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公开(公告)号：US20240356255A1
公开(公告)日：2024-10-24
申请号：US18683758
申请日：2022-08-12
Applicant: Tesla, Inc.
Inventor： Rishabh Bhandari , Yong guo Li , Mohamed Haitham Helmy Nasr , Samuel Lichy , Aydin Nabovati , Shiva Farzinazar , Mitchell Heschke
CPC classification number: H01R12/716 , H01R13/2421 , H01R13/46 , H05K7/20927
Abstract: An array of compliant connectors for electronic assemblies is provided. In one aspect, a system includes an array of first electronic components and an array of second electronic components. Each of the second electronic components is paired with corresponding to one of the first electronic components. Each pair of the first and second electronic components is coupled via a plurality of compliant connectors.
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公开(公告)号：US20240312863A1
公开(公告)日：2024-09-19
申请号：US18576230
申请日：2022-06-28
Applicant: Tesla, Inc.
Inventor： Yong guo Li , Rishabh Bhandari , Aydin Nabovati , Vijaykumar Krithivasan , William Chang
IPC: H01L23/367 , H01L21/48 , H01L23/40
CPC classification number: H01L23/3675 , H01L21/4882 , H01L23/40
Abstract: Wafer assemblies and related methods of manufacture are disclosed. Such assemblies and methods can account for different heights of electronic modules positioned on a wafer. In an embodiment, a wafer assembly includes a cooling system, a wafer, a first electronic module, a second electronic module, and a height adjustment structure. A first thermal interface material (TIM) can be disposed between the first electronic module and a first portion of the cooling system. A second TIM can be disposed between the second electronic module and a second portion of the cooling system. The height adjustment structure can compensate for a height difference between the first electronic module and the second electronic module. Other wafer assemblies and methods of manufacture are disclosed.
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公开(公告)号：US20240163973A1
公开(公告)日：2024-05-16
申请号：US18549881
申请日：2022-03-17
Applicant: Tesla, Inc.
Inventor： Rishabh Bhandari , Sanditi Khandelwal , Anand S. Konanur , Edward Hugh Robert Alley , Mobarrat Shahriar , Mohib Jafri , Xufan Wang , Aleksandar Plavsic , Xue Hai Fang
CPC classification number: H05B1/0236 , B60R19/483 , G01S7/4047 , G01S13/867
Abstract: Systems and methods for configuration and management of heater elements associated with sensor components are provided. A control component associated with the heater element obtains a plurality of inputs associated with the operation of the vehicle, such as location, operational status of components. The control component can utilize a body of information sources independent of any specific temperature or condition sensors on the sensor component to specify operational parameters of the heater element, such as a lookup table. The specified operational parameters can be selected with consideration of mitigation or discouraging the build-up of frozen precipitation on portions of the vehicle approximate to the sensor components. Additionally, the specified operational parameters can further be selected or specified with consideration of mitigation or discouraging of prolonged operation of the heater element resulting in such damages.
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公开(公告)号：US11260809B2
公开(公告)日：2022-03-01
申请号：US16231314
申请日：2018-12-21
Applicant: Tesla, Inc.
Inventor： Satyan Chandra , In Jae Chung , Adnan Esmail , Matthew Blum , Rishabh Bhandari
Abstract: A new wiring and power and communications system for an automobile that includes a plurality of devices, wherein the devices are connected to a backbone section that has an outer sheathing, a first conductor disposed within the outer sheathing, a second conductor disposed within the outer sheathing, a pair of inner sheathing members disposed within the outer sheathing and located on opposing sides of the at least one conductor, the inner sheathing members configured to electrically insulate the first conductor from the second conductor, and a shield member disposed within the outer sheathing.
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公开(公告)号：US20240357729A1
公开(公告)日：2024-10-24
申请号：US18683754
申请日：2022-08-16
Applicant: Tesla, Inc.
Inventor： Mohamed Haitham Helmy Nasr , Samuel Lichy , Aydin Nabovati , Rishabh Bhandari , Yong guo Li , Zheng Gao
CPC classification number: H05K1/0204 , H05K1/181 , H05K2201/064 , H05K2201/066
Abstract: Electronic assemblies with a cold plate having an opening are provided. In one aspect. a system includes an array of electronic components. a control board. and a cold plate having a plurality of openings therethrough. The cold plate can be arranged between the array of electronic components and the control board. The cold plate can cool the array of electronic components. The system can also include a plurality of pass through connectors arranged in the openings in the cold plate and configured to connect the array of electronic components to the control board. The cold plate can also be used to cool the control board electronics and the connectors passing through.
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Patent Agency Ranking
公开(公告)号：US12036932B2
公开(公告)日：2024-07-16
申请号：US17652599
申请日：2022-02-25
Applicant: Tesla, Inc.
Inventor： Satyan Chandra , In Jae Chung , Adnan Esmail , Matthew Blum , Rishabh Bhandari
CPC classification number: B60R16/0238 , B60R16/0207 , B60R16/03 , H05K1/0216 , H05K9/003 , H05K9/0098 , H01R12/62 , H01R13/50 , H01R25/162
Abstract: A new wiring and power and communications system for an automobile that includes a plurality of devices, wherein the devices are connected to a backbone section that has an outer sheathing, a first conductor disposed within the outer sheathing, a second conductor disposed within the outer sheathing, a pair of inner sheathing members disposed within the outer sheathing and located on opposing sides of the at least one conductor, the inner sheathing members configured to electrically insulate the first conductor from the second conductor, and a shield member disposed within the outer sheathing.
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公开(公告)号：US20240234333A9
公开(公告)日：2024-07-11
申请号：US18548433
申请日：2022-02-23
Applicant: Tesla, Inc.
Inventor： Yong guo Li , Rishabh Bhandari , Aydin Nabovati , Ron Rosenberg , Vijaykumar Krithivasan , Mitchell Heschke
IPC: H01L23/544 , H01L23/367
CPC classification number: H01L23/544 , H01L23/367 , H01L2223/54426
Abstract: A system on a wafer (SoW) assembly is disclosed. The SoW assembly can include a first SoW assembly structure with a first coefficient of thermal expansion (CTE). The first SoW assembly structure includes first to third slots at different locations. The SoW assembly can include a second SoW assembly structure stacked on the first SoW assembly structure. The second SoW assembly structure has a second CTE different from the first CTE. The second SoW assembly structure has first to third pins extending therefrom and disposed in the first to third slots. The first and second slots shaped to allow the first and second pins to move along a first axis, and the third slot shaped to allow the third pin to move along a second axis. The first SoW assembly structure can be a SoW and the second SoW assembly structure can be a heat dissipation structure in certain applications.
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公开(公告)号：US20190217794A1
公开(公告)日：2019-07-18
申请号：US16231314
申请日：2018-12-21
Applicant: Tesla, Inc.
Inventor： Satyan Chandra , In Jae Chung , Adnan Esmail , Matthew Blum , Rishabh Bhandari
IPC: B60R16/023 , B60R16/03 , H05K1/02 , H05K9/00
CPC classification number: B60R16/0238 , B60R16/03 , H01R13/50 , H05K1/0216 , H05K9/003
Abstract: A new wiring and power and communications system for an automobile that includes a plurality of devices, wherein the devices are connected to a backbone section that has an outer sheathing, a first conductor disposed within the outer sheathing, a second conductor disposed within the outer sheathing, a pair of inner sheathing members disposed within the outer sheathing and located on opposing sides of the at least one conductor, the inner sheathing members configured to electrically insulate the first conductor from the second conductor, and a shield member disposed within the outer sheathing.
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公开(公告)号：US20240356285A1
公开(公告)日：2024-10-24
申请号：US18683432
申请日：2022-08-16
Applicant: Tesla, Inc.
Inventor： Yong guo Li , Peter Groen , Rishabh Bhandari , Aydin Nabovati , Xuyang Zhang
IPC: H01R13/631 , H01R12/71 , H01R13/518
CPC classification number: H01R13/6315 , H01R12/716 , H01R13/518
Abstract: A connector system is disclosed. The connector system can include a support structure, a holder coupled to the support structure, an alignment adjustment structure positioned between the support structure and the holder, and an actuator. The holder can receive a first connector of a connection line. The alignment adjustment structure is compressible along a first axis and movable along a second axis different from the first axis. The actuator is configured to provide movement of the holder so as to connect the first connector to a second connector of a processor system, such as a system on wafer (SoW) assembly.
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10.发明公开公开(公告)号：US20240145432A1
公开(公告)日：2024-05-02
申请号：US18549307
申请日：2022-03-01
Applicant: TESLA, INC.
Inventor： Mengzhi Pang , Yang Sun , Yong guo Li , Jianjun Li , Rodrigo Rodriguez Navarrete , Vijaykumar Krithivasan , Rishabh Bhandari
IPC: H01L25/065 , H01L23/00 , H01L23/367 , H01L23/552 , H01L23/60
CPC classification number: H01L25/0652 , H01L23/3672 , H01L23/552 , H01L23/60 , H01L24/48 , H01L24/16 , H01L2224/16221 , H01L2224/48245
Abstract: The present disclosure relates to processing systems and more specifically to integrated circuit (IC) packages designed to reduce the effects of electrostatic discharge and/or electromagnetic interference during integrated circuit manufacture and/or use. The IC assembly may include a wafer positioned between a cooling system and thermal dissipation structure. The cooling system and thermal dissipation structure include electrically conductive material at a ground potential such that the thermal systems act as electrical ground. The wafer may be electrically connected to the cooling system and thermal dissipation structure to reduce static charge accumulation during the assembly process. The cooling system and thermal dissipation structure may further provide radio frequency (RF) shielding to reduce electromagnetic interference during use of the IC assembly.
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