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公开(公告)号：US3989179A
公开(公告)日：1976-11-02
申请号：US611622
申请日：1975-09-09
申请人： John N. Antonevich
发明人： John N. Antonevich
CPC分类号： B23K1/0012 , B23K3/0684
摘要： A method is provided for eliminating "icicles" or ligaments and other manifestations of dripping solder from articles which are dip soldered by vibrating the articles simultaneously with removing them from the solder bath and continuing to vibrate the articles until the solder thereon has at least levelled.
摘要翻译： 提供了一种消除“冰柱”或者韧带以及从焊料中浸渍焊料的其他表现，其中浸渍焊料通过同时振动制品同时从焊料槽中除去并继续振动制品直到其上的焊料至少具有水平。
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公开(公告)号：US10039194B2
公开(公告)日：2018-07-31
申请号：US14415676
申请日：2013-08-01
申请人： OSRAM SYLVANIA Inc.
发明人： Jeffery Serre , Alan Lenef , Adam Scotch
CPC分类号： H05K3/3431 , B23K1/0016 , B23K1/20 , B23K3/0684 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/95 , H01L24/97 , H01L33/62 , H01L2224/29082 , H01L2224/29105 , H01L2224/29113 , H01L2224/325 , H01L2224/83143 , H01L2224/83192 , H01L2224/8321 , H01L2224/83815 , H01L2224/83907 , H01L2224/9205 , H01L2224/95085 , H01L2224/95101 , H01L2224/95146 , H01L2224/97 , H01L2924/01322 , H05K1/111 , H05K3/3468 , H05K13/0465 , H05K2201/10992 , H05K2203/044 , H05K2203/047 , H05K2203/048 , H01L2924/00012 , H01L2924/0105
摘要： A dual solder layer for fluidic self assembly, an electrical component substrate, and method employing same is described. The dual solder layer comprises a layer of a self-assembly solder disposed on a layer of a base solder which is disposed on the solder pad of an electrical component substrate. The self-assembly solder has a liquidus temperature less than a first temperature and the base solder has a solidus temperature greater than the first temperature. The self-assembly solder liquefies at the first temperature during a fluidic self assembly method to cause electrical components to adhere to the substrate. After attachment, the substrate is removed from the bath and heated so that the base solder and self-assembly solder combine to form a composite alloy which forms the final electrical solder connection between the component and the solder pad on the substrate.
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公开(公告)号：US20100059575A1
公开(公告)日：2010-03-11
申请号：US12516359
申请日：2007-12-04
申请人： Hans Isler , Ernst Wandke
发明人： Hans Isler , Ernst Wandke
CPC分类号： B23K1/085 , B23K3/0684 , B23K2101/42 , H05K3/3447 , H05K3/3468 , H05K2203/0763
摘要： The invention relates to a device and method for selective soldering, including at least one nozzle and a soldering channel surrounded by a vertically moveable hood, which immerses in a soldering bath or which is sealed against a surface of the soldering bath. The hood includes a passage for each nozzle, at least one gas feeding device for providing protective and/or active gas underneath the hood, and flow plates which are attached to the hood to extend substantially downward in the direction of the soldering bath from the hood.
摘要翻译： 本发明涉及一种用于选择性焊接的装置和方法，包括至少一个喷嘴和由可垂直移动的罩围绕的焊接通道，其浸没在焊接槽中或密封在焊接槽的表面上。 罩包括用于每个喷嘴的通道，用于在罩下方提供保护和/或活性气体的至少一个气体供给装置，以及连接到罩的流动板，其沿着焊接槽的方向从罩向下大致向下延伸 。
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公开(公告)号：US4076167A
公开(公告)日：1978-02-28
申请号：US701299
申请日：1976-06-30
申请人： William E. Wright
发明人： William E. Wright
CPC分类号： B23K3/0684 , F28F9/26 , Y10T29/49373
摘要： Apparatus for venting a plate fin coil during the ultrasonic soldering of aluminum return bend tubes to the heat exchange tubes in the coil. The apparatus includes a process snorkel member comprising a bored plug for telescoping inside an extension tube extending from an open end of a heat exchange tube forming an end of a circuit in the coil, and a venting tube defining an air conduit from the plug to the atmosphere, whereby the pressure in the interior of the plate fin coil assembly is relieved when the fin coil is immersed in the solder bath.
摘要翻译： 用于在将铝返回弯管的超声波焊接到线圈中的热交换管的过程中，对板翅片线圈进行排气的装置。 该装置包括一个工艺通气管构件，它包括一个钻孔塞，用于在从构成线圈中的回路端部的热交换管的开口端延伸的延伸管内伸缩，以及限定从塞子到 从而当翅片线圈浸入焊料槽中时，平板翅片线圈组件内部的压力得以缓解。
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公开(公告)号：US08328069B2
公开(公告)日：2012-12-11
申请号：US12516359
申请日：2007-12-04
申请人： Hans Isler , Ernst Wandke
发明人： Hans Isler , Ernst Wandke
CPC分类号： B23K1/085 , B23K3/0684 , B23K2101/42 , H05K3/3447 , H05K3/3468 , H05K2203/0763
摘要： The invention relates to a device and method for selective soldering, including at least one nozzle and a soldering channel surrounded by a vertically moveable hood, which immerses in a soldering bath or which is sealed against a surface of the soldering bath. The hood includes a passage for each nozzle, at least one gas feeding device for providing protective and/or active gas underneath the hood, and flow plates which are attached to the hood to extend substantially downward in the direction of the soldering bath from the hood.
摘要翻译： 本发明涉及一种用于选择性焊接的装置和方法，包括至少一个喷嘴和由可垂直移动的罩围绕的焊接通道，其浸没在焊接槽中或密封在焊接槽的表面上。 罩包括用于每个喷嘴的通道，用于在罩下方提供保护和/或活性气体的至少一个气体供给装置，以及连接到罩的流动板，其沿着焊接槽的方向从罩向下大致向下延伸 。
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公开(公告)号：US4602730A
公开(公告)日：1986-07-29
申请号：US619146
申请日：1984-05-22
CPC分类号： H05K3/3468 , B23K3/0684 , H05K2203/0292 , H05K2203/1581
摘要： Device for soldering a printed board, equipped with a printed substrate conveyor, which effects soldering of chip parts on a printed substrate by moving the printed substrate through a molten solder wave formed by providing a nozzle in a solder tank accommodating molten solder, and a vibration imparter for giving vibration to the printed substrate when it is passing through the molten solder wave.
摘要翻译： PCT No.PCT / JP82 / 00382 Sec。 371日期1984年5月22日 102（e）日期1984年5月22日PCT提交1982年9月22日PCT公布。 出版物WO84 / 01258 日期：1984年3月29日。用于焊接装有印刷基板输送机的印刷电路板的装置，其通过使印刷基板通过在焊料槽中设置喷嘴而形成的熔融焊波移动来实现芯片部件在印刷基板上的焊接 容纳熔融焊料的振动，以及当印刷基板通过熔融焊料波时给印刷基板施加振动的振动片。
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公开(公告)号：US4130232A
公开(公告)日：1978-12-19
申请号：US745578
申请日：1976-11-29
申请人： Walter W. Anderson
发明人： Walter W. Anderson
CPC分类号： B23K3/0684
摘要： An improved process plug for use during immersion soldering of aluminum heat exchanger coils, such as an air conditioner evaporator. The plug allows the solder to flow into an open bell or female socket of a suction header tube to "pretin" the internal finish of the bell or tube joint while preventing the solder bath from entering the coil. The process plug is designed to achieve a "short" or reduced area joint so that the plug can be readily removed by heating. The suction header tube joint is completed by hand soldering of a precoated male copper transition tube.
摘要翻译： 一种用于铝热交换器盘管浸入焊接的改进的过程塞，例如空调蒸发器。 插头允许焊料流入抽吸集管的开口铃或母插座，以“预浸入”钟罩或管接头的内部精整，同时防止焊料槽进入线圈。 过程塞被设计成实现“短”或缩小的面积接头，使得插头可以通过加热容易地移除。 抽吸集管接头通过预涂阳极铜过渡管的手工焊接完成。
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公开(公告)号：US06082607A
公开(公告)日：2000-07-04
申请号：US384421
申请日：1999-08-27
申请人： Takahiro Itoh
发明人： Takahiro Itoh
IPC分类号： B23K1/00 , B23K1/08 , B23K3/06 , H01F41/10 , H01R43/02 , B23K1/06 , B23K5/20 , B23K20/10 , B23K31/02 , B23K31/00
CPC分类号： H01F41/10 , B23K3/0669 , B23K3/0684 , H01R43/0228 , B23K2201/32 , Y10T29/49002 , Y10T29/49179 , Y10T428/2947
摘要： Method and apparatus, by which the relative displacement between molten solder and a terminal pin is caused and further, a coating formed on an end portion of a coil is removed by molten solder and thus the terminal portion is firmly soldered to the terminal pin after removing the coating. In contrast, in the case of conventional soldering method, when a terminal pin, which is provided on a terminal base and has an end portion of a coil wound therearound, is dipped in molten solder contained in a solder bath, there is caused no relative displacement between the pin and the molten solder. Thus, sometimes, the coating formed on the coil still remains, so that the soldering connection between the terminal pin and the coil is not sufficiently achieved. However, in accordance with the method and apparatus of the present invention, the firm connection therebetween is achieved. Consequently, the reliability thereof is enhanced.
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公开(公告)号：US6073832A
公开(公告)日：2000-06-13
申请号：US82076
申请日：1998-05-21
申请人： Takahiro Itoh
发明人： Takahiro Itoh
IPC分类号： B23K1/00 , B23K1/08 , B23K3/06 , H01F41/10 , H01R43/02 , B23K31/02 , B23K35/12 , B32B27/00 , D02G3/00
CPC分类号： H01F41/10 , B23K3/0669 , B23K3/0684 , H01R43/0228 , B23K2201/32 , Y10T29/49002 , Y10T29/49179 , Y10T428/2947
摘要： Method and apparatus, by which the relative displacement between molten solder and a terminal pin is caused and further, a coating formed on an end portion of a coil is removed by molten solder and thus the terminal portion is firmly soldered to the terminal pin after removing the coating. In contrast, in the case of conventional soldering method, when a terminal pin, which is provided on a terminal base and has an end portion of a coil wound therearound, is dipped in molten solder contained in a solder bath, there is caused no relative displacement between the pin and the molten solder. Thus, sometimes, the coating formed on the coil still remains, so that the soldering connection between the terminal pin and the coil is not sufficiently achieved. However, in accordance with the method and apparatus of the present invention, the firm connection therebetween is achieved. Consequently, the reliability thereof is enhanced.
摘要翻译： 引起熔融焊料和端子销之间的相对位移的方法和装置，并且进一步地，通过熔融焊料去除在线圈的端部上形成的涂层，因此端子部分在去除之后被牢固地焊接到端子销 涂层。 相反，在常规焊接方法的情况下，当设置在端子座上并且具有卷绕在其上的线圈的端部的端子针被浸入包含在焊料槽中的熔融焊料中时，不产生相对 销和熔融焊料之间的位移。 因此，有时候，形成在线圈上的涂层仍然保留，使得端子销和线圈之间的焊接连接不能充分实现。 然而，根据本发明的方法和装置，实现了它们之间的牢固连接。 因此，其可靠性得到提高。
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公开(公告)号：US5611480A
公开(公告)日：1997-03-18
申请号：US317249
申请日：1994-10-03
CPC分类号： B23K3/0684 , B23K1/08 , H05K3/3468
摘要： In a soldering process leads of components on a circuit board are dipped into a solder bath to solder them to the underside of the board. The board is rotated about a horizontal axis as it is lifted away from the bath. This reduces the tendency to form solder bridges between closely spaced leads.
摘要翻译： 在焊接过程中，将电路板上的部件引线浸入焊料槽中以将其焊接到电路板的下侧。 当板被从浴中提起时，板绕水平轴旋转。 这减少了在紧密间隔的引线之间形成焊接桥的趋势。
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