公开(公告)号：US06008071A

公开(公告)日：1999-12-28

申请号：US649837

申请日：1996-04-30

申请人： Kazuaki Karasawa ,  Teru Nakanishi ,  Toshiya Akamatsu

发明人： Kazuaki Karasawa ,  Teru Nakanishi ,  Toshiya Akamatsu

IPC分类号： H01L21/60 ,  H05K3/04 ,  H05K3/34 ,  H01L21/283

CPC分类号： H01L24/12 ,  H01L24/11 ,  H01L24/17 ,  H05K3/3457 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/1143 ,  H01L2224/11849 ,  H01L2224/13027 ,  H01L2224/13099 ,  H01L2224/1701 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/351 ,  H05K2201/0317 ,  H05K2203/0338 ,  H05K3/048 ,  Y10T29/41

摘要： Methods for forming solder bumps on terminal pads of a semiconductor substrate for an integrated circuit device employ a solder bump transfer plate and a mask to form solder deposits on the plate. One embodiment of the invention employs a metal mask having a plurality of through holes for forming solder deposits on the solder bump transfer plate by vapor phase deposition through the through holes each area of which increases in step wise from the first surface of the mask to the second surface opposite to the first surface, thereby preventing solder deposits in the through holes from being removed when the mask is separated from the plate. Another embodiment of the invention is a solder bump transfer plate having a plurality of solder deposits on the surface non-wettable to molten solder both diameter and spacing of which are both smaller than diameter and spacing of the terminal pads on the semiconductor substrate, whereby a single solder bump is accurately formed on each of the terminal pads.

摘要翻译： 在集成电路器件的半导体衬底的端子焊盘上形成焊料凸点的方法采用焊料凸块传递板和掩模，以在板上形成焊料沉积物。 本发明的一个实施例采用金属掩模，其具有多个通孔，用于通过气相沉积在焊料凸块转移板上形成焊料沉积，该通孔的每个区域从掩模的第一表面逐步增加到通孔 与第一表面相对的第二表面，从而防止当掩模与板分离时在通孔中的焊料沉积物被去除。 本发明的另一实施例是一种焊料凸块传递板，其具有在不能熔化的焊料的表面上的多个焊料沉积物，其两个直径和间距均小于半导体衬底上的端子焊盘的直径和间距， 在每个端子焊盘上精确地形成单个焊料凸块。

公开(公告)号：US6136047A

公开(公告)日：2000-10-24

申请号：US222316

申请日：1998-12-29

申请人： Kazuaki Karasawa ,  Teru Nakanishi ,  Toshiya Akamatsu

发明人： Kazuaki Karasawa ,  Teru Nakanishi ,  Toshiya Akamatsu

IPC分类号： H01L21/60 ,  H05K3/04 ,  H05K3/34 ,  H01L23/48 ,  H01L21/00 ,  H01L21/64 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/12 ,  H01L24/11 ,  H01L24/17 ,  H05K3/3457 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/1143 ,  H01L2224/11849 ,  H01L2224/13027 ,  H01L2224/13099 ,  H01L2224/1701 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/351 ,  H05K2201/0317 ,  H05K2203/0338 ,  H05K3/048 ,  Y10T29/41

摘要： A solder bump transfer plate having a plurality of solder deposits on the surface non-wettable to molten solder both diameter and spacing of which are both smaller than diameter and spacing of the terminal pads on a semiconductor substrate.

摘要翻译： 一种焊料凸块传递板，其具有在不能润湿熔融焊料的表面上的多个焊料沉积物，其两个直径和间距均小于半导体衬底上的端子焊盘的直径和间距。

公开(公告)号：US20050062157A1

公开(公告)日：2005-03-24

申请号：US10980788

申请日：2004-11-04

申请人： Kazuaki Karasawa ,  Teru Nakanishi ,  Toshiya Akamatsu

发明人： Kazuaki Karasawa ,  Teru Nakanishi ,  Toshiya Akamatsu

IPC分类号： H01L21/60 ,  H05K3/04 ,  H05K3/34 ,  H01L23/48

CPC分类号： H01L24/12 ,  H01L24/11 ,  H01L24/17 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05644 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/1143 ,  H01L2224/11849 ,  H01L2224/13027 ,  H01L2224/13099 ,  H01L2224/1701 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/351 ,  H05K3/048 ,  H05K3/3457 ,  H05K2201/0317 ,  H05K2203/0338 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/013

摘要： Methods and apparatus for forming solder bumps on terminal pads of a semiconductor substrate for an integrated circuit device employ a solder bump transfer plate and a mask to form solder deposits on the plate. One embodiment of the invention employs a metal mask having a plurality of through holes for forming solder deposits on the solder bump transfer plate by vapor phase deposition through the through holes each area of which increases in step wise from the first surface of the mask to the second surface opposite to the first surface, thereby preventing solder deposits in the through holes from being removed when the mask is separated from the plate. Another embodiment of the invention is a solder bump transfer plate having a plurality of solder deposits on the surface non-wettable to molten solder both diameter and spacing of which are both smaller than diameter and spacing of the terminal pads on the semiconductor substrate, whereby a single solder bump is accurately formed on each of the terminal pads without a fine alignment technique.

摘要翻译： 用于在集成电路器件的半导体衬底的端子焊盘上形成焊料凸块的方法和装置采用焊料凸块转移板和掩模，以在板上形成焊料沉积物。 本发明的一个实施例采用金属掩模，其具有多个通孔，用于通过气相沉积在焊料凸块转移板上形成焊料沉积，该通孔的每个区域从掩模的第一表面逐步增加到通孔 与第一表面相对的第二表面，从而防止当掩模与板分离时在通孔中的焊料沉积物被去除。 本发明的另一实施例是一种焊料凸块传递板，其具有在不能熔化的焊料的表面上的多个焊料沉积物，其两个直径和间距均小于半导体衬底上的端子焊盘的直径和间距， 在每个端子焊盘上精确地形成单个焊料凸块，而没有精细对准技术。

公开(公告)号：US20160315059A1

公开(公告)日：2016-10-27

申请号：US14980616

申请日：2015-12-28

申请人： STMICROELECTRONICS S.R.L.

发明人： Paolo CREMA ,  Pierangelo MAGNI

IPC分类号： H01L23/00 ,  B29C67/00 ,  G05B19/418

CPC分类号： H01L24/13 ,  B33Y80/00 ,  G05B19/418 ,  G05B2219/35134 ,  G05B2219/49007 ,  H01L22/32 ,  H01L24/11 ,  H01L2224/11312 ,  H01L2224/11318 ,  H01L2224/1143 ,  H01L2224/11505 ,  H01L2224/11552 ,  H01L2224/1183 ,  H01L2224/13015 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13019 ,  H01L2224/13023 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2924/00012 ,  H01L2924/00014

摘要： An electronic component, such as an integrated circuit, includes one or more circuits with bumps extending in a longitudinal direction outward from the circuit. The bumps may be formed, e.g., by 3D printing, with at least one protrusion extending away from the longitudinal direction.

摘要翻译： 诸如集成电路的电子部件包括具有从电路向外延伸的凸起的一个或多个电路。 凸起可以例如通过3D印刷形成，其中至少一个突起远离纵向方向延伸。