公开(公告)号：US20170012081A1

公开(公告)日：2017-01-12

申请号：US15181288

申请日：2016-06-13

Applicant: XINTEC INC.

Inventor： Chia-Lun SHEN ,  Yi-Ming CHANG ,  Hsiao-Lan YEH ,  Yen-Shih HO

IPC: H01L27/146 ,  H01L21/78 ,  H01L25/065 ,  H01L23/00

CPC classification number: H01L27/14687 ,  H01L21/78 ,  H01L24/03 ,  H01L24/06 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L24/94 ,  H01L25/0657 ,  H01L27/14636 ,  H01L2224/0331 ,  H01L2224/0332 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/06131 ,  H01L2224/06132 ,  H01L2224/06135 ,  H01L2224/11005 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1181 ,  H01L2224/11849 ,  H01L2224/13016 ,  H01L2224/13023 ,  H01L2224/13111 ,  H01L2224/1403 ,  H01L2224/14132 ,  H01L2224/14179 ,  H01L2224/16057 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17135 ,  H01L2224/81011 ,  H01L2224/81191 ,  H01L2224/818 ,  H01L2224/81801 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06568 ,  H01L2924/3511 ,  H01L2224/11 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A manufacturing method of a chip package includes the following steps. A patterned solder paste layer is printed on a patterned conductive layer of a wafer. Plural solder balls are disposed on the solder paste layer that is on a first portion of the conductive layer. A reflow process is performed on the solder balls and the solder paste layer. A flux layer converted from a surface of the solder paste layer is cleaned.

Abstract translation: 芯片封装的制造方法包括以下步骤。 将图案化的焊膏层印刷在晶片的图案化导电层上。 多个焊球设置在导电层的第一部分上的焊膏层上。 在焊球和焊膏层上进行回流处理。 从焊膏层的表面转换的焊剂层被清洁。

公开(公告)号：US20170213805A1

公开(公告)日：2017-07-27

申请号：US15483928

申请日：2017-04-10

Applicant: XINTEC INC.

Inventor： Chia-Lun SHEN ,  Yi-Ming CHANG ,  Tsang-Yu LIU ,  Yen-Shih HO

IPC: H01L23/00 ,  H01L21/78

CPC classification number: H01L24/32 ,  H01L21/30604 ,  H01L21/48 ,  H01L21/78 ,  H01L24/05 ,  H01L24/09 ,  H01L24/33 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/02371 ,  H01L2224/02373 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05669 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8385 ,  H01L2224/8389 ,  H01L2924/00014 ,  H01L2924/10155 ,  H01L2924/10156 ,  H01L2924/12042 ,  H01L2924/37001 ,  H01L2924/00 ,  H01L2224/45099

Abstract: A method for forming a chip package is provided. The method includes providing a first substrate and a second substrate. The first substrate is attached onto the second substrate by an adhesive layer. A first opening is formed to penetrate the first substrate and the adhesive layer and separate the first substrate and the adhesive layer into portions. A chip package formed by the method is also provided.

公开(公告)号：US20170186712A1

公开(公告)日：2017-06-29

申请号：US15393170

申请日：2016-12-28

Applicant: XINTEC INC.

Inventor： Chia-Lun SHEN ,  Po-Shen LIN ,  Ang CHAN

IPC: H01L23/00 ,  H01L21/768 ,  H01L21/78 ,  H01L23/31

Abstract: A chip package including a substrate is provided. The substrate includes a front surface, a back surface, and a side surface. A redistribution layer is disposed on the back surface and is electrically connected to a sensing or device region in the substrate. A protection layer covers the redistribution layer and extends onto the side surface. A cover plate is disposed on the front surface and laterally protrudes from the protection layer on the side surface. The cover plate includes a first surface facing the front surface and a second surface facing away from the front surface. A bottom portion of the cover plate broadens from the first surface towards the second surface. A method of forming the chip package is also provided.

公开(公告)号：US20150279808A1

公开(公告)日：2015-10-01

申请号：US14673657

申请日：2015-03-30

Applicant: XINTEC INC.

Inventor： Chia-Lun SHEN ,  Yi-Ming CHANG ,  Tsang-Yu LIU ,  Yen-Shih HO

IPC: H01L23/00 ,  H01L21/306 ,  H01L21/78

CPC classification number: H01L24/32 ,  H01L21/30604 ,  H01L21/48 ,  H01L21/78 ,  H01L24/05 ,  H01L24/09 ,  H01L24/33 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/02371 ,  H01L2224/02373 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05669 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8385 ,  H01L2224/8389 ,  H01L2924/00014 ,  H01L2924/10155 ,  H01L2924/10156 ,  H01L2924/12042 ,  H01L2924/37001 ,  H01L2924/00 ,  H01L2224/45099

Abstract: A method for forming a chip package is provided. The method includes providing a first substrate and a second substrate. The first substrate is attached onto the second substrate by an adhesive layer. A first opening is formed to penetrate the first substrate and the adhesive layer and separate the first substrate and the adhesive layer into portions. A chip package formed by the method is also provided.

Abstract translation: 提供一种形成芯片封装的方法。 该方法包括提供第一基板和第二基板。 第一衬底通过粘合剂层附着到第二衬底上。 形成第一开口以穿透第一基底和粘合剂层，并将第一基底和粘合剂层分离成部分。 还提供了通过该方法形成的芯片封装。