公开(公告)号：US20240047319A1

公开(公告)日：2024-02-08

申请号：US18125348

申请日：2023-03-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jongho PARK ,  Gyuho Kang ,  Sung Keun Park ,  Seong-Hoon Bae ,  Jaemok Jung ,  Ju-ll Choi

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  H01L25/10 ,  H01L21/48 ,  H01L21/56 ,  H01L25/00

CPC classification number: H01L23/49811 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/105 ,  H01L21/4853 ,  H01L21/563 ,  H01L25/50 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/48227 ,  H01L24/48

Abstract: A semiconductor package includes a first substrate, a semiconductor chip on the first substrate, a second substrate spaced apart from the first substrate, a wire spaced apart from a lateral surface of the semiconductor chip and connecting the first substrate to the second substrate, a mold structure on a top surface of the semiconductor chip, the lateral surface of the semiconductor chip, and a lateral surface of the wire, and an under-fill pattern on the lateral surface of the wire and is between the wire and the mold structure.

公开(公告)号：US20220068904A1

公开(公告)日：2022-03-03

申请号：US17220468

申请日：2021-04-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongho PARK ,  Seung Hwan KIM ,  Jun Young OH ,  Jungjoo KIM ,  Yongkwan LEE ,  Dong-Ju JANG

IPC: H01L25/18 ,  H01L23/538 ,  H01L25/00

Abstract: A semiconductor package includes a first substrate that includes a first trench on a recessed portion of a bottom surface of the first substrate and a first through hole extending through the first substrate to the first trench, a first semiconductor chip on the first substrate, a first capacitor chip in the first trench and on the first substrate, and a first molding layer on the first substrate and covering the first semiconductor chip. The first molding layer includes a first part that extends parallel to a top surface of the first substrate, a second part connected to the first part and extending vertically in the first through hole, and a third part connected to the second part and surrounding the first capacitor chip. A bottom surface of the third part is coplanar with the bottom surface of the first substrate.

公开(公告)号：US20210375831A1

公开(公告)日：2021-12-02

申请号：US17399233

申请日：2021-08-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jongho PARK ,  Kyungsuk OH ,  Hyunki KIM ,  Yongkwan LEE ,  Sangsoo KIM ,  Seungkon MOK ,  Junyoung OH ,  Changyoung YOO

IPC: H01L25/065 ,  H01L23/16 ,  H01L23/31 ,  H01L23/00 ,  H01L23/498

Abstract: A semiconductor package including a circuit substrate including a plurality of interconnections; a first chip on the circuit substrate; a second chip stacked on the first chip; a plurality of first pads on the circuit substrate, the plurality of first pads overlapping the first chip; a plurality of bumps between the circuit substrate and the first chip; a plurality of second pads on an edge portion of a first side of the circuit substrate, the plurality of second pads electrically connected to the second chip through a conductive wire; an underfill that fills a space between the circuit substrate and the first chip; and a first dam on the circuit substrate, the first dam overlapping the first chip. The first dam includes a conductive material and overlaps at least one of the plurality of interconnections.

公开(公告)号：US20210091805A1

公开(公告)日：2021-03-25

申请号：US17030288

申请日：2020-09-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongho PARK ,  Yongbin YOON ,  Hyunsoo KIM ,  Youngjun PARK ,  Hyangbok LEE ,  Hyungjoon YU ,  Youngkwon LEE

IPC: H04B1/04 ,  H04B17/10

Abstract: Various embodiments of an electronic device for matching an antenna impedance may include an antenna, a wireless communication module, an impedance matching module, and at least one processor, wherein the at least one processor is configured to: select a first index corresponding to an impedance of the antenna among a plurality of sampled indexes through a first measurement in which a tuning code of the impedance matching module is configured as a reference code; identify a use environment corresponding to the first index; select a second index corresponding to the impedance of the antenna among the plurality of sampled indexes through a second measurement in which the tuning code of the impedance matching module is configured as the reference code and as a ground code corresponding to the use environment; and adjust the impedance of the antenna based on a tuning code corresponding to the second index.

公开(公告)号：US20250038081A1

公开(公告)日：2025-01-30

申请号：US18734529

申请日：2024-06-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongho PARK ,  Unbyoung KANG ,  Seonghoon BAE ,  Jaemok JUNG ,  Juil CHOI ,  Taeoh HA

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L23/36

Abstract: A semiconductor package includes a lower redistribution wiring layer having a first region and a second region and including first redistribution wirings, a semiconductor chip disposed on the first region of the lower redistribution wiring layer, a molding member covering the semiconductor chip on the lower redistribution wiring layer, a plurality of vertical conductive structures penetrating the molding member on the second region of the lower redistribution wiring layer, electrically connected to the first redistribution wirings, and including first conductive pillars and second conductive pillars stacked on the first conductive pillars respectively, and an upper redistribution wiring layer disposed on the molding member and having second redistribution wirings electrically connected to the plurality of vertical conductive structures. Each of the first conductive pillars has a first length and each of the second conductive pillars has a second length greater than the first length.

公开(公告)号：US20240213223A1

公开(公告)日：2024-06-27

申请号：US18516367

申请日：2023-11-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaemok JUNG ,  Dowan KIM ,  Sungkeun PARK ,  Jongho PARK ,  Juil CHOI

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/522

CPC classification number: H01L25/0657 ,  H01L23/3107 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/5226 ,  H01L24/08 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/08056 ,  H01L2224/08245 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/06544 ,  H01L2924/181

Abstract: A semiconductor package includes a first redistribution wiring layer having a first region and a second region surrounding the first region, a semiconductor chip disposed on the first region of the first redistribution wiring layer, a sealing member covering the semiconductor chip on the first redistribution wiring layer, vertical conductive wires penetrating the sealing member on the second region of the first redistribution wiring layer, a second redistribution wiring layer disposed on the sealing member and including second redistribution wirings electrically connected to the vertical conductive wires, and bonding pads provided on an upper surface of the first redistribution wiring layer or a lower surface of the second redistribution wiring layer, each bonding pad having a concavo-convex pattern on an upper surface of the bonding pad. The vertical conductive wires are bonded to the concavo-convex patterns of the bonding pads, respectively.

公开(公告)号：US20240079394A1

公开(公告)日：2024-03-07

申请号：US18366054

申请日：2023-08-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Juil CHOI ,  Jongho PARK ,  Sanghyuck OH ,  Jaeyoung LEE ,  Jaemok JUNG ,  Hongseo HEO

IPC: H01L25/10 ,  H01L23/00 ,  H01L23/31 ,  H01L23/373 ,  H01L23/48 ,  H01L23/498 ,  H10B80/00

CPC classification number: H01L25/105 ,  H01L23/3128 ,  H01L23/3736 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49822 ,  H01L24/16 ,  H01L24/32 ,  H10B80/00 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204

Abstract: A semiconductor package may include a first redistribution structure, a first semiconductor chip on the first redistribution structure, a first molding layer covering the first semiconductor chip, first connection structures on the first redistribution structure and extending in a vertical direction while passing through the first molding layer, a second redistribution structure on the first semiconductor chip, a second semiconductor chip on the second redistribution structure, and a metal layer on the second semiconductor chip. The metal layer may be in contact with an upper surface of the second semiconductor chip.

公开(公告)号：US20230060115A1

公开(公告)日：2023-02-23

申请号：US17723552

申请日：2022-04-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sechul PARK ,  Unbyoung KANG ,  Heewon KIM ,  Jongho PARK ,  Hyojin YUN ,  Juil CHOI

IPC: H01L23/00 ,  H01L25/065

Abstract: A semiconductor package includes a first semiconductor chip on a base chip, a second semiconductor chip on the first semiconductor chip in a first direction, each of the first and second semiconductor chips including a TSV and being electrically connected to each other via the TSV, dam structures on the base chip and surrounding a periphery of the first semiconductor chip, a first adhesive film between the base chip and the first semiconductor chip, a portion of the first adhesive film filling a space between the first semiconductor chip and the dam structures, a second adhesive film between the first semiconductor chip and the second semiconductor chip, a portion of the second adhesive film overlapping the dam structures in the first direction, and an encapsulant encapsulating a portion of each of the dam structures, the first semiconductor chip, and the second semiconductor chip.

公开(公告)号：US20210030290A1

公开(公告)日：2021-02-04

申请号：US16964087

申请日：2019-01-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hansung LEE ,  Hwan SHIM ,  Yongjin LEE ,  Jooman HAN ,  Jongho PARK ,  Gahee JUNG ,  Seounghun KIM ,  Jihwan KIM ,  Choonghee AHN ,  Hyungjoon LIM ,  Jiwoon JUNG ,  Jeongmin PARK

IPC: A61B5/024 ,  A61B5/00 ,  A61B5/0255 ,  G16H40/67

Abstract: An electronic device is disclosed. According to an embodiment disclosed herein, an electronic device may include a PPG sensor including a light emitter that applies a current in a specified range and emits a light signal corresponding to the current and a light detector that amplifies a received light signal by applying one of a plurality of gain values, a memory that stores a plurality of sets of PPG models corresponding to the plurality of gain values and including a current value and PPG level data corresponding to the current value, and at least one processor electrically connected to the PPG sensor and the memory, wherein the at least one processor may acquire a first PPG signal from the PPG sensor set with a first current value satisfying the specified range and a first gain value of the plurality of gain values when a user's contact is detected by the PPG sensor, generate a first PPG model corresponding to the user based on a first PPG model set corresponding to the first gain value among the plurality of sets of PPG models, the first current value and the first PPG signal, determine a second gain value and a second current value for acquiring a PPG signal with a specified PPG level, based at least on the first PPG model set, and acquire a second PPG signal with the specified PPG level using the PPG sensor set with the second gain value and the second current value. In addition, various embodiments understood from the specification are possible.

公开(公告)号：US20240106488A1

公开(公告)日：2024-03-28

申请号：US18526774

申请日：2023-12-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongbeen YUN ,  Joongkwon KIM ,  Jongho PARK ,  Wonhyung HEO

IPC: H04B1/40

CPC classification number: H04B1/40

Abstract: According to various embodiments, an electronic device may include: an antenna, an antenna tuner, a transceiver, a power amplifier electrically connected to the antenna tuner and configured to perform power amplification according to an execution of impedance matching, and at least one processor operatively connected to the transceiver, the antenna tuner, and the power amplifier. The at least one processor may be configured to: configure a reference tuner code for the antenna tuner connected to the antenna in a signal path of the transceiver and identify a reflection coefficient of the antenna, calculate a tuner code of the antenna tuner based on whether the identified reflection coefficient of the antenna has been changed and an operation of at least one component of the antenna tuner, and perform the impedance matching of the antenna.