公开(公告)号：US12019377B2

公开(公告)日：2024-06-25

申请号：US17299531

申请日：2019-12-04

Applicant: ASML Netherlands B.V.

Inventor： Maurits Van Der Schaar ,  Olger Victor Zwier ,  Patrick Warnaar

IPC: G03F7/00 ,  G01N21/47

CPC classification number: G03F7/70633 ,  G01N21/4788 ,  G03F7/70683

Abstract: A target for determining a performance parameter of a lithographic process, the target comprising a first sub-target formed by at least two overlapping gratings, wherein the underlying grating of the first sub-target has a first pitch and the top lying grating of the first sub-target has a second pitch, at least a second sub-target formed by at least two overlapping gratings, wherein the underlying grating of the second sub-target has a third pitch and the top lying grating of the second sub-target has a fourth pitch.

公开(公告)号：US12013647B2

公开(公告)日：2024-06-18

申请号：US17419648

申请日：2019-12-24

Applicant: ASML Netherlands B.V.

Inventor： Simon Gijsbert Josephus Mathijssen ,  Marc Johannes Noot ,  Kaustuve Bhattacharyya ,  Arie Jeffrey Den Boef ,  Grzegorz Grzela ,  Timothy Dugan Davis ,  Olger Victor Zwier ,  Ralph Timotheus Huijgen ,  Peter David Engblom ,  Jan-Willem Gemmink

IPC: G03F7/00 ,  G01N21/47 ,  G06T7/00

CPC classification number: G03F7/70633 ,  G01N21/47 ,  G06T7/0004 ,  G01N2021/4735 ,  G06T2207/30148

Abstract: A method provides the steps of receiving an image from a metrology tool, determining individual units of said image and discriminating the units which provide accurate metrology values. The images are obtained by measuring the metrology target at multiple wavelengths. The discrimination between the units, when these units are pixels in said image, is based on calculating a degree of similarity between said units.

公开(公告)号：US20240192608A1

公开(公告)日：2024-06-13

申请号：US18571913

申请日：2022-05-23

Applicant: ASML NETHERLANDS B.V.

Inventor： Shikhar BHARDWAJ

IPC: G03F7/00

CPC classification number: G03F7/70341 ,  G03F7/7085 ,  G03F7/70875 ,  G03F7/70916

Abstract: A tool for assessing a hole property of one or more holes in a component of a lithographic apparatus, the tool including: an assessment substrate; a fluid supply configured to supply a jet of fluid from each of the one or more holes to a first surface of the assessment substrate, wherein the fluid is supplied at a fluid temperature such that the one or more jets of fluid cause local temperature variations in at least part of the assessment substrate; and an infrared sensor configured to sense a temperature distribution of the assessment substrate in dependence on the local temperature variations.

公开(公告)号：US12007699B2

公开(公告)日：2024-06-11

申请号：US17787235

申请日：2020-11-13

Applicant: ASML Netherlands B.V.

Inventor： Sander Kerssemakers ,  Robert Gabriël Maria Lansbergen ,  Martinus Hendrikus Antonius Leenders ,  Henricus Gerardus Tegenbosch

IPC: G03F7/20 ,  G03F7/00 ,  H05G2/00

CPC classification number: G03F7/70841 ,  G03F7/70033 ,  G03F7/70975 ,  H05G2/005 ,  H05G2/008

Abstract: A vessel (16) for an EUV radiation source, the vessel comprising a first opening (30) for accessing an interior (32) of the vessel, a first access member (34) configured to allow or prevent access to the interior of the vessel through the first opening, a second opening (36) for accessing the interior of the vessel, the second opening being arranged in the first access member and a second access member (38) arranged on the first access member and configured to allow or prevent access to the interior of the vessel through the second opening.

公开(公告)号：US12007219B2

公开(公告)日：2024-06-11

申请号：US17282141

申请日：2019-09-09

Applicant: ASML Netherlands B.V.

Inventor： Erwin Van Dorp

IPC: G01B11/06 ,  G01B21/04 ,  G01C3/08

CPC classification number: G01B11/0608 ,  G01B21/042 ,  G01C3/08

Abstract: The invention provides an apparatus configured for determining a distance of the apparatus to an object according to the principle of triangulation. The apparatus comprises a transmissive device with a predefined distance between a first surface and a second surface of the transmissive device, and a detector that is configured to receive at least a portion of a radiation beam after interaction with the transmissive device and the object. The first surface is arranged to reflect a first part of the radiation beam, and the second surface is arranged to reflect a second part of the radiation beam. The predefined distance is used for determining the distance of the apparatus to the object.

公开(公告)号：US20240183655A1

公开(公告)日：2024-06-06

申请号：US18279030

申请日：2022-03-03

Applicant: ASML NETHERLANDS B.V.

Inventor： Alexander VON FINCK ,  Simon HALM ,  Ingo Juergen MARKEL ,  Maciej NEUMANN-RÖBISCH

IPC: G01B11/30 ,  G01N21/47 ,  G01N21/88 ,  G01N21/94

CPC classification number: G01B11/303 ,  G01N21/474 ,  G01N21/8806 ,  G01N21/94 ,  G01N2021/4742 ,  G01N2021/4783 ,  G01N2021/8835 ,  G01N2021/8845 ,  G01N2021/8848 ,  G01N2201/0612 ,  G01N2201/062 ,  G01N2201/08

Abstract: A measuring apparatus has at least two radiation sources arranged to illuminate a measuring region of a surface of a sample, the at least two sources configured to illuminate the measuring region along at least two illumination beam paths at different angles of incidence relative to a surface normal of the surface, a detector device configured to detect at least two scattered radiation images of surface sections in the illuminated measuring region at a predetermined viewing angle relative to the surface normal of the surface, portions of the scattered radiation received by the detector device, which portions are formed in each case by the illumination in one of the illumination beam paths, in each case having a common spatial frequency, and an evaluation device configured to determine at least one roughness feature of the surface sections from the at least two scattered radiation images.

公开(公告)号：US12001149B2

公开(公告)日：2024-06-04

申请号：US17428897

申请日：2020-01-24

Applicant: ASML Netherlands B.V.

Inventor： Marcus Adrianus Van De Kerkhof

IPC: G03F7/00 ,  G03F1/38 ,  G03F1/82 ,  H01L21/67

CPC classification number: G03F7/70925 ,  G03F1/38 ,  G03F1/82 ,  H01L21/67028

Abstract: A method of protecting a component of a lithographic apparatus, the method including the steps of: providing a protective cover which is shaped to protect at least part of said component, the protective cover having a contact surface which is arranged to adhere to a first surface of at least part of said lithographic apparatus or said component; and bringing the protective cover into proximity with the component so as to cause the contact surface to adhere to the lithographic apparatus or said component and remain adhered without the application of external force. It is also provided a patterning device for use in a lithographic apparatus and a lithographic apparatus.

公开(公告)号：US11999645B2

公开(公告)日：2024-06-04

申请号：US17287015

申请日：2019-10-03

Applicant: ASML NETHERLANDS B.V.

Inventor： Robbert Edgar Van Leeuwen ,  Amir Abdolvand

IPC: C03B37/00 ,  C03B37/012 ,  C03B37/027 ,  C03C25/68 ,  G01N21/956 ,  G02F1/35 ,  G02F1/365 ,  G03F7/00

CPC classification number: C03B37/0122 ,  C03B37/01228 ,  C03B37/02781 ,  C03C25/68 ,  G01N21/956 ,  G02F1/3528 ,  G02F1/365 ,  G03F7/70316 ,  C03B2203/16 ,  C03B2203/42

Abstract: An optical fiber, manufacturing intermediate for forming an optical fiber and a method for forming an optical fiber. The method includes providing a manufacturing intermediate having an elongate body and having an aperture extending through the elongate body along an axial dimension of the elongate body, a boundary of the aperture defining an internal surface of the manufacturing intermediate. The method further includes etching the internal surface of the manufacturing intermediate using an etching substance, and drawing the manufacturing intermediate along the axial dimension so as to form the optical fiber.

公开(公告)号：US11996267B2

公开(公告)日：2024-05-28

申请号：US17271667

申请日：2019-08-22

Applicant: ASML NETHERLANDS B.V.

Inventor： Ruben Cornelis Maas ,  Alexey Olegovich Polyakov ,  Teis Johan Coenen

IPC: H01J37/304 ,  G03F7/00 ,  H01J37/147 ,  H01J37/302 ,  H01J37/317 ,  H01L21/263

CPC classification number: H01J37/304 ,  G03F7/70591 ,  H01J37/1474 ,  H01J37/3023 ,  H01J37/3174 ,  H01L21/263 ,  H01J2237/31755

Abstract: A particle beam apparatus includes an object table configured to hold a semiconductor substrate; a particle beam source configured to generate a particle beam; a detector configured to detect a response of the substrate caused by interaction of the particle beam with the substrate and to output a detector signal representative of the response; and a processing unit configured to: receive or determine a location of one or more defect target areas on the substrate; control the particle beam source to inspect the one or more defect target areas; identify one or more defects within the one or more defect target areas, based on the detector signal obtained during the inspection of the one or more defect target areas; control the particle beam source to repair the one or more defects.

公开(公告)号：US11994848B2

公开(公告)日：2024-05-28

申请号：US17601503

申请日：2020-03-12

Applicant: ASML NETHERLANDS B.V.

Inventor： Johannes Onvlee ,  Arnaud Hubaux

IPC: G05B19/418

CPC classification number: G05B19/41885 ,  G05B2219/32335 ,  G05B2219/45031

Abstract: A method for configuring a semiconductor manufacturing process, the method including: providing an initial prediction model including a plurality of model parameters to one or more remote locations; receiving at least one updated model parameter from the one or more remote locations, the at least one model parameter is updated by training the initial prediction model with local data at the one or more remote locations; determining aggregated model parameters based on the at least one updated model parameter received from the one or more remote locations; and adjusting the initial prediction model based on the aggregated model parameters, the adjusted prediction model being operable to configure the semiconductor manufacturing process.