摘要:
A latch-up protection circuit for an integrated circuit powered through a first power rail and a second power rail is disclosed, the integrated circuit having at least one semiconductor bulk of a conductivity type. The latch-up protection circuit comprises a control circuit and a switch circuit. The control circuit is connected to the first power rail and the second power rail for detecting a relative voltage therebetween and generating a first control signal and a second control signal. The switch circuit connected to the first power rail and the control circuit. When the relative voltage is greater than a first predetermined value, the switch circuit in response to the first control signal electrically connects the first power rail with the at least one semiconductor bulk. When the relative voltage is smaller than the first predetermined value, the switch in response to the first control signal electrically disconnects the first power rail from the at least one semiconductor bulk.
摘要:
An apparatus and method for use in a semiconductor memory device to reduce internal circuit damage resulting from the effects of electro-static discharge (ESD) on a bitline pull-up or other type of circuit. Each of a plurality of bitlines in the memory device are coupled to a source terminal of a corresponding N-type MOSFET. Each source terminal is formed in a separate corner portion of at least one active region of the memory device, and is coupled to a given bitline via a bitline contact arranged in the corner portion. Each drain terminal of the N-type MOSFETS is formed from another portion of the active region and is coupled to a VDD supply of the memory device via a VDD contact. A gate terminal of a given MOSFET is formed from a polysilicon gate region overlying a channel in the active region. The gate region has an approximately 90.degree. bend therein such that a bitline contact in the corresponding corner portion of the active region is located between the bend and an outer peripheral edge of the corner portion. This layout allows the contact-to-diffusion-edge and contact-to-gate-edge spacings of the VDD contacts to be increased such that internal circuit ESD immunity of the memory device is improved without impacting device dimension and layout area constraints.
摘要:
In a multiple-supply CMOS IC, if VDDH is applied slower than VDDL during powering up, some diffusion junctions normally reversed-biased may momentarily become forward-biased and produce latch-up to produce permanent damage to circuits. Therefore a protection circuit against latch-up in a multiple-supply IC is provided. The protection circuit comprises an N-channel MOSFET, which has its gate connected to the high-voltage bus, its drain connected to the low-voltage supply, and its source connected to the low-voltage bus to control the power-up sequence of high voltage and low voltage for the multiple-supply IC and to prevent latch-up. The N-channel MOSFET can be of different modes, such as enhancement mode, depletion mode or enhancement mode having a low threshold voltage.
摘要:
A high-voltage tolerance input buffer and a high-voltage ESD protection circuit connected to a pad of an integrated circuit for preventing rapid gate oxide aging. The high-voltage tolerance input buffer of the present invention comprises a voltage-sharing circuit and a switch circuit, wherein the voltage-sharing circuit is connected between the pad and a power rail and generates a reference voltage not higher than the voltage of the pad. The switch circuit is connected to the voltage-sharing circuit and comprises a control gate to control the switching operation of the switch circuit according to the reference voltage. The present invention can be implemented to solve the rapid gate oxide aging problem without incurring any change in the original process flow by employing a voltage-sharing circuit.
摘要:
A system and method for controlling an input/output driver. The system includes a control system configured to receive a first supply voltage and a second supply voltage and generate a control signal, and a first transistor including a first gate, a first terminal, and a second terminal. The first gate is configured to receive the control signal, and the first terminal is configured to receive the first supply voltage. Additionally, the system includes a second transistor including a second gate, a third terminal, and a fourth terminal, and the second gate is coupled to the second terminal. Moreover, the system includes a third transistor including a third gate, a fifth terminal, and a sixth terminal, and the third gate is configured to receive the control signal. Also, the system includes an input/output pad coupled to the fourth terminal and the fifth terminal.
摘要:
A novel device structure and process are described for an SCR ESD protection device used with shallow trench isolation structures. The invention incorporates polysilicon gates bridging SCR diode junction elements and also bridging between SCR elements and neighboring STI structures. The presence of the strategically located polysilicon gates effectively counters the detrimental effects of non-planar STI “pull down” regions as well as compensating for the interaction of silicide structures and the effective junction depth of diode elements bounded by STI elements. Connecting the gates to appropriate voltage sources such as the SCR anode input voltage and the SCR cathode voltage, typically ground, reduces normal operation leakage of the ESD protection device.
摘要:
A method for forming an electrical metal fuse for use with a semiconductor integrated circuit device. At least two varying trench metal depths may be formed on a substrate to configure the electrical metal fuse thereon. Additionally, at least two different widths of single metal lines, may be configured on the substrate. As a result of the two different trench depths and two different widths of metal formed thereon to create the electrical metal fuse, increases in current density gradients and thermal gradients thereof can be generated. The trench metal depths and width of metal are formed from copper. The electrical metal fuse generally comprises a current density ratio greater than 10 to 1.
摘要:
The present invention provides an ESD protection circuit having at least one semiconductor-controlled rectifier and a diode. The SCR having a floating anode gate is connected between a first circuit node a second circuit node. The diode is connected between an anode and a cathode gate of the SCR to activate the SCR so that a potential between the first circuit node and second circuit node can be clamped at about a holding voltage of the SCR during an ESD event.
摘要:
An integrated circuit package includes a semiconductor chip, a plurality of wired pins, and at least one non-wired pin. The size of the non-wired pin is minimized, or the non-wired pin is eliminated, in order to increase the lead pin spacing. The increase in lead pin spacing prevents electrostatic discharge failure in an integrated circuit package due to electrostatic stressing of the non-wired pin.
摘要:
A diode structure compatible with silicide processes for electrostatic discharge protection is disclosed. The diode structure comprises a semiconductor layer of a first conductivity type, a diffusion region of a second conductivity type formed in the semiconductor layer, and a doped region of the second conductivity type formed in the semiconductor layer around the diffusion region. The doped region has a doping concentration less than that of the diffusion region to provide a ballastic resistance under a high current stressing condition.