摘要:
When an overcurrent detection section detects an overcurrent, a control circuit performs ON-OFF control for switching devices each switchable between a forward direction and a reverse direction, in a mode in which a current having flowed is reduced, such that when the mode is a mode in which a current is passed through any of diodes, a switching device connected in parallel with the current-passed diode is turned ON. Thus, even when an overcurrent occurs, the current flowing in the diode connected in parallel with the switching device is reduced, and the diode is protected from being deteriorated or broken by the overcurrent.
摘要:
When an overcurrent detection section detects an overcurrent, a control circuit performs ON-OFF control for switching devices each switchable between a forward direction and a reverse direction, in a mode in which a current having flowed is reduced, such that when the mode is a mode in which a current is passed through any of diodes, a switching device connected in parallel with the current-passed diode is turned ON. Thus, even when an overcurrent occurs, the current flowing in the diode connected in parallel with the switching device is reduced, and the diode is protected from being deteriorated or broken by the overcurrent.
摘要:
A power semiconductor module applied to a power converting apparatus for a railway car includes an element pair formed by connecting an IGBT and an SiC-FWD in anti-parallel to each other and an element pair formed by connecting an Si-IGBT and an SiC-FWD in anti-parallel to each other. The element pair and the element pair are housed in one module and configured as a 2-in-1 module in a manner that the first element pair operates as a positive side arm of the power converting apparatus and the second element pair operates as a negative side arm of the power converting apparatus. The element pairs are formed such that a ratio of an occupied area of SiC-FWD chips to an occupied area of IGBT chips in the element pairs is equal to or higher than 15% and lower than 45%.
摘要:
A power semiconductor module in which temperature rise of switching elements made of a Si semiconductor can be suppressed low and efficiency of cooling the module can be enhanced. To that end, the power semiconductor module includes switching elements made of the Si semiconductor and diodes made of a wide-bandgap semiconductor, the diodes are arranged in the middle region of the power semiconductor module, and the switching elements are arranged in both sides or in the periphery of the middle region of the power semiconductor module.
摘要:
A power switching circuit includes a power semiconductor element that includes a main switching element connected in parallel with a main body diode and a sense switching element connected in parallel with a sense body diode; a reverse overcurrent detection circuit that detects an overcurrent flowing in the reverse direction out of currents flowing through a parallel-connection body of the sense switching element and the sense body diode; and a control circuit that drives the gate of the power semiconductor element; wherein when the reverse overcurrent detection circuit detects a reverse overcurrent, the control circuit controls the main switching element and the sense switching element to turn on.
摘要:
A power conversion device in which the inductance of a main circuit is reduced, a surge voltage is suppressed, elements are properly cooled, which is miniaturized and reduced in weight as a whole, and is excellent in handling performance in a manufacturing process and a maintenance work. A positive side arm unit includes IGBT modules, a coupling diode module, a cooling plate on which the modules are mounted, and a first laminated bus bar connected to the respective modules. A negative side arm unit includes IGBT modules, a coupling diode module, a cooling plate on which the modules are mounted, and a second laminated bus bar connected to the respective modules, and both the laminated bus bars and the capacitors are connected to one another by a third laminated bus bar. Both the cooling plates are parallel to each other so that the mount surfaces thereof are set in the same direction.
摘要:
In a conventional cooling device, a heat pipe or a circulation-type liquid cooler provided with a pump is used and therefore, a large space is needed for the cooling device. There is provided a cooling device which includes a plurality of cooling modules 6 having cooling units 6A for cooling heat-generating elements 7 by coolant and radiation units 6C for radiating heat from the coolant heated in the cooling units 6A, the plurality of cooling modules being bubble-pump-type ones in which the coolant is circulated between the radiation units 6C and the cooling units 6A by the coolant being boiled in the cooling units 6A, the radiation units 6C being arranged side by side, and a cooling fan 2 for generating wind blowing the radiation units 6C.
摘要:
There is provided a cooling device which includes a plurality of cooling modules 6 having cooling units 6A for cooling heat-generating elements 7 by coolant and radiation units 6C for radiating heat from the coolant heated in the cooling units 6A, the plurality of cooling modules being bubble-pump-type ones in which the coolant is circulated between the radiation units 6C and the cooling units 6A by the coolant being boiled in the cooling units 6A, the radiation units 6C being arranged side by side, and a cooling fan 2 for generating wind blowing the radiation units 6C.
摘要:
Solid fine particles which contain a magnesium atom, an aluminum atom and a C1-20 alkoxy group simultaneously, are insoluble in a hydrocarbon solvent, and have an average particle diameter of 3 to 80 μm, and an olefin polymerization catalyst containing the solid fine particles and a transition metal compound in the groups 3 to 11 in the periodic table, exhibit a very high olefin polymerization activity without combination with an expensive organoaluminum oxy compound or organoboron compound and maintains a high activity in polymerization for a long time, and an olefin polymer excellent in powdery properties can be produced by using the olefin polymerization catalyst. The transition metal compound in the groups 3 to 11 in the periodic table includes a transition metal compound having a ligand containing two or more atoms selected from a boron atom, a nitrogen atom, an oxygen atom, a phosphorus atom and a sulfur atom.
摘要:
An ethylene-based polymer which is an ethylene/C4 to C10 α-olefin copolymer and satisfies the following requirements [k1] to [k3]: [k1] melt flow rate (MFR) under a loading of 2.16 kg at 190° C. is in the range of 1.0 to 50 g/10 minutes; [k2] LNR defined as a scale of neck-in upon film molding is in the range of 0.6 to 1.4; and [k3] take-up speed at break [DS (m/min)] at 160° C. and melt flow rate (MFR) satisfy the following relationship (Eq-1): 12×MFR0.577≦DS≦165×MFR0.577 (Eq-1), and a thermoplastic resin composition containing the ethylene-based polymer, provide a molded product, preferably a film, excellent in moldability and mechanical strength.The ethylene-based polymer can be efficiently obtained by polymerization in the presence of an olefin polymerization catalyst formed from a solid carrier, (A) a solid transition metal catalyst component obtained by contacting (a) a compound of a transition metal of the group 4 in the periodic table, containing at least one ligand having a cyclopentadienyl skeleton, (b) an organoaluminum oxy compound, (c) a multifunctional organic halide, and if necessary (d) an organoaluminum compound, and if necessary (B) organoaluminum compound.