公开(公告)号：US20250140577A1

公开(公告)日：2025-05-01

申请号：US18926562

申请日：2024-10-25

Applicant: SEMES CO., LTD.

Inventor： Ju Yeon SONG ,  Sang Min LEE

IPC: H01L21/67

Abstract: Disclosed is a substrate treating apparatus including: a chamber providing a treatment space therein; a substrate support member located inside the chamber and for supporting a substrate; a supply port for supplying a treatment fluid into the treatment space of the chamber; a filler member located between the supply port and the substrate to fill a portion of a volume of the treatment space, in which the filler member has perforations, and the perforations are provided in a collision shape such that treatment fluids passing through the perforations collide each other.

公开(公告)号：US20220305536A1

公开(公告)日：2022-09-29

申请号：US17667459

申请日：2022-02-08

Applicant: SEMES CO., LTD.

Inventor： Sang Min LEE ,  Seung Hoon OH ,  Yong Joon IM ,  Hyo Won YANG

IPC: B08B13/00 ,  B08B3/04 ,  F26B5/00

Abstract: A substrate processing apparatus includes a process chamber including a first body and a second body that are coupled to each other to form a processing space therein, a clamping member configured to clamp the first body and the second body, and an anti-friction member mounted in a groove formed in a contact region between the first body or the second body and the clamping member.

公开(公告)号：US20220165606A1

公开(公告)日：2022-05-26

申请号：US17529649

申请日：2021-11-18

Applicant: SEMES CO., LTD.

Inventor： Sang Min LEE ,  Do Hyeon YOON

IPC: H01L21/687

Abstract: The present invention provides an apparatus for treating a substrate, including: a process chamber including a first body and a second body which are combined with each other to form a treatment space for treating a substrate is treated therein; a driver which moves the process chamber to an open position or a close position; a support unit which supports a substrate within the treatment space; and a fluid supply unit which supplies a fluid to the treatment space, in which the support unit includes: a support pin coupled to the first body or the second body; and a guide member which is coupled to the support pin and extends in a lateral direction of the support pin to support the substrate.

公开(公告)号：US20250006517A1

公开(公告)日：2025-01-02

申请号：US18672290

申请日：2024-05-23

Applicant: Semes Co., Ltd

Inventor： Sang Min LEE ,  Jong Doo LEE ,  Ju Yeon SONG

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/687

Abstract: Disclosed is a manufacturing method of a semiconductor device. The manufacturing method may include: a closing operation of seating a substrate on a support member provided in a chamber, and closing the chamber to seal a treating space provided by the chamber; a clamping operation of clamping the chamber by moving a clamping body in a direction facing the chamber after the closing operation; a close-contact operation of making the chamber be in contact with the clamping body after the clamping operation; and a substrate processing operation of drying the substrate by supplying supercritical fluid into the treating space.

公开(公告)号：US20230129923A1

公开(公告)日：2023-04-27

申请号：US17971734

申请日：2022-10-24

Applicant: SEMES CO., LTD.

Inventor： Jin Woo JUNG ,  Jin Mo JAE ,  Sang Min LEE ,  Young Hun LEE ,  Yong Hyun CHOI ,  Yong Joon IM ,  Seung Hoon OH

IPC: H01L21/687 ,  H01L21/67 ,  B08B3/04 ,  B08B13/00

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a housing for providing a treating space for treating a substrate within; a support unit for supporting the substrate in the treating space; a bottom supply port for supplying a process fluid to the treating space; and a filler member positioned below the substrate supported on the support unit in the treating space, and wherein the filler member forms a buffer space facing the bottom supply port, and a passage is formed between the filler member and an inner wall of the housing and flows the process fluid which is introduced to the buffer space in a direction of the substrate.

公开(公告)号：US20220205782A1

公开(公告)日：2022-06-30

申请号：US17560390

申请日：2021-12-23

Applicant: SEMES CO., LTD.

Inventor： Young Seop CHOI ,  Yong-Jun SEO ,  Sang Hyun SON ,  Sang Min LEE ,  Jong Hyeon WOO ,  Hwan Bin KIM

IPC: G01C9/02 ,  G01P15/18 ,  G01P15/08 ,  G01C19/00

Abstract: A substrate type sensor provided in an atmosphere accompanied by a temperature change to measure a horizontality of a support member that supports a substrate is disclosed. The substrate type sensor may include a base having a shape of the substrate, one or more sensors provided in the base and including 3 or more axis acceleration sensors or 6 or more axis measurement units (IMUs), a receiver configured to receive data collected by the one or more sensors and a power source configured to provide electric power to the one or more sensors and the receiver.

公开(公告)号：US20230046276A1

公开(公告)日：2023-02-16

申请号：US17884709

申请日：2022-08-10

Applicant: SEMES CO., LTD.

Inventor： Sang Min LEE ,  Woo Jin CHUNG ,  Ki Bong KIM

IPC: B05C5/02 ,  B05C11/10

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber providing a treating space; and a fluid supply unit supplying a treating fluid to the chamber, and wherein the fluid supply unit includes: a supply tank storing the treating fluid; a supply line connecting the supply tank and the chamber; and a plurality of valves installed at the supply line, and wherein any one valve among the plurality of valves is provided as a safety valve, and wherein the safety valve is opened after confirming that the chamber has been switched to a closed state when supplying the treating fluid from a tank to the chamber.

公开(公告)号：US20220381509A1

公开(公告)日：2022-12-01

申请号：US17825275

申请日：2022-05-26

Applicant: SEMES CO., LTD.

Inventor： Yong Joon IM ,  Sang Min LEE ,  Jong Doo LEE ,  Jin Se PARK

IPC: F26B5/00

Abstract: The present invention provides a substrate treating apparatus, including: a housing including a first body and a second body which are combined with each other to provide a treatment space in which a substrate is treated; an actuator which moves the second body in a vertical direction with respect to the first body to seal or open the treatment space; and a pipe which is coupled with the second body and in which a fluid flows, in which the pipe is a stretchable pipe that is stretchable and contractible according to the vertical movement of the second body.

公开(公告)号：US20240170304A1

公开(公告)日：2024-05-23

申请号：US18515611

申请日：2023-11-21

Applicant: SEMES CO., LTD.

Inventor： Ho Jong HWANG ,  Hyun Goo PARK ,  Hyo Won YANG ,  Ki-Moon KANG ,  Sang Min LEE ,  Se Hoon OH ,  Won Sik SON

IPC: H01L21/67

CPC classification number: H01L21/67017 ,  H01L21/67109

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes treating modules having an opening for taking in and taking out a substrate and which are stacked on each other; and an air flow generating member for generating a downward airflow at each treating module, and wherein the air flow generating member includes: a pan unit configured to supply an air; a spray unit configured to be provided above the treating module and which sprays an air supplied from the pan unit; and an exhaust unit configured to exhaust an air sprayed by the spray unit to outside of the treating module.

公开(公告)号：US20230111149A1

公开(公告)日：2023-04-13

申请号：US17957428

申请日：2022-09-30

Applicant: SEMES CO., LTD.

Inventor： Sang Min LEE ,  Jin Se PARK ,  Ki Hoon CHOI

IPC: H01L21/67 ,  G01N1/10

Abstract: Provided is a concentration measuring apparatus, which measures a concentration of a fluid under a high-pressure environment, such as an environment in which a supercritical fluid is provided. The concentration measuring apparatus includes: a concentration meter for measuring a concentration of a first fluid contained in a fluid in the measurement line; a sampling line for transferring a process fluid of a processing space in which a substrate is treated in a high-pressure environment to the measurement line; a control valve for opening and closing the sampling line; a fluid pressure regulator installed downstream the control valve in the sampling line and configured to adjust the passing fluid to a set pressure; and a decompression tank installed between the sampling line and the measurement line.