公开(公告)号：US10391608B2

公开(公告)日：2019-08-27

申请号：US15855839

申请日：2017-12-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Hung Chen ,  Chia-Jung Hsu ,  Yi-An Lin

IPC: B24B37/30 ,  B24B37/10 ,  H01L21/67 ,  H01L21/02 ,  H01L21/321 ,  H01L21/673 ,  H01L21/683 ,  B24B37/04

Abstract: A wafer polishing apparatus is described herein. The wafer polishing apparatus includes a polish module configured to apply air pressure to a first surface of a wafer while performing a polishing process on a second surface of the wafer. In some implementations, the polish module is further configured to perform a cleaning process and/or a drying process on the second surface of the wafer, such that the same wafer polishing apparatus is configured to perform the polishing process, the cleaning process, and/or the drying process. In some implementations, the polishing module is further configured to air seal edges of the wafer during the polishing process, the cleaning process, and/or the drying process.

公开(公告)号：US09865477B2

公开(公告)日：2018-01-09

申请号：US15052310

申请日：2016-02-24

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Hung Chen ,  Chia-Jung Hsu ,  Yi-An Lin

IPC: H01L21/321 ,  H01L21/02 ,  H01L21/683 ,  H01L21/673

CPC classification number: H01L21/32115 ,  B24B37/00 ,  H01L21/02013 ,  H01L21/02016 ,  H01L21/02054 ,  H01L21/0209 ,  H01L21/3212 ,  H01L21/673 ,  H01L21/683

Abstract: The present disclosure provides a semiconductor fabrication apparatus in accordance with one embodiment. The apparatus includes a wafer stage that is operable to secure and rotate a wafer; a polish head configured to polish a backside surface of the wafer; an air bearing module configured to apply an air pressure to a front surface of the wafer; and an edge sealing unit configured to seal edges of the wafer.

公开(公告)号：US10201887B2

公开(公告)日：2019-02-12

申请号：US15473967

申请日：2017-03-30

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Hung Chen ,  Kei-Wei Chen

IPC: B24B37/26 ,  B24B37/22 ,  B24B37/04 ,  H01L21/67 ,  H01L21/683

Abstract: A polishing pad is provided. The polishing pad includes a base layer, a top layer, and multiple grooves. The top layer is located over the base layer and has a polishing surface and a bottom surface opposite to each other. The bottom surface is connected to the base layer. The grooves are formed on the bottom surface of the top layer.

公开(公告)号：US11145751B2

公开(公告)日：2021-10-12

申请号：US15939389

申请日：2018-03-29

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Kuo-Ju Chen ,  Su-Hao Liu ,  Chun-Hao Kung ,  Liang-Yin Chen ,  Huicheng Chang ,  Kei-Wei Chen ,  Hui-Chi Huang ,  Kao-Feng Liao ,  Chih-Hung Chen ,  Jie-Huang Huang ,  Lun-Kuang Tan ,  Wei-Ming You

IPC: H01L29/66 ,  H01L29/417 ,  H01L29/78

Abstract: A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes a gate structure, a source/drain structure, a dielectric layer, a contact plug. The gate structure is positioned over a fin structure. The source/drain structure is positioned in the fin structure and adjacent to the gate structure. The dielectric layer is positioned over the gate structure and the source/drain structure. The contact plug is positioned passing through the dielectric layer. The contact plug includes a first metal compound including one of group III elements, group IV elements, group V elements or a combination thereof.

公开(公告)号：US10058974B1

公开(公告)日：2018-08-28

申请号：US15475269

申请日：2017-03-31

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Hung Chen ,  Kei-Wei Chen ,  Ying-Lang Wang

IPC: H01L21/302 ,  B24B37/013 ,  B24B37/04 ,  B24B49/16 ,  H01L21/306 ,  H01L21/321

CPC classification number: B24B37/013 ,  B24B37/042 ,  B24B37/107 ,  B24B49/16

Abstract: A method for performing a CMP process is provided. The method includes performing the CMP process. The method further includes during the CMP process detecting a motion of a carrier head about a rotation axis beside a polishing pad. The method also includes producing a control signal corresponding to a detected result of the motion. In addition, the method includes prohibiting the rotation of the carrier head about a rotation axis by a driving motor which is controlled by the control signal. And, the method includes selecting a point of time at which the CMP process is terminated after the control signal is substantially the same as a threshold value.

公开(公告)号：US20180138052A1

公开(公告)日：2018-05-17

申请号：US15855839

申请日：2017-12-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Hung Chen ,  Chia-Jung Hsu ,  Yi-An Lin

IPC: H01L21/321 ,  H01L21/683 ,  H01L21/673 ,  H01L21/02

CPC classification number: B24B37/30 ,  B24B37/04 ,  B24B37/10 ,  H01L21/02013 ,  H01L21/02016 ,  H01L21/0209 ,  H01L21/32115 ,  H01L21/3212 ,  H01L21/67046 ,  H01L21/67092 ,  H01L21/67219 ,  H01L21/673 ,  H01L21/683

Abstract: A wafer polishing apparatus is described herein. The wafer polishing apparatus includes a polish module configured to apply air pressure to a first surface of a wafer while performing a polishing process on a second surface of the wafer. In some implementations, the polish module is further configured to perform a cleaning process and/or a drying process on the second surface of the wafer, such that the same wafer polishing apparatus is configured to perform the polishing process, the cleaning process, and/or the drying process. In some implementations, the polishing module is further configured to air seal edges of the wafer during the polishing process, the cleaning process, and/or the drying process.

公开(公告)号：US20170243733A1

公开(公告)日：2017-08-24

申请号：US15052310

申请日：2016-02-24

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Hung Chen ,  Chia-Jung Hsu ,  Yi-An Lin

IPC: H01L21/02

CPC classification number: H01L21/32115 ,  B24B37/00 ,  H01L21/02013 ,  H01L21/02016 ,  H01L21/02054 ,  H01L21/0209 ,  H01L21/3212 ,  H01L21/673 ,  H01L21/683

Abstract: The present disclosure provides a semiconductor fabrication apparatus in accordance with one embodiment. The apparatus includes a wafer stage that is operable to secure and rotate a wafer; a polish head configured to polish a backside surface of the wafer; an air bearing module configured to apply an air pressure to a front surface of the wafer; and an edge sealing unit configured to seal edges of the wafer.