摘要:
A method of forming an integrated circuit having a capacitor is disclosed. In one embodiment, the method includes forming a capacitor element with a first electrode, a dielectric layer and a second electrode. The capacitor element is formed using a support layer.
摘要:
A method of forming an integrated circuit having a capacitor is disclosed. In one embodiment, the method includes forming a capacitor element with a first electrode, a dielectric layer and a second electrode. The capacitor element is formed using a support layer.
摘要:
An electronic component has a first bit line and a second bit line, which are coupled to a plurality of memory cells, a line for providing a precharging potential, a resistance component which is connected to the line, a first switch which is coupled between the resistance component and the first bit line for connection of the first bit line to the resistance component, and a second switch, which is coupled between the resistance component and the second bit line, for connection of the second bit line to the resistance component. The electrical resistance of the resistance component is controllable in order to assume a predetermined first resistance value or a predetermined second resistance value which is higher than the first resistance value.
摘要:
A conductor for interconnecting integrated circuit components having improved reliability. The conductor includes a liner surrounding at least three surfaces of the conductor, producing a low textured conductor. It has been found that low textured conductor results in improved electromigration lifetime.
摘要:
A memory component comprises a plurality of bit lines, on which memory cells are arranged, and a plurality of sense amplifiers, which are arranged in a row, each sense amplifier being connected to two bit lines. A bit line which is connected to a first sense amplifier in the row is arranged directly adjacent to a bit line which is connected to a second sense amplifier in the same row.
摘要:
The invention proposes an apparatus for writing to and/or reading from a memory cell in a semiconductor memory having a selection transistor and a storage capacitor, where the apparatus has a device which is used to influence a threshold voltage for the selection transistor contrary to the influence of an ambient temperature. The invention also proposes a method for writing to and/or reading from a memory cell in a semiconductor memory having a selection transistor and a storage capacitor, where the method comprises the following method steps: a) an ambient temperature for the memory cell is ascertained, and b) an electrical voltage is applied to a substrate well in the selection transistor as a function of the ascertained ambient temperature such that a threshold voltage for the selection transistor is influenced contrary to the influence of an ambient temperature.
摘要:
A semiconductor memory device comprises a temperature dependent voltage source for outputting a voltage at its output in dependence on a temperature measured in the semiconductor memory device. At least one memory cell is provided with at least one first transistor. The first transistor includes a first transistor body, which is connected to the output of said temperature dependent voltage source.
摘要:
A conductor for interconnecting integrated circuit components having improved reliability. The conductor includes a liner surrounding at least three surfaces of the conductor, producing a low textured conductor. It has been found that low textured conductor results in improved electromigration lifetime.
摘要:
A memory component comprises a plurality of bit lines, on which memory cells are arranged, and a plurality of sense amplifiers, which are arranged in a row, each sense amplifier being connected to two bit lines. A bit line which is connected to a first sense amplifier in the row is arranged directly adjacent to a bit line which is connected to a second sense amplifier in the same row.
摘要:
A microelectronic structure is formed on a first layer or a substrate. The first layer or substrate is formed with grooves and contact openings. A metal nitride layer of TiN or WN covers the first layer or the substrate at least partially. An alpha-phase tantalum layer is deposited on top of the metal nitride layer. Finally, a metal is deposited to completely fill the grooves and the contact openings.