Abstract:
An electronics-harmful-radiation (EHR) monitoring system includes an EHR measurement circuit. The EHR measurement circuit includes a first device, a single event upset (SEU) detector circuit configured to determine a first number of SEUs of the first device during a first period, and an EHR measurement generator configured to generate a first EHR value based on the first number of SEUs and the first period.
Abstract:
An integrated circuit (IC) chip having circuitry adapted to detect and unlatch a latched transistor, and methods for operating the same are provided. In one example, an IC chip includes a body, a power rail disposed in the body and coupled to at least one of a plurality of contract pads disposed on the body, and a first core circuit disposed in the body. The first core circuit includes a first current limiting circuit, a silicon controlled rectifier (SCR) device having a first transistor, a second transistor, and a first latch sensing circuit. The first current limiting circuit is coupled to the power rail. First terminals of the first and second transistors are coupled to the first current limiting circuit. The first latch sensing circuit has a first input terminal coupled to second terminals of the first and second transistors. The first latch sensing circuit also has an output terminal coupled to the first current limiting circuit.
Abstract:
Approaches are disclosed for processing a circuit design to protect against single event upsets. A logic path of the circuit design is selected for redundancy based on a total of failure rates of circuit elements in the logic path being greater than a product of a target reduction in failure rate of the logic path and a failure rate of a voting circuit. The circuit design is modified to include at least three instances of the logic path coupled in parallel and a voting circuit coupled to receive output signals from the instances of the logic path. The modified circuit design is stored in a memory.
Abstract:
A wafer includes a first interposer having a first patterned metal layer and a second interposer having a second patterned metal layer. The wafer includes a metal connection in a scribe region of the wafer that electrically couples the first patterned metal layer of the first interposer with the second patterned metal layer of the second interposer forming a global wafer network. The wafer further includes a probe pad located in the scribe region that is electrically coupled to the global wafer network.
Abstract:
Examples described herein provide for single event latch-up (SEL) mitigation techniques. In an example, a circuit includes a semiconductor substrate, a first transistor, a second transistor, and a ballast resistor. The semiconductor substrate comprises a p-doped region and an n-doped region. The first transistor comprises an n+ doped source region disposed in the p-doped region of the semiconductor substrate. The second transistor comprises a p+ doped source region disposed in the n-doped region of the semiconductor substrate. The p+ doped source region, the n-doped region, the p-doped region, and the n+ doped source region form a PNPN structure. The ballast resistor is electrically connected in series with the PNPN structure between a power node and a ground node.
Abstract:
Examples described herein provide for single event latch-up (SEL) mitigation techniques. In an example, a semiconductor structure includes a semiconductor substrate, a p-type transistor having p+ source/drain regions disposed in a n-doped region in the semiconductor substrate, an n-type transistor having n+ source/drain regions disposed in a p-doped region in the semiconductor substrate, a n+ guard ring disposed in the n-doped region and laterally around the p+ source/drain regions of the p-type transistor, and a p+ guard ring disposed laterally around the n-doped region. The p+ guard ring is disposed between the p-type transistor and the n-type transistor.
Abstract:
A reticle for multiple patterning a layer of an integrated circuit die includes a first portion with a first layout pattern for multiple patterning the layer of the integrated circuit die, and a second portion with a second layout pattern for multiple patterning the layer of the integrated circuit die. The first layout pattern is different from the second layout pattern.
Abstract:
A device comprising a plurality of transistors; interconnect elements coupled to the plurality of transistors is described. The interconnect elements enable the transfer of signals between the plurality of transistors. The device further includes a cooling element associated with the device, wherein the cooling element is configured to maintain a temperature of a circuit having the plurality of transistors and interconnect elements below a predetermined temperature; wherein one or more parameters of the device is optimized to operate at a temperature below the predetermined temperature. A method of implementing a circuit is also described.
Abstract:
An integrated circuit (IC) chip having circuitry adapted to detect and unlatch a latched transistor, and methods for operating the same are provided. In one example, an IC chip includes a body, a power rail disposed in the body and coupled to at least one of a plurality of contact pads disposed on the body, and a first core circuit disposed in the body. The first core circuit includes a first current limiting circuit, a silicon controlled rectifier (SCR) device having a first transistor, a second transistor, and a first latch sensing circuit. The first current limiting circuit is coupled to the power rail. First terminals of the first and second transistors are coupled to the first current limiting circuit. The first latch sensing circuit has a first input terminal coupled to second terminals of the first and second transistors. The first latch sensing circuit also has an output terminal coupled to the first current limiting circuit.
Abstract:
An exemplary interconnect circuit for a programmable integrated circuit (IC) includes an input terminal coupled to receive from a node in the programmable IC, an output terminal coupled to transmit towards another node in the programmable IC, first and second control terminals coupled to receive from a memory cell of the programmable IC, and a complementary metal oxide semiconductor (CMOS) pass-gate coupled between the input terminal and the output terminal and to the first and second control terminals. The CMOS pass-gate includes a P-channel transistor configured with a low threshold voltage for a CMOS process used to fabricate the programmable IC.