Abstract:
A lighting device has a light-bar mount and multiple light bars. The light-bar mount is integrally formed from a board. The light bars are mounted on the light-bar mount and each light bar has a heat sink, a circuit board and multiple high-power LED modules. The heat sink is detachably mounted in the light-bar mount. The circuit board is mounted in the heat sink. The high-power LED modules are mounted on the heat sink and electrically connected to the circuit board for providing outward illumination.
Abstract:
A solid-state light emitting display and a fabrication method thereof are proposed. The light emitting display includes a metallic board formed with conductive circuits, and a plurality of luminous microcrystals disposed on a surface of the metallic board and electrically connected to the conductive circuits. The metallic board provides the features of lightness and thinness, and flexibility, and the luminous microcrystals are in the form of light emitting components, so as to improve the luminous efficiency of display and attain the effect of environmental protection and energy saving, thereby providing display technology with performance satisfactory for various display requirements.
Abstract:
Amphoteric polymer composite nanoparticles are added into the polymer grains of synthetic fibers. The synthetic fibers are woven to form a textile capable of adjusting pH value.
Abstract:
A heat-dissipating plate has a casing and a supporting structure, where the casing has surrounding walls to define a receiving compartment therein confined by an inner wall. The inner wall is integrated with a capillary structure. Disposed inside the receiving compartment, the supporting structure includes a meshed partition and a plurality of columns. The meshed partition has a plurality of holes and joined-openings. The columns are fixed in the joined-openings and abut against the inner surface of the walls. The associated manufacturing process for the heat-dissipating plate is easily to accomplish.
Abstract:
A plasma deposition apparatus is provided. The plasma deposition apparatus comprises a chamber. A pedestal is placed in the chamber. A plasma generator is placed in the chamber and over the pedestal. The plasma generator comprises a plasma jet for plasma thin film deposition having a discharge direction angle θ1 larger than 0° and less than 90° between a normal direction of the pedestal and the discharge direction of the plasma jet. A gas-extracting pipe extends into the chamber and over the pedestal. The gas-extracting pipe provides a pumping path for particles and side-products having a pumping direction angle θ2 larger than 0° and less than 90° between the normal direction of the pedestal and the pumping direction of the gas-extracting pipe. The chamber is kept at an ambient atmospheric pressure.
Abstract:
A coding method and system with an adaptive bitplane coding mode is provided to code multiple bitplanes of a frame consisting of multiple macroblocks. Each bitplane consists of macroblock modes used by the macroblocks of the frame. The method includes the steps of: (A) initializing a bitplane coding mode of the frame as a compress mode; (B) coding the frame and the bitplanes to thereby obtain coded bitplanes, and calculating the bit number of coded bitplanes; (C) calculating the bit number of uncoded bitplanes; (D) executing step (A) when the bit number of coded bitplanes is smaller than the bit number of uncoded bitplanes; (E) initializing the bitplane coding mode of the frame as a raw mode when the bit number of coded bitplanes is not smaller than the bit number of uncoded bitplanes.
Abstract:
A method for processing substrates to manufacture semiconductor structures thereon includes analyzing at least one first processing parameter of a first apparatus for processing a substrate, thereby yielding at least one first throughput rate of the first apparatus. At least one second processing parameter of a second apparatus is analyzed for processing the substrate, thereby yielding at least one second throughput rate of the second apparatus. The first throughput rate and the second throughput rate are compared, thereby yielding at least one comparison result for processing the substrate.
Abstract:
Coil frames and transformers are provided. A coil frame includes a sub-coil-frame and an extended frame. The sub-coil-frame is utilized for winding a metal coil thereon. The extended frame is attached to the sub-coil-frame. The extended frame has a hole and a protrusion. The hole of the coil frame can be connected with the protrusion of another coil frame.
Abstract:
A method for the improved electroplating of copper onto a copper seed layer provides burnishing the surface of the copper seed layer. The burnishing treatment is used to enhance the platability of the copper seed layer. The burnishing may be a reverse electroplating or a sputter etching process. Following the burnishing of the seed layer, the copper layer that is electroplated onto the seed layer exhibits improved quality.