摘要:
A storage capacitor, suitable for use in a DRAM cell, is at least partially formed above a substrate surface and includes: a storage electrode at least partially formed above the substrate surface, a dielectric layer formed adjacent the storage electrode, and a counter electrode formed adjacent the dielectric layer, the counter electrode being isolated from the storage electrode by the dielectric layer, wherein the storage electrode is formed as a body which is delimited by at least one curved surface having a center of curvature outside the body in a plane parallel to the substrate surface. According to another configuration, the storage electrode is formed as a body which is delimited by at least one set having two contiguous planes, the two planes extending perpendicularly with respect to the substrate surface, a point of intersection of normals of the two planes lying outside the body.
摘要:
A semiconductor device comprises a memory area including floating body transistors in the form of pillar structures, which are formed in a bulk architecture. The pillar structures may be appropriately addressed on the basis of a buried word line and a buried sense region or sense lines in combination with an appropriate bit line contact regime.
摘要:
A method is disclosed that includes forming a conductive logic contact in a logic area of a semiconductor device, forming a bit line contact and a capacitor contact in a memory array of the semiconductor device, and performing at least one first common process to form a first metallization layer comprising a first conductive line in the logic area that is conductively coupled to the conductive logic contact and a bit line in the memory array that is conductively coupled to the bit line contact. The method further includes performing at least one second common process to form a second metallization layer comprising a first conductive structure conductively coupled to the first conductive line in the logic area and a second conductive structure in the memory array that that is conductively coupled to the capacitor contact.
摘要:
When forming sophisticated semiconductor devices including high-k metal gate electrode structures, a raised drain and source configuration may be used for controlling the height upon performing a replacement gate approach, thereby providing superior conditions for forming contact elements and also obtaining a well-controllable reduced gate height.
摘要:
A semiconductor device includes a first transistor with a first drift zone, and a plurality of second transistors, each second transistor comprising a source region, a drain region and a gate electrode. The second transistors are electrically coupled in series to form a series circuit that is electrically coupled to the first transistor, the first and the plurality of second transistors being at least partially disposed in a semiconductor substrate including a buried doped layer, wherein the source or the drain regions of the second transistors are disposed in the buried doped layer.
摘要:
Generally, the present disclosure is directed to a semiconductor device with DRAM bit lines made from the same material as the gate electrodes in non-memory regions of the device, and methods of making the same. One illustrative method disclosed herein comprises forming a semiconductor device including a memory array and a logic region. The method further comprises forming a buried word line in the memory array and, after forming the buried word line, performing a first common process operation to form at least a portion of a conductive gate electrode in the logic region and to form at least a portion of a conductive bit line in the memory array.
摘要:
A semiconductor device comprises a memory area including floating body transistors in the form of pillar structures, which are formed in a bulk architecture. The pillar structures may be appropriately addressed on the basis of a buried word line and a buried sense region or sense lines in combination with an appropriate bit line contact regime.
摘要:
A transistor, which is formed in a semiconductor substrate having a top surface, includes first and second source/drain regions, a channel connecting the first and second source/drain regions, and a gate electrode for controlling an electrical current flowing in the channel. The gate electrode is disposed in a lower portion of a gate groove defined in the top surface of the semiconductor substrate. The upper portion of the groove is filled with an insulating material. The channel includes a fin-like portion in the shape of a ridge having a top side and two lateral sides in a cross-section perpendicular to a direction defined by a line connecting the first and second source/drain regions. The gate electrode encloses the channel at the top side and the two lateral sides thereof.
摘要:
In a method for fabricating a capacitor that includes an electrode structure (80), an auxiliary layer (40) is formed over a substrate (10). A recess (60), which determines the shape of the electrode structure (80), is etched into the auxiliary layer (40), and the electrode structure of the capacitor is formed in the recess. As an example, the auxiliary layer can be a semiconductor layer (40).
摘要:
An integrated circuit includes a memory cell arrangement with a plurality of active regions along a first direction, a plurality of parallel buried word lines (BWL) along a second direction, a plurality of parallel bitlines along a third direction, and a plurality of storage capacitors. The BWLs run through the active regions. Two of the BWLs are spaced apart from one another and from isolation trenches running through a respective active region, the BWLs being insulated from a channel region by a gate dielectric. The bit lines run perpendicular to the second direction, wherein each bit line makes contact with the relevant source region of the associated active region. The first direction lies between the second and third directions. Storage capacitors are connected to associated drain regions in a respective active region.