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    Coatings for EMI/RFI shielding
    1.
    发明授权
    Coatings for EMI/RFI shielding 失效
    EMI / RFI屏蔽涂层

    公开(公告)号：US6013203A

    公开(公告)日：2000-01-11

    申请号：US136219

    申请日：1998-08-19

    申请人： Vincent Paneccasio, Jr. ,  Mark P. Chasse

    发明人： Vincent Paneccasio, Jr. ,  Mark P. Chasse

    IPC分类号： C09D5/24 ,  H01B1/22 ,  H05K1/09 ,  H05K9/00

    CPC分类号： H05K9/0092 ,  C09D5/24 ,  H01B1/22 ,  H05K1/095

    摘要： An electrically conductive paint for providing EMI/RFI shielding for housings of electronics components comprises a cross-linked organic resin binder containing cross-linkable functional groups such as OH groups, electrically conductive metallic particles, preferably a mixture of silver flakes and silver-coated copper flakes, a solvent, a cross-linking agent which cross-links with itself and with the functional groups of the organic binder and preferably a catalyst which accelerates cross-linking of the cross-linking agent and organic binder. Using such a paint formulation it has been found that thinner coatings can be used while still exceeding the properties needed for EMI/RFI shielding of housing for electronic components. A rheological additive which is an organic derivative of castor oil is preferably used to control the viscosity and spraying characteristics of the paint especially in a paint composition containing silver coated copper flakes. The conductive paint provides a sprayed coating which is durable, has low resistivity and is smooth and has both cohesive and adhesive strength. A method is also provided for forming EMI/RFI shielding on housings for electronic components and electronic components made using the method and paint composition of the invention.

    摘要翻译： 用于为电子部件的壳体提供EMI / RFI屏蔽的导电涂料包括含有可交联官能团如OH基团的交联有机树脂粘合剂，导电金属颗粒，优选银薄片和银涂层铜的混合物 薄片，溶剂，与其自身和有机粘合剂的官能团交联的交联剂，优选加速交联剂和有机粘合剂的交联的催化剂。 已经发现使用这种涂料配方，可以使用更薄的涂层，同时仍然超过用于电子部件的外壳的EMI / RFI屏蔽所需的性能。 作为蓖麻油的有机衍生物的流变添加剂优选用于控制涂料的粘度和喷涂特性，特别是在含有银涂布的铜薄片的涂料组合物中。 导电涂料提供耐用的，具有低电阻率并且光滑并且具有粘结和粘合强度的喷涂。 还提供了一种用于在使用本发明的方法和涂料组合物制造的电子部件和电子部件的壳体上形成EMI / RFI屏蔽的方法。

    Method for applying a conductive paint coating and articles made thereby
    2.
    发明授权
    Method for applying a conductive paint coating and articles made thereby 失效
    用于涂覆导电涂料的方法和由此制成的制品

    公开(公告)号：US06375866B1

    公开(公告)日：2002-04-23

    申请号：US09478951

    申请日：2000-01-07

    申请人： Vincent Paneccasio, Jr. ,  Mark P. Chasse′

    发明人： Vincent Paneccasio, Jr. ,  Mark P. Chasse′

    IPC分类号： H01B122

    CPC分类号： H05K9/0092 ,  C09D5/24 ,  H01B1/22 ,  H05K1/095

    摘要： An electrically conductive paint for applying to substrates to make articles of manufacture including EMI/RFI shielded housings of electronic components and printing plates comprises a cross-linked organic resin binder containing cross-linkable functional groups such as OH groups, electrically conductive metallic particles, preferably a mixture of silver flakes and silver-coated copper flakes, a solvent, a cross-linking agent which cross-links with itself and with the functional groups of the organic binder and preferably a catalyst which accelerates cross-linking of the cross-linking agent and organic binder. Using such a paint formulation it has been found that thinner coatings can be used while still exceeding the properties needed for EMI/RFI shielding of housing for electronic components. A Theological additive which is an organic derivative of castor oil is preferably used to control the viscosity and spraying characteristics of the paint especially in a paint composition containing silver coated copper flakes. The conductive paint provides a sprayed coating which is durable, has low resistivity and is smooth and has both cohesive and adhesive strength. A method is also provided for forming EMI/RFI shielding on housings for electronic components and electronic components made using the method and paint composition of the invention. Another method is provided for making printing plates used to print a design on an article such as a beverage can. The printing plate is made by applying the conductive paint of the invention to a polymer imaged substrate such as a steel plate.

    摘要翻译： 用于施加到基板以制造包括电子部件和印刷板的EMI / RFI屏蔽外壳的制品的导电涂料包括含有可交联官能团如OH基，导电金属颗粒的交联有机树脂粘合剂，优选地 银薄片和银包铜薄片的混合物，溶剂，与其自身交联并与有机粘合剂的官能团交联的交联剂，优选加速交联剂交联的催化剂 和有机粘合剂。 已经发现使用这种涂料配方，可以使用更薄的涂层，同时仍然超过用于电子部件的外壳的EMI / RFI屏蔽所需的性能。 作为蓖麻油的有机衍生物的神学添加剂优选用于控制油漆的粘度和喷涂特性，特别是在含有银涂布的铜薄片的涂料组合物中。 导电涂料提供耐用的，具有低电阻率并且光滑并且具有粘结和粘合强度的喷涂。 还提供了一种用于在使用本发明的方法和涂料组合物制造的电子部件和电子部件的壳体上形成EMI / RFI屏蔽的方法。 提供另一种方法用于制造用于在诸如饮料罐的物品上印刷设计的印刷板。 印版通过将本发明的导电涂料施加到诸如钢板的聚合物成像基板上而制成。

    Copper electrodeposition in microelectronics
    3.
    发明授权
    Copper electrodeposition in microelectronics 有权
    铜电沉积在微电子学

    公开(公告)号：US07815786B2

    公开(公告)日：2010-10-19

    申请号：US11846385

    申请日：2007-08-28

    申请人： Vincent Paneccasio, Jr. ,  Xuan Lin ,  Paul Figura ,  Richard Hurtubise

    发明人： Vincent Paneccasio, Jr. ,  Xuan Lin ,  Paul Figura ,  Richard Hurtubise

    IPC分类号： H01L21/4763

    CPC分类号： H01L21/2885 ,  C25D3/38 ,  C25D7/12 ,  C25D7/123 ,  H01L21/76877

    摘要： An electrolytic plating method and composition for electrolytically plating Cu onto a semiconductor integrated circuit substrate having submicron-sized interconnect features. The composition comprises a source of Cu ions and a suppressor compound comprising polyether groups. The method involves superfilling by rapid bottom-up deposition at a superfill speed by which Cu deposition in a vertical direction from the bottoms of the features to the top openings of the features is substantially greater than Cu deposition on the side walls.

    摘要翻译： 一种用于在具有亚微米尺寸互连特征的半导体集成电路基板上电解电镀Cu的电解电镀方法和组合物。 该组合物包含Cu离子源和包含聚醚基团的抑制剂化合物。 该方法包括以超填充速度的快速自下而上沉积来超填充，通过其从特征的底部到特征的顶部开口的垂直方向上的Cu沉积基本上大于侧壁上的Cu沉积。

    Surface preparation process for damascene copper deposition
    4.
    发明授权
    Surface preparation process for damascene copper deposition 有权
    镶嵌铜沉积的表面处理工艺

    公开(公告)号：US07998859B2

    公开(公告)日：2011-08-16

    申请号：US12238139

    申请日：2008-09-25

    申请人： Qingyun Chen ,  Xuan Lin ,  Vincent Paneccasio, Jr. ,  Richard Hurtubise ,  Joseph A. Abys

    发明人： Qingyun Chen ,  Xuan Lin ,  Vincent Paneccasio, Jr. ,  Richard Hurtubise ,  Joseph A. Abys

    IPC分类号： H01L21/00

    CPC分类号： H01L21/76873 ,  H01L21/02068 ,  H01L21/288 ,  H01L21/76843 ,  H01L21/76846 ,  H01L21/76861 ,  H01L21/76874

    摘要： A method is disclosed for metallizing a substrate comprising an interconnect feature in the manufacture of a microelectronic device, wherein the interconnect feature comprises a bottom, a sidewall, and a top opening having a diameter, D. The method comprises the following steps: depositing a barrier layer on the bottom and the sidewall of the interconnect feature, the barrier layer comprising a metal selected from the group consisting of ruthenium, tungsten, tantalum, titanium, iridium, rhodium, and combinations thereof; contacting the substrate comprising the interconnect feature comprising the bottom and sidewall having the barrier layer thereon with an aqueous composition comprising a reducing agent and a surfactant; and depositing copper metal onto the bottom and the sidewall of the interconnect feature having the barrier layer thereon.

    摘要翻译： 公开了一种用于金属化包括在微电子器件的制造中的互连特征的衬底的方法，其中所述互连特征包括底部，侧壁和具有直径D的顶部开口。该方法包括以下步骤： 所述阻挡层包括选自由钌，钨，钽，钛，铱，铑及其组合组成的组的金属; 使包含所述底部和侧壁的所述基底的所述基底与所述阻挡层接触，所述水性组合物包含还原剂和表面活性剂; 以及在其上具有阻挡层的互连部件的底部和侧壁上沉积铜金属。

    Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers
    8.
    发明授权
    Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers 有权
    用基于二吡啶基的矫直剂在微电子学中电沉积铜的方法和组合物

    公开(公告)号：US08388824B2

    公开(公告)日：2013-03-05

    申请号：US12324335

    申请日：2008-11-26

    申请人： Vincent Paneccasio, Jr. ,  Xuan Lin ,  Richard Hurtubise ,  Qingyun Chen

    发明人： Vincent Paneccasio, Jr. ,  Xuan Lin ,  Richard Hurtubise ,  Qingyun Chen

    IPC分类号： C25D5/02 ,  C25D3/38 ,  H05K3/42

    CPC分类号： H01L21/76879 ,  C25D3/38 ,  C25D5/02 ,  C25D7/12 ,  C25D7/123 ,  H01L21/2885 ,  H01L21/76877 ,  H01L23/53228 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method for metallizing a via feature in a semiconductor integrated circuit device substrate, wherein the semiconductor integrated circuit device substrate comprises a front surface, a back surface, and the via feature and wherein the via feature comprises an opening in the front surface of the substrate, a sidewall extending from the front surface of the substrate inward, and a bottom. The method comprises contacting the semiconductor integrated circuit device substrate with an electrolytic copper deposition chemistry comprising (a) a source of copper ions and (b) a leveler compound, wherein the leveler compound is a reaction product of a dipyridyl compound and an alkylating agent; and supplying electrical current to the electrolytic deposition chemistry to deposit copper metal onto the bottom and sidewall of the via feature, thereby yielding a copper filled via feature.

    摘要翻译： 一种用于金属化半导体集成电路器件衬底中的通孔特征的方法，其中所述半导体集成电路器件衬底包括前表面，后表面和所述通孔特征，并且其中所述通孔特征包括在所述衬底的前表面中的开口 ，从基板的前表面向内延伸的侧壁和底部。 该方法包括使半导体集成电路器件衬底与包含（a）铜离子源和（b）整平剂化合物的电解铜沉积化学物质接触，其中矫光剂化合物是二吡啶基化合物和烷基化剂的反应产物; 并向电解沉积化学物质提供电流以将铜金属沉积到通孔特征的底部和侧壁上，从而产生铜填充的通孔特征。

    Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect
    9.
    发明授权
    Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect 有权
    用于CU填充VLSI / ULSI互连的亚微米特征的电镀化学

    公开(公告)号：US06776893B1

    公开(公告)日：2004-08-17

    申请号：US09716975

    申请日：2000-11-20

    申请人： Elena H. Too ,  Paul R. Gerst ,  Vincent Paneccasio, Jr. ,  Richard W. Hurtubise

    发明人： Elena H. Too ,  Paul R. Gerst ,  Vincent Paneccasio, Jr. ,  Richard W. Hurtubise

    IPC分类号： C25D502

    CPC分类号： C25D3/38 ,  H05K3/423

    摘要： A copper electroplating bath and a method to plate substrates with the bath are provided. The bath and method are particularly effective to plate electronic components such as semiconductive wafer VLSI and ULSI interconnects with void-free fill copper plating for circuitry forming vias and trenches and other small features less than 0.2 microns with high aspect ratios. The copper bath contains a bath soluble organic divalent sulfur compound, and a bath soluble polyether compound such as a block copolymer of polyoxyethylene and polyoxypropylene, a polyoxyethylene or polyoxypropylene derivative of a polyhydric alcohol and a mixed polyoxyethylene and polyoxypropylene derivative of a polyhydric alcohol. A preferred polyether compound is a mixed polyoxyethylene and polyoxypropylene derivative of glycerine. A preferred copper bath also contains a pyridine compound derivative.

    摘要翻译： 提供了一种铜电镀浴和一种用浴板对基片进行印版的方法。 该浴和方法特别有效地将诸如半导体晶片VLSI和ULSI互连的电子部件用无孔填充铜电镀形成用于形成通孔和沟槽的电路以及具有高纵横比的小于0.2微米的其它小特征。 铜浴含有可溶于水的有机二价硫化合物，以及诸如聚氧乙烯和聚氧丙烯的嵌段共聚物的浴溶性聚醚化合物，多元醇的聚氧乙烯或聚氧丙烯衍生物以及多元醇的混合聚氧乙烯和聚氧丙烯衍生物。 优选的聚醚化合物是甘油的混合聚氧乙烯和聚氧丙烯衍生物。 优选的铜浴还含有吡啶化合物衍生物。

    Zincate solutions for treatment of aluminum and aluminum alloys
    10.
    发明授权
    Zincate solutions for treatment of aluminum and aluminum alloys 失效
    用于处理铝和铝合金的锌溶液

    公开(公告)号：US5182006A

    公开(公告)日：1993-01-26

    申请号：US650149

    申请日：1991-02-04

    申请人： Juan Haydu ,  Vincent Paneccasio, Jr. ,  Patricia A. Cacciatore

    发明人： Juan Haydu ,  Vincent Paneccasio, Jr. ,  Patricia A. Cacciatore

    IPC分类号： C23C18/18 ,  C23C28/02 ,  C23F1/44 ,  C25D5/42 ,  C25D5/44

    CPC分类号： C25D5/44 ,  C23C18/1651 ,  C23C18/54

    摘要： A method for producing smooth metal coatings on zincated aluminum substrates using a specially formulated zincating bath containing an additive comprising a bath soluble cationic condensation polymer represented by the general formula: ##STR1## wherein: Z represents a group of atoms necessary to complete a heterocylic compound having a five or six membered ring containing at least 2 nitrogen atoms;R is nothing or the alkyl group of an alkylating agent;X is Cl, Br or I, andn is >1.

    摘要翻译： 一种使用特殊配方的含有含有由以下通式表示的可溶性阳离子缩聚物的溶液的阳离子缩聚物的添加剂的特殊配制的镀锌浴制备平滑金属涂层的方法：其中：Z代表完成杂环化合物所必需的一组原子 具有含有至少2个氮原子的五元或六元环; R不是烷基化剂或烷基化剂的烷基; X为Cl，Br或I，n为> 1。