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公开(公告)号：US08717739B2
公开(公告)日：2014-05-06
申请号：US13419545
申请日：2012-03-14
摘要： A ceramic electronic component includes a substantially rectangular ceramic element assembly, a first external electrode, and a second external electrode. The first external electrode includes at least one plating film including a first plating film disposed directly on the ceramic element assembly from outside. Likewise, the second external electrode includes at least one plating film including a second plating film disposed directly on the ceramic element assembly from outside. The first and second plating films each have a surface area per unit area equal to or larger than about 1.02 in plan view.
摘要翻译： 陶瓷电子部件包括大致矩形的陶瓷元件组件，第一外部电极和第二外部电极。 第一外部电极包括至少一个镀膜，其包括从外部直接设置在陶瓷元件组件上的第一镀膜。 类似地，第二外部电极包括至少一个镀膜，其包括从外部直接设置在陶瓷元件组件上的第二镀膜。 在平面图中，第一和第二电镀膜的每单位面积的表面积等于或大于约1.02。
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公开(公告)号：US08411409B2
公开(公告)日：2013-04-02
申请号：US13161535
申请日：2011-06-16
申请人： Makoto Ogawa , Akihiro Motoki , Masahito Saruban , Toshiyuki Iwanaga , Syunsuke Takeuchi , Kiyoyasu Sakurada
发明人： Makoto Ogawa , Akihiro Motoki , Masahito Saruban , Toshiyuki Iwanaga , Syunsuke Takeuchi , Kiyoyasu Sakurada
IPC分类号： H01G4/30
摘要： When an external terminal electrode of a ceramic electronic component such as a laminated ceramic capacitor is formed by plating, plating growth may be also caused even in an undesired location. The ceramic surface provided by a component main body is configured to include a high plating growth region of, for example, a barium titanate based ceramic, which exhibits relatively high plating growth, and a low plating growth region of, for example, a calcium zirconate based ceramic, which exhibits relatively low plating growth. The plating film constituting a first layer to define a base for an external terminal electrode is formed in such a way that the growth of a plated deposit deposited with conductive surfaces provided by exposed ends of internal electrodes as starting points is limited so as not to cross over a boundary between the high plating growth region and the low plating growth region toward the low plating growth region.
摘要翻译： 当通过电镀形成层压陶瓷电容器等陶瓷电子部件的外部端子电极时，即使在不希望的位置也可能产生电镀生长。 由组件主体提供的陶瓷表面被构造为包括例如呈现较高镀层生长的例如钛酸钡系陶瓷的高镀层生长区域和例如锆酸锆的低镀层生长区域 其具有相对较低的电镀生长。 构成用于限定外部端子电极的基底的第一层的电镀膜以这样的方式形成，使得以由内部电极的暴露端作为起点设置的导电表面沉积的镀覆沉积物的生长被限制为不交叉 在高电镀生长区域和低电镀生长区域之间的边界朝向低电镀生长区域。
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3.发明授权Method for manufacturing ceramic electronic component and ceramic electronic component 有权制造陶瓷电子部件和陶瓷电子部件的方法公开(公告)号：US08334748B2
公开(公告)日：2012-12-18
申请号：US13357671
申请日：2012-01-25
申请人： Syunsuke Takeuchi , Teruyo Katayama , Toshiyuki Iwanaga , Akihiro Motoki , Makoto Ogawa , Kenichi Kawasaki
发明人： Syunsuke Takeuchi , Teruyo Katayama , Toshiyuki Iwanaga , Akihiro Motoki , Makoto Ogawa , Kenichi Kawasaki
IPC分类号： H01F5/00
摘要： A method for manufacturing a ceramic electronic component includes the steps of preparing a ceramic body including a plurality of first internal electrodes and a plurality of second internal electrodes, processing the ceramic body to an internal electrode exposure rate of about 102% to about 153%, and plating the processed ceramic body to form a plated layer thereon.
摘要翻译： 陶瓷电子部件的制造方法包括以下步骤：制备包括多个第一内部电极和多个第二内部电极的陶瓷体，将所述陶瓷体加工成约102％〜约153％的内部电极曝光率， 并对其进行电镀，在其上形成镀层。
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公开(公告)号：US08508913B2
公开(公告)日：2013-08-13
申请号：US13337445
申请日：2011-12-27
申请人： Masahito Saruban , Makoto Ogawa , Wataru Ogawa , Akihiro Motoki , Syunsuke Takeuchi , Yoji Yamamoto
发明人： Masahito Saruban , Makoto Ogawa , Wataru Ogawa , Akihiro Motoki , Syunsuke Takeuchi , Yoji Yamamoto
IPC分类号： H01G4/228
摘要： In a method of manufacturing a laminate type electronic component, when a heat treatment is carried out after plating films, which at least partially define external electrodes, are formed by growing plated depositions deposited on exposed ends of a plurality of internal electrodes in a component main body, the presence of the plating films may not only interfere with moisture release, but may also cause blisters or bulge defects in the plating films, while moisture such as a plating solution in the component main body is removed by evaporation. To avoid such problems, cuts to divide exposed ends into multiple sections are formed in extending sections of internal electrodes. Thus, plating films include slits extending in the stacking direction at locations corresponding to positions of the cuts.
摘要翻译： 在层压型电子部件的制造方法中，在通过使成膜主体中的多个内部电极的露出端上沉积的镀层析出来形成至少部分地限定外部电极的镀膜之后进行热处理 电镀膜的存在不仅可以干扰湿气的释放，而且还可能导致镀膜中的起泡或凸起缺陷，同时通过蒸发除去组分主体中的电镀溶液等水分。 为了避免这种问题，在内部电极的延伸部分中形成将暴露端分割为多个部分的切割。 因此，电镀膜包括在与切口的位置相对应的位置沿堆叠方向延伸的狭缝。
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公开(公告)号：US20110235232A1
公开(公告)日：2011-09-29
申请号：US13051018
申请日：2011-03-18
IPC分类号： H01G4/00
摘要： An electronic component includes a laminate including a plurality of insulating layers that are laminated on each other. A capacitor conductor is embedded in the laminate and includes an exposed portion exposed between the insulating layers at a predetermined surface of the laminate. An external electrode is provided on the predetermined surface by direct plating so as to cover the exposed portion. An outer edge of the external electrode is spaced away from the exposed portion by about 0.8 μm or more.
摘要翻译： 电子部件包括彼此层叠的多个绝缘层的层叠体。 电容器导体嵌入层压体中，并且包括暴露在层压体的预定表面处的绝缘层之间的暴露部分。 外部电极通过直接电镀设置在预定表面上，以覆盖露出部分。 外部电极的外边缘与暴露部分间隔约0.8μm或更大。
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公开(公告)号：US09013859B2
公开(公告)日：2015-04-21
申请号：US13020886
申请日：2011-02-04
CPC分类号： H01G4/30 , H01F17/0013 , H01G4/005 , H01G13/00 , H01L41/293
摘要： A method for manufacturing a laminated electronic component in which, when first plating layers that respectively connect a plurality of internal electrodes to each other and second plating layers that improves the mountability of a laminated electronic component are formed as external terminal electrodes, the entire component main body is treated with a water repellent agent after the formation of the first plating layers, and the water repellent agent on the first plating layers is then removed before the formation of the second plating layers. The gaps between the end edges of the first plating films on the outer surface of the component main body and the outer surface of the component main body are filled with the water repellent agent.
摘要翻译： 一种层叠电子部件的制造方法，其中，当分别连接多个内部电极彼此连接的第一镀层和提高层压电子部件的安装性的第二镀层形成为外部端子电极时，整个部件主体 在形成第一镀层之后，用防水剂处理体，然后在形成第二镀层之前去除第一镀层上的防水剂。 在组件主体的外表面上的第一镀膜的端缘与部件主体的外表面之间的间隙填充有防水剂。
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公开(公告)号：US08520361B2
公开(公告)日：2013-08-27
申请号：US13045585
申请日：2011-03-11
IPC分类号： H01G4/228
CPC分类号： H01G4/30 , H01G4/232 , H01G4/2325
摘要： A laminated electronic component includes a first plating film that defines a base for external terminal electrodes and that includes a plurality of layers including a first layer made of, for example, copper and a second layer provided on the first layer. The total thickness of the first plating film is about 3 μm to about 15 μm, and the thickness of the second layer is about 2 to 10 times as thick as the thickness of the first layer. The first layer is formed by electroless plating, and the second layer is formed by electrolytic plating. This formation results in a grain size of about 0.5 μm or more of a metal grain included in the second layer, and thus makes the film less susceptible to oxidation.
摘要翻译： 层叠电子部件包括：第一镀膜，其限定外部端子电极的基部，并且包括多个层，所述多个层包括由例如铜制成的第一层和设置在第一层上的第二层。 第一镀膜的总厚度为约3μm至约15μm，第二层的厚度为第一层的厚度的约2至10倍。 第一层由无电镀形成，第二层通过电解电镀形成。 这种形成导致包含在第二层中的约0.5μm或更多的金属颗粒的晶粒尺寸，因此使得膜不易氧化。
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公开(公告)号：US08355241B2
公开(公告)日：2013-01-15
申请号：US12943072
申请日：2010-11-10
CPC分类号： H01G4/2325 , H01G4/30
摘要： A laminated electronic component includes a component body including a plurality of laminated functional layers, a plurality of internal conductors provided inside the component body, and an external terminal electrode that is electrically connected to an internal conductor via an exposed portion of the internal conductor and that is defined by a direct plating film. An average grain diameter of metal grains defining the plating film is about 0.1 μm or less.
摘要翻译： 层叠电子部件包括：具有多个层叠功能层的多个内部导体和设置在所述部件主体内侧的多个内部导体的部件体以及经由所述内部导体的露出部与内部导体电连接的外部端子电极， 由直接电镀膜定义。 限定镀膜的金属颗粒的平均粒径为约0.1μm以下。
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公开(公告)号：US09123469B2
公开(公告)日：2015-09-01
申请号：US13050977
申请日：2011-03-18
申请人： Akihiro Motoki , Syunsuke Takeuchi , Makoto Ogawa , Seiichi Nishihara , Kenichi Kawasaki , Shuji Matsumoto
发明人： Akihiro Motoki , Syunsuke Takeuchi , Makoto Ogawa , Seiichi Nishihara , Kenichi Kawasaki , Shuji Matsumoto
CPC分类号： H01G4/248 , B32B18/00 , B32B37/18 , B32B2307/202 , B32B2315/02 , B32B2457/00 , C23C18/40 , H01G4/005 , H01G4/012 , H01G4/12 , H01G4/228 , H01G4/30
摘要： In a method of forming a plating layer for an external terminal electrode by applying, for example, copper plating to an end surface of a component main body with respective ends of internal electrodes exposed, and then applying a heat treatment at a temperature of about 1000° C. or more in order to improve the adhesion strength and moisture resistance of the external terminal electrode, the plating layer may be partially melted to decrease the bonding strength of the plating layer. In the step of applying a heat treatment at a temperature of about 1000° C. or more to a component main body with plating layers formed thereon, the average rate of temperature increase from room temperature to the temperature of about 1000° C. or more is set to about 100° C./minute or more. This average rate of temperature increase maintains a moderate eutectic state in the plating layer and ensures a sufficient bonding strength of the plating layer.
摘要翻译： 在形成外部端子电极用镀层的方法中，例如通过对内部电极的两端露出的部件主体的端面进行镀铜，然后在约1000℃的温度下进行热处理 ℃以上，为了提高外部端子电极的粘合强度和耐湿性，可以使镀层部分熔融，降低镀层的接合强度。 在其上形成有镀层的组件主体上，在约1000℃以上的温度下进行热处理的步骤中，平均温度从室温升高至约1000℃以上的温度 设定为约100℃/分钟以上。 该平均升温速率在镀层中保持中等的共晶状态，并确保镀层的充分的接合强度。
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公开(公告)号：US08553391B2
公开(公告)日：2013-10-08
申请号：US13233412
申请日：2011-09-15
IPC分类号： H01G4/06
CPC分类号： H01G4/08 , H01G4/012 , H01G4/2325 , H01G4/30
摘要： In an electronic component, a laminate includes a plurality of laminated ceramic layers and a mounting surface defined by outer edges of the plurality of laminated ceramic layers, the outer edges being continuously located adjacent to each other. Capacitor conductors are disposed on the ceramic layers and include exposed portions that are exposed at the mounting surface between the ceramic layers. An electroconductive layer defining an external electrode is arranged to directly cover the exposed portions and is formed by plating so as to be made of plated material. Another electroconductive layer covers the above-mentioned electroconductive layer and partially covers surfaces of the laminate, and it is made of a material including metal and one of glass and resin.
摘要翻译： 在电子部件中，层压体包括多个层叠陶瓷层和由多个层叠陶瓷层的外边缘限定的安装面，外边缘彼此相邻地连续定位。 电容器导体设置在陶瓷层上，并且包括露出在陶瓷层之间的安装表面的暴露部分。 限定外部电极的导电层被布置成直接覆盖暴露部分，并且通过电镀形成以由电镀材料制成。 另一导电层覆盖上述导电层并且部分覆盖层压体的表面，并且由包括金属和玻璃和树脂之一的材料制成。
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