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    Probe head for electronic devices and corresponding probe card
    1.
    发明授权
    Probe head for electronic devices and corresponding probe card 有权

    公开(公告)号：US12032003B2

    公开(公告)日：2024-07-09

    申请号：US17591363

    申请日：2022-02-02

    Applicant: Technoprobe, S.p.A.

    Inventor： Roberto Crippa

    IPC: G01R1/073 ,  G01R1/067

    CPC classification number: G01R1/07357 ,  G01R1/06738 ,  G01R1/07378

    Abstract: A probe head for a test equipment of electronic devices comprises a plurality of contact probes inserted in guide holes provided in at least one upper guide and one lower guide, a bending area for the contact probes being defined between the upper and lower guides, each contact probe having at least one first terminal portion which protrudes of a first length from the lower guide and ends with a contact tip (22A) adapted to abut onto a respective contact pad of a device to be tested, as well as a second terminal portion which protrudes of a second length from the upper guide and ends with a contact head adapted to abut onto a contact pad of a board for connecting or interfacing with the test equipment, suitably comprising at least one protection structure projecting from the upper guide in direction of a longitudinal development axis of the contact probes towards the board, the protection structure thus extending in correspondence of the contact heads of the contact probes.

    Vertical probe testing head with improved frequency properties
    5.
    发明授权
    Vertical probe testing head with improved frequency properties 有权

    公开(公告)号：US11029337B2

    公开(公告)日：2021-06-08

    申请号：US16550089

    申请日：2019-08-23

    Applicant: TECHNOPROBE S.P.A.

    Inventor： Roberto Crippa ,  Raffaele Vallauri

    IPC: G01R1/073 ,  G01R1/04 ,  G01R3/00

    Abstract: A testing head comprises at least one guide provided with a plurality of guide holes, and a plurality of contact elements housed in the plurality of guide holes. Suitably, the at least one guide comprises a plurality of conductive layers, each conductive layer: including holes of a corresponding plurality of group of the plurality of guide holes and electrically connecting a corresponding group of contact elements housed in the guide holes of the group, contact elements of a group being adapted to carry a same type of signal. The at least one guide is a multilayer comprising a plurality of non-conductive layers, and the conductive layers are arranged on respective faces of a layer of the plurality of non-conductive layers.

    Testing head of electronic devices
    6.
    发明授权
    Testing head of electronic devices 有权

    公开(公告)号：US09829508B2

    公开(公告)日：2017-11-28

    申请号：US14791012

    申请日：2015-07-02

    Applicant: TECHNOPROBE S.p.A.

    Inventor： Stefano Felici ,  Raffaele Vallauri ,  Roberto Crippa

    IPC: G01R31/20 ,  G01R1/073

    CPC classification number: G01R1/07321 ,  G01R1/07357

    Abstract: It is described a testing head for a testing equipment of an electronic device comprising at least one upper guide and a lower guide provided with guide holes, a plurality of contact probes inserted into the guide holes of the upper and lower guides and at least one containment element of the probes being is disposed between the upper and lower guides, each of the contact probes having at least one terminal portion which ends with a contact tip adapted to abut on a respective contact pad of the electronic device to be tested; at least one spacer element sandwiched between the containment element and at least one of the upper and lower guides, the spacer element being removable to adjust a length of the terminal portions of the contact probes projecting from the lower guide.

    TESTING HEAD OF ELECTRONIC DEVICES
    8.
    发明申请
    TESTING HEAD OF ELECTRONIC DEVICES 有权
    电子设备测试头

    公开(公告)号：US20150309076A1

    公开(公告)日：2015-10-29

    申请号：US14791012

    申请日：2015-07-02

    Applicant: TECHNOPROBE S.p.A.

    Inventor： Stefano Felici ,  Raffaele Vallauri ,  Roberto Crippa

    IPC: G01R1/073

    CPC classification number: G01R1/07321 ,  G01R1/07357

    Abstract: It is described a testing head for a testing equipment of an electronic device comprising at least one upper guide and a lower guide provided with guide holes, a plurality of contact probes inserted into the guide holes of the upper and lower guides and at least one containment element of the probes being is disposed between the upper and lower guides, each of the contact probes having at least one terminal portion which ends with a contact tip adapted to abut on a respective contact pad of the electronic device to be tested; at least one spacer element sandwiched between the containment element and at least one of the upper and lower guides, the spacer element being removable to adjust a length of the terminal portions of the contact probes projecting from the lower guide.

    Abstract translation: 描述了一种用于电子设备的测试设备的测试头，其包括至少一个上引导件和设置有引导孔的下引导件，插入到上引导件和下引导件的引导孔中的多个接触探针和至少一个容纳件 探针的元件设置在上引导件和下引导件之间，每个接触探针具有至少一个末端部分，端接部分以接触末端为末端，接触头部适于邻接待测试的电子设备的相应接触焊盘; 夹在所述容纳元件与所述上导向件和所述下导向件中的至少一个之间的至少一个间隔元件，所述间隔元件可移除以调节从所述下引导件突出的所述接触探针的端子部分的长度。

    Probe head for reduced-pitch applications
    9.
    发明授权
    Probe head for reduced-pitch applications 有权

    公开(公告)号：US11953522B2

    公开(公告)日：2024-04-09

    申请号：US17783440

    申请日：2020-12-17

    Applicant: TECHNOPROBE S.P.A.

    Inventor： Roberto Crippa ,  Stefano Felici

    IPC: G01R1/073 ,  G01R1/067 ,  G01R31/28

    CPC classification number: G01R1/0735 ,  G01R1/06744 ,  G01R1/06755 ,  G01R1/07357 ,  G01R1/07378 ,  G01R31/2889

    Abstract: A probe head for a testing apparatus integrated on a semiconductor wafer is disclosed having a first plurality of contact probes having a first transversal diameter, a second plurality of micro contact probes having a second transversal diameter, smaller than the first transversal diameter, and a flexible membrane having conductive tracks for connecting a first plurality contact probe with a corresponding second plurality micro contact probe. The second plurality contact probes are arranged between the testing apparatus and the flexible membrane, and the second plurality micro contact probes are arranged between the flexible membrane and a semiconductor wafer. The second plurality micro contact probes are configured to abut onto contact pads of a device under test integrated in the semiconductor wafer, with each first plurality contact probe being in contact with a corresponding second plurality micro contact probe through a conductive track of the flexible membrane to connect the device under test with the testing apparatus.

    TESTING HEAD WITH IMPROVED FREQUENCY PROPERTY
    10.
    发明公开
    TESTING HEAD WITH IMPROVED FREQUENCY PROPERTY 审中-公开

    公开(公告)号：US20230324438A1

    公开(公告)日：2023-10-12

    申请号：US18334283

    申请日：2023-06-13

    Applicant: TECHNOPROBE S.p.A.

    Inventor： Roberto Crippa ,  Flavio Maggioni

    IPC: G01R1/073 ,  G01R1/067

    CPC classification number: G01R1/07371 ,  G01R1/06761

    Abstract: A testing head comprises a plurality of contact probes, and a guide having a plurality of guide holes for housing the contact probes and including a conductive portion. Each contact probe includes a first end region and a second end region, and a body which extends between the first and second end regions. Suitably, the conductive portion includes a group of the guide holes and electrically connects contact probes of a first group of the contact probes. The contact probes of the first group slide in the guide holes in the conductive portion and are adapted to carry a same signal, and each contact probe of a second group of the plurality of contact probes is surrounded by an insulating coating layer that extends along the body of each contact probe of the second group, thereby insulating the contact probes of the second group from the conductive portion.

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