Three-dimensional semiconductor memory device

    公开(公告)号:US11515325B2

    公开(公告)日:2022-11-29

    申请号:US17025479

    申请日:2020-09-18

    Abstract: A three-dimensional semiconductor memory device may include a peripheral circuit structure including transistors on a first substrate, and a cell array structure on the peripheral circuit structure, the cell array structure including: a first stack structure block comprising first stack structures arranged side by side in a first direction on a second substrate, a second stack structure block comprising second stack structures arranged side by side in the first direction on the second substrate, a separation structure disposed on the second substrate between the first stack structure block and the second stack structure block and comprising first mold layers and second mold layers, and a contact plug penetrating the separation structure. The cell array structure may include a first metal pad and the peripheral circuit structure may include a second metal pad. The first metal pad may be in contact with the second metal pad.

    Method and apparatus for providing vibration in electronic device

    公开(公告)号:US11198154B2

    公开(公告)日:2021-12-14

    申请号:US16488507

    申请日:2018-02-22

    Abstract: Disclosed are a method and an apparatus for converting a musical element so as to provide a vibration in an electronic device. According to various embodiments of the present invention, an electronic device may comprise: a display; a vibration generation apparatus for generating a vibration; and a processor functionally connected to the display and the vibration generation apparatus, wherein the processor is configured to: select multiple frequencies, using a musical element; set at least one vibration on the basis of the selected multiple frequencies; and generate a vibration pattern on the basis of the set vibration. Various elements are possible.

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