公开(公告)号：US5930382A

公开(公告)日：1999-07-27

申请号：US645475

申请日：1996-05-13

申请人： Yoko Irie ,  Hideaki Doi ,  Yasuhiko Hara ,  Tadashi Iida ,  Yasuhiro Fujishita ,  Yasuo Nakagawa ,  Takanori Ninomiya

发明人： Yoko Irie ,  Hideaki Doi ,  Yasuhiko Hara ,  Tadashi Iida ,  Yasuhiro Fujishita ,  Yasuo Nakagawa ,  Takanori Ninomiya

IPC分类号： G01N23/04 ,  G01N21/88 ,  G01N21/956 ,  G01N29/04 ,  G01R31/02 ,  G06T7/00 ,  H05K3/00 ,  G06K9/00 ,  G06K9/32 ,  G06K9/42

CPC分类号： G06T7/0004 ,  G06T2207/10116 ,  G06T2207/20044 ,  G06T2207/30141

摘要： A wiring pattern inspecting method comprises irradiating a test object provided with wiring patterns formed in a plurality of layers with x-rays, obtaining a variable-density image signal corresponding to the thickness of the wiring patterns superposed in a plurality of layers including superposed sections of the wiring patterns, extracting a plurality of image signals, the number of which corresponding to that of the superposed wiring patterns, from the variable-density image signal, and comparing end point information or isolated point information about the wiring patterns obtained from image signal representing a larger number of superposed wiring patterns, and branch information about the end points or the isolated points on the wiring points, obtained from the extracted image signal representing a smaller number of superposed wiring patterns to inspect the wiring patterns for defects in the wiring patterns. The wiring pattern inspecting method is carried out by a wiring pattern inspecting system.

摘要翻译： 布线图案检查方法包括用X射线照射设置有多层的布线图案的测试对象，获得与叠加在多个层中的布线图案的厚度相对应的可变密度图像信号，所述多个层包括叠加部分 布线图案，从可变密度图像信号中提取与叠加布线图案的数量相对应的多个图像信号的数量，以及比较从表示的图像信号获得的布线图案的终点信息或孤立点信息 从提取的图像信号中获得的表示较少数量的叠加布线图案以检查布线图案中的布线图案中的缺陷的叠加布线图案的数量以及关于布线点上的端点或隔离点的分支信息。 布线图形检查方法由布线图形检查系统进行。

公开(公告)号：US5754621A

公开(公告)日：1998-05-19

申请号：US769218

申请日：1996-12-18

申请人： Yoko Suzuki ,  Hideaki Doi ,  Yasuhiko Hara ,  Koichi Karasaki ,  Tadashi Iida

发明人： Yoko Suzuki ,  Hideaki Doi ,  Yasuhiko Hara ,  Koichi Karasaki ,  Tadashi Iida

IPC分类号： G01N23/04 ,  G01R31/304 ,  H05K3/00 ,  H05K3/46

CPC分类号： H05K3/4638 ,  G01N23/04 ,  G01R31/304 ,  H05K3/0008

摘要： An X-ray inspection apparatus and method in which an object to be inspected is irradiated with characteristic X-rays containing at least one wavelength which affords a high X-ray absorbance in the object to be inspected. A transmitted X-ray image which has passed through the object to be inspected is detected, and the object to be inspected is inspected on the basis of the transmitted X-ray image. The method and apparatus are utilized to fabricate a multi-layer printed circuit board.

摘要翻译： 一种X射线检查装置和方法，其中被检查物体用包含至少一个波长的特征X射线照射，所述波长在被检测物体中提供高X射线吸光度。 检测已经通过待检查对象的透射X射线图像，并且根据透射的X射线图像来检查被检查物体。 该方法和装置用于制造多层印刷电路板。

公开(公告)号：US20050042366A1

公开(公告)日：2005-02-24

申请号：US10959073

申请日：2004-10-07

申请人： Takeyuki Itabashi ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

发明人： Takeyuki Itabashi ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

IPC分类号： H05K1/02 ,  C23C18/38 ,  C23C18/40 ,  H05K3/18 ,  H05K3/42 ,  H05K3/46 ,  B05D1/18

CPC分类号： C23C18/40 ,  H05K3/421 ,  H05K3/422 ,  H05K3/426 ,  H05K3/429 ,  H05K2201/09518

摘要： A multilayer wiring substrate which is high in connection reliability is provided through process steps of forming more than one opening, such as a via-hole in a dielectric layer laminated on a substrate, and then applying uniform copper plating to a surface portion of the dielectric layer including the opening to thereby form a wiring layer. An electroless copper plating solution with at least one of mandelonitrile and triethyltetramine mixed therein is used to perform the intended electroless copper plating. An alternative process makes use of an electroless copper plating solution with chosen additives or “admixtures” containing at least on of mandelonitrile and triethyltetramine plus eriochrome block T along with at least one of 2,2′-bipyridyl, 1,10-phenanthroline, and 2,9-dimethyl-1,10-phenanthroline

摘要翻译： 通过在层叠在基板上的电介质层中形成多个开口（例如通孔），然后对电介质的表面部分施加均匀的镀铜，通过工艺步骤提供连接可靠性高的多层布线基板 层，从而形成布线层。 使用其中混合有扁桃腈和三乙基四胺中的至少一种的无电镀铜溶液进行预期的无电镀铜。 一种替代方法利用含有至少含有扁桃腈和三乙基四胺加色团块T的选择的添加剂或“混合物”的化学镀铜溶液以及至少一种2,2'-联吡啶，1,10-菲咯啉和 2,9-二甲基-1,10-菲咯啉

公开(公告)号：US5476210A

公开(公告)日：1995-12-19

申请号：US264356

申请日：1994-06-22

申请人： Yasuo Hodozuka ,  Tadashi Iida ,  Yoshikazu Yamaga ,  Satoshi Ueda ,  Yasuo Imaizumi

发明人： Yasuo Hodozuka ,  Tadashi Iida ,  Yoshikazu Yamaga ,  Satoshi Ueda ,  Yasuo Imaizumi

IPC分类号： B23K9/02 ,  B23K9/025 ,  F16B5/08 ,  B23K9/04

CPC分类号： F16B5/08 ,  B23K9/02 ,  B23K9/025 ,  B23K2201/16 ,  Y10T403/477

摘要： In order to join a first plate element such as a rear quarter panel of an automobile and a second plate element such as a roof panel together, an edge portion of the first plate element is provided with a joggled portion. The joggled portion is formed integrally with a general portion of the first plate element by way of a shoulder. The joggled portion includes an offset reinforcing portion having a band-shaped recess along the shoulder. A major portion lying closer to the terminal edge of the joggled portion than the reinforcing portion includes a joining surface to which an edge portion of the second plate element is joined in a face-to-face contact in such a manner that a gap is defined between an terminal edge of the edge portion and the shoulder. A welding material is built up into the recess of the reinforcing portion through the gap to thereby join the first and second plate elements together. The welding material within the recess reaches the back side of the second plate element so that the welding area is increased by the welding material and that the rigidity and strength of the joined structure is increased due to the cooperation of the reinforcing portion and the welding material. The structure prevents a local heating, suppresses thermal strains and concave thermal deformation of the two plate elements after cooling, and hence omits the hammering after the welding.

摘要翻译： 为了将诸如汽车的后四分之一面板的第一板元件和诸如屋顶板的第二板元件结合在一起，第一板元件的边缘部分设有翘曲部分。 该弯曲部分通过肩部与第一板元件的一般部分一体地形成。 弯曲部分包括具有沿着肩部的带状凹部的偏移加强部分。 位于比加强部分更靠近弯曲部分的末端边缘的主要部分包括接合表面，第二板状元件的边缘部分以面对面接触的方式接合到该接合表面，使得间隙被限定 在边缘部分的终端边缘和肩部之间。 通过间隙将焊接材料积聚在加强部的凹部中，从而将第一和第二板状部件接合在一起。 凹部内的焊接材料到达第二板状元件的背面，焊接面积增加，并且由于加强部和焊接材料的配合，接合结构的刚性和强度增加 。 该结构防止局部加热，在冷却后抑制两个板状元件的热应变和凹形热变形，因此省略了焊接后的锤击。

公开(公告)号：US20070079727A1

公开(公告)日：2007-04-12

申请号：US11634071

申请日：2006-12-06

申请人： Takeyuki Itabashi ,  Hiroshi Kanemoto ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

发明人： Takeyuki Itabashi ,  Hiroshi Kanemoto ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

IPC分类号： C23C18/40 ,  B05D1/40

CPC分类号： C23C18/1803 ,  C23C18/1653 ,  C23C18/40

摘要： This invention provides an electroless copper plating solution using glyoxylic acid as a reducing agent, which is small in the reacting quantity of Cannizzaro reaction, does not largely cause precipitation of the salt accumulated in the electroless copper plating solution by the plating reaction and Cannizzaro reaction, and can be used stably over a long period of time. The electroless copper plating solution comprises copper ion, a complexing agent for copper ion, a reducing agent for copper ion and a pH adjusting agent, wherein said reducing agent for copper ion is glyoxylic acid or a salt thereof, said pH adjusting agent is potassium hydroxide and said electroless copper plating solution contains at least one member selected from metasilicic acid, metasilicic acid salt, germanium dioxide, germanic acid salt, phosphoric acid, phosphoric acid salt, vanadic acid, vanadic acid salt, stannic acid and stannic acid salt in an amount of 0.0001 mol/L or more.

摘要翻译： 本发明提供一种使用乙醛酸作为还原剂的化学镀铜溶液，其在坎尼扎罗反应的反应量较小时，不会通过电镀反应和坎尼扎罗反应在很大程度上导致积存在化学镀铜溶液中的盐沉淀， 并可长期稳定使用。 所述无电镀铜溶液包括铜离子，铜离子络合剂，铜离子还原剂和pH调节剂，其中所述铜离子还原剂是乙醛酸或其盐，所述pH调节剂是氢氧化钾 所述化学镀铜溶液含有选自硅酸，偏硅酸盐，二氧化锗，锗酸盐，磷酸，磷酸盐，钒酸，钒酸盐，锡酸和锡酸盐中的至少一种， 为0.0001mol / L以上。

公开(公告)号：US06900394B1

公开(公告)日：2005-05-31

申请号：US09678800

申请日：2000-10-04

申请人： Takeyuki Itabashi ,  Haruo Akahoshi ,  Tadashi Iida ,  Yoshinori Ueda ,  Eiji Takai ,  Naoki Nishimura

发明人： Takeyuki Itabashi ,  Haruo Akahoshi ,  Tadashi Iida ,  Yoshinori Ueda ,  Eiji Takai ,  Naoki Nishimura

IPC分类号： H05K3/46 ,  C23C18/16 ,  C23C18/31 ,  C23C18/40 ,  H05K3/18 ,  H01R12/04 ,  H05K1/11

CPC分类号： C23C18/1617 ,  C23C18/40 ,  H05K3/187

摘要： A method is provided for removing plating blocking ions, such as anions, in pairs with copper ions and oxidant ions of a copper ion reducing agent from an electroless copper plating solution and keeping a constant salt concentration in the electroless copper plating solution during plating. The electroless copper plating method uses a plating solution containing copper sulfate as copper ion sources, and a copper ion complexing agent as copper ion sources, glyoxylic acid as a copper ion reducing agent, and a pH conditioner. The method is characterized by precipitating and removing sulfuric and oxalic ions in said electroless copper plating solution and keeping an optimum concentration of at least one of sulfuric and oxalic ions in said electroless copper plating solution during plating.

摘要翻译： 提供了一种从电化学镀铜溶液中去除铜离子还原剂的铜离子和氧化剂离子的电镀阻挡离子（例如阴离子）的方法，并且在镀覆期间在化学镀铜溶液中保持恒定的盐浓度。 无电镀铜方法使用含有硫酸铜作为铜离子源的镀液，铜离子源铜离子络合剂，作为铜离子还原剂的乙醛酸和pH调节剂。 该方法的特征在于在所述化学镀铜溶液中析出和除去硫酸和草酸离子，并且在镀覆期间保持所述无电镀铜溶液中的硫酸和草酸离子中的至少一种的最佳浓度。

公开(公告)号：US08906465B2

公开(公告)日：2014-12-09

申请号：US12452808

申请日：2008-07-18

申请人： Junya Ogawa ,  Koji Kanagawa ,  Shuichi Nakahara ,  Tadashi Iida ,  Hiroyuki Nagano ,  Yoshizumi Matsuno ,  Yasushi Nakao

发明人： Junya Ogawa ,  Koji Kanagawa ,  Shuichi Nakahara ,  Tadashi Iida ,  Hiroyuki Nagano ,  Yoshizumi Matsuno ,  Yasushi Nakao

IPC分类号： B05D5/00 ,  B05D3/02 ,  B05D7/00 ,  B05D1/02

CPC分类号： B05D7/574 ,  B05D3/0254 ,  B05D7/572 ,  B05D2202/10 ,  Y10T428/31511

摘要： This invention provides a method for forming multilayer coating film excelling in smoothness and distinctness of image, by 3-coat-1-bake system in which a step of applying onto a coating object a water-based intermediate paint (X) to form an intermediate coating film; a step of adjusting the solid content of the intermediate coating film to 70-100 mass %; a step of applying onto the intermediate coating film a water-based base coating paint (Y) containing 30-55 mass parts of alcoholic solvent having a boiling point of 170-250° C., to form a base coating film; a step of adjusting the solid content of the base coating film to 70-100 mass %; a step of applying a clear paint (Z) comprising 40-60 mass parts of carboxyl-containing compound and 60-40 mass parts of polyepoxide onto the base coating film to form a clear coating film; and heating the intermediate coating film, base coating film and clear coating film at 100-120° C. for 3-10 minutes and thereafter further heating them at 130-160° C. for 10-30 minutes; are successively carried out.

摘要翻译： 本发明提供了一种形成多层涂膜的方法，其通过3-涂层1烘烤系统的平滑度和清晰度，其中涂布在涂料上的步骤为水性中间涂料（X）以形成中间体 涂膜; 将中间涂膜的固体成分调整为70〜100质量％的工序; 向中间涂膜施加含有30-55质量份沸点为170-250℃的醇溶剂的水性底涂层（Y）的步骤，以形成基底涂膜; 调整基底涂膜的固体成分为70〜100质量％的工序。 将包含40-60质量份含羧基化合物和60-40质量份聚环氧化物的透明涂料（Z）施加到基底涂膜上以形成透明涂膜的步骤; 并在100-120℃下加热中间涂膜，底涂层和透明涂膜3-10分钟，然后在130-160℃下进一步加热10-30分钟; 相继进行。

公开(公告)号：US20050252684A1

公开(公告)日：2005-11-17

申请号：US11113011

申请日：2005-04-25

申请人： Takeyiki Itabashi ,  Haruo Akahoshi ,  Tadashi Iida ,  Yoshinori Ueda ,  Eiji Takai ,  Naoki Nishimura

发明人： Takeyiki Itabashi ,  Haruo Akahoshi ,  Tadashi Iida ,  Yoshinori Ueda ,  Eiji Takai ,  Naoki Nishimura

IPC分类号： H05K3/46 ,  C23C18/16 ,  C23C18/31 ,  C23C18/40 ,  H05K3/18 ,  H05K1/11 ,  B05D3/04 ,  B05D3/10 ,  H01R12/04

CPC分类号： C23C18/1617 ,  C23C18/40 ,  H05K3/187

摘要： A method is provided for removing plating blocking ions, such as anions, in pairs with copper ions and oxidant ions of a copper ion reducing agent from an electroless copper plating solution and keeping a constant salt concentration in the electroless copper plating solution during plating. The electroless copper plating method uses a plating solution containing copper sulfate as copper ion sources, and a copper ion complexing agent as copper ion sources, glyoxylic acid as a copper ion reducing agent, and a pH conditioner. The method is characterized by precipitating and removing sulfuric and oxalic ions in said electroless copper plating solution and keeping an optimum concentration of at least one of sulfuric and oxalic ions in said electroless copper plating solution during plating.

摘要翻译： 提供了一种从电化学镀铜溶液中去除铜离子还原剂的铜离子和氧化剂离子的电镀阻挡离子（例如阴离子）的方法，并且在镀覆期间在化学镀铜溶液中保持恒定的盐浓度。 无电镀铜方法使用含有硫酸铜作为铜离子源的镀液，铜离子源铜离子络合剂，作为铜离子还原剂的乙醛酸和pH调节剂。 该方法的特征在于在所述化学镀铜溶液中析出和除去硫酸和草酸离子，并且在镀覆期间保持所述无电镀铜溶液中的硫酸和草酸离子中的至少一种的最佳浓度。

公开(公告)号：US06831009B2

公开(公告)日：2004-12-14

申请号：US09962249

申请日：2001-09-26

申请人： Takeyuki Itabashi ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

发明人： Takeyuki Itabashi ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

IPC分类号： H01L214763

CPC分类号： C23C18/40 ,  H05K3/421 ,  H05K3/422 ,  H05K3/426 ,  H05K3/429 ,  H05K2201/09518

摘要： A multilayer wiring substrate which is high in connection reliability is provided through process steps of forming more than one opening, such as a via-hole in a dielectric layer laminated on a substrate, and then applying uniform copper plating to a surface portion of the dielectric layer including the opening to thereby form a wiring layer. An electroless copper plating solution with at least one of mandelonitrile and triethyltetramine mixed therein is used to perform the intended electroless copper plating. An alternative process makes use of a electroless copper plating solution with chosen additive agents or “admixtures” containing at least one of mandelonitrile and triethyltetramine plus eriochrome black T along with at least one of 2,2′-bipyridyl, 1,10-phenanthroline, and 2,9-dimethyl-1,10-phenanthroline.

摘要翻译： 通过在层叠在基板上的电介质层中形成多个开口（例如通孔），然后对电介质的表面部分施加均匀的镀铜，通过工艺步骤提供连接可靠性高的多层布线基板 层，从而形成布线层。 使用其中混合有扁桃腈和三乙基四胺中的至少一种的无电镀铜溶液进行预期的无电镀铜。 一种替代方法利用具有选择的添加剂的无电镀铜溶液或含有扁桃腈和三乙基四胺加上色素黑T中的至少一种的“混合物”以及2,2'-联吡啶，1,10-菲咯啉， 和2,9-二甲基-1,10-菲咯啉。

公开(公告)号：US20100129662A1

公开(公告)日：2010-05-27

申请号：US12452808

申请日：2008-07-18

申请人： Junya Ogawa ,  Koji Kanagawa ,  Shuichi Nakahara ,  Tadashi Iida ,  Hiroyuki Nagano ,  Yoshizumi Matsuno ,  Yasushi Nakao

发明人： Junya Ogawa ,  Koji Kanagawa ,  Shuichi Nakahara ,  Tadashi Iida ,  Hiroyuki Nagano ,  Yoshizumi Matsuno ,  Yasushi Nakao

IPC分类号： B05D3/02 ,  B32B27/38

CPC分类号： B05D7/574 ,  B05D3/0254 ,  B05D7/572 ,  B05D2202/10 ,  Y10T428/31511

摘要： This invention provides a method for forming multilayer coating film excelling in smoothness and distinctness of image, by 3-coat-1-bake system in which a step of applying onto a coating object a water-based intermediate paint (X) to form an intermediate coating film; a step of adjusting the solid content of the intermediate coating film to 70-100 mass %; a step of applying onto the intermediate coating film a water-based base coating paint (Y) containing 30-55 mass parts of alcoholic solvent having a boiling point of 170-250° C., to form a base coating film; a step of adjusting the solid content of the base coating film to 70-100 mass %; a step of applying a clear paint (Z) comprising 40-60 mass parts of carboxyl-containing compound and 60-40 mass parts of polyepoxide onto the base coating film to form a clear coating film; and heating the intermediate coating film, base coating film and clear coating film at 100-120° C. for 3-10 minutes and thereafter further heating them at 130-160° C. for 10-30 minutes; are successively carried out.

摘要翻译： 本发明提供了一种形成多层涂膜的方法，其通过3-涂层1烘烤系统的平滑度和清晰度，其中涂布在涂料上的步骤为水性中间涂料（X）以形成中间体 涂膜; 将中间涂膜的固体成分调整为70〜100质量％的工序; 向中间涂膜施加含有30-55质量份沸点为170-250℃的醇溶剂的水性底涂层（Y）的步骤，以形成基底涂膜; 调整基底涂膜的固体成分为70〜100质量％的工序。 将包含40-60质量份含羧基化合物和60-40质量份聚环氧化物的透明涂料（Z）施加到基底涂膜上以形成透明涂膜的步骤; 并在100-120℃下加热中间涂膜，底涂层和透明涂膜3-10分钟，然后在130-160℃下进一步加热10-30分钟; 相继进行。