terminal of the PCM storage element, and the control terminal of the selection transistor is connected to a respective word-selection line. A second terminal of the PCM storage element is connected to a respective column-selection line, and a second terminal of the selection transistor is connected to a reference-potential region while reading and programming the memory cells.
Abstract:
A charge pump circuit, connected between a first voltage reference and an output terminal, comprises at least two stages comprising an elementary charge pump circuit connected between said first voltage reference and said output terminal, and adjustment circuitry connected between said output terminal and respective control terminals of said at least two stages. This circuitry is arranged to select for actuation an appropriate combination of these elementary stages according to the current absorbed from a load connected to the output terminal.
Abstract:
A phase change memory includes a temperature sensor having a resistance variable with temperature with the same law as a phase-change storage element. The temperature sensor is formed by a resistor of chalcogenic material furnishing an electrical quantity that reproduces the relationship between the resistance of a phase change memory cell and temperature; the electrical quantity is processed so as to generate reference quantities as necessary for writing and reading the memory cells. The chalcogenic resistor has the same structure as a memory cell and is programmed with precision, preferably in the reset state.
Abstract:
Described herein is a nonvolatile memory comprising a memory array organized according to global word lines and local word lines; a global row decoder; a local row decoder; a first supply stage for supplying the global row decoder; and a second supply stage for supplying the local row decoder; and a third supply stage for biasing the drain and source terminals of the memory cells of the memory array. Each of the supply stages comprises a respective resistive divider formed by a plurality of series-connected resistors, and a plurality of pass-gate CMOS switches each connected in parallel to a respective resistor. The nonvolatile memory further comprises a control circuit for controlling the pass-gate CMOS switches of the supply stages, and a switching circuit for selectively connecting the supply input of the control circuit to the output of the second supply stage during reading and programming of the memory, and to the output of the third supply stage during erasing of the memory.
Abstract:
An analog-to-digital conversion method and device for a multilevel non-volatile memory devicethat includes a multilevel memory cell. The method comprises a first step of converting the most significant bits contained in the memory cell, followed by a second step of converting the least significant bits. The first step is completed within a time interval corresponding to the rise transient of the gate voltage, and the second step is initiated at the end of the transient. Also disclosed is a scheme for error control coding in multilevel Flash memories. The n bits stored in a single memory cell are organized in different nullbit-layersnull, which are independent from one another. Error correction is carried out separately for each bit-layer. The correction of any failure in a single memory cell is achieved by using a simple error control code providing single-bit correction, regardless of the number of bits stored in a single cell.
Abstract:
The device includes a circuit for sector remapping having a CAM (Content Addressable Memory) unit, associated to and in data communication with a multiplexer unit. The CAM unit detects that a sector is defective, it provides the pre-programmed address of a replacing sector and it activates the multiplexer which performs the replacement. The defective sectors and the corresponding locations of the address map are therefore advantageously positioned to the rear to the addressing area. The addressing area is consequently continuous, thus allowing the information to be easily stored and retrieved.