Abstract:
Provided are a chip network resistor contacting a printed circuit board (PCB) through solder balls and a semiconductor module having the chip network resistor. The chip network resistor includes: a body formed of an insulating material; a resistor formed on the body; external electrodes connected to the resistor and disposed on a lower surface of the body so as to have solder ball pad shapes; and conductive balls adhered on the external electrodes.
Abstract:
In a semiconductor device and a method of manufacturing the semiconductor device, an electric element is formed. A first insulation interlayer is formed on the electric element. A capacitor structure is formed on the first insulation interlayer. The capacitor structure vertically disposed relative to the electric element. The capacitor structure has a shape extending horizontally. Thus, a space under the capacitor structure having a relatively large area can be utilized for increasing an integration degree of the semiconductor device. Accordingly, the size of a semiconductor chip including the semiconductor device can be reduced.
Abstract:
A method of cleaning a board includes dipping a board having a surface on which an organic solderability preservative (OSP) is provided into a cleaning solution having glycolic acid, a surfactant and water.
Abstract:
Provided is an apparatus for clamping a stack of trays that allows automation and prevents distribution of particles or foreign materials during a semiconductor fabrication process. In one embodiment, the apparatus includes a frame body surrounding the stack of trays, a plurality of belt drums, and a hook. Each belt drum is attached to one side of the frame body has a belt and spiral spring. The belt is structured to securely surround the stack of trays using the elastic tension of the spiral spring member mounted in the belt drum. The hook is structured to be rotatably connected to the frame body and slid under a bottom surface of the stack of trays to secure the stack of trays.
Abstract:
A backlight unit and method of use are provided having a first light guide plate, a linear light source disposed along at least one side edge of the first light guide plate, a plurality of second light guide plates facing the first light guide plate, and a point light source disposed along at least one side edge of each second light guide plate. Accordingly, the present invention can provide a backlight unit using both a point light source and a linear light source at substantially the same time, and having superior color reproducibility and low power consumption.
Abstract:
The present invention relates to an LCD and a method for improving display thereof where a plurality of LED devices are mounted on a rear of LCD panel, and a partition which allows the plurality of the LED devices to be disposed in a plurality of partitioned areas is provided. The thickness of the partition narrows toward the LCD panel. A power supplier supplies power to the plurality of LED devices, and a controller controls the power supplier to supply the power to the LED device in each divided area sequentially and repeatedly. An LCD with improved contrast ratio while LED devices are separately driven in a plurality of partitioned areas is achieved.
Abstract:
A data line layout includes column selection lines arranged in a first direction at a layer on a memory cell array region, and data lines arranged in the first direction at the layer, the data lines being connected between I/O sense amplifiers and I/O pads.
Abstract:
Provided are method and apparatus for encoding and decoding an image by using a bit plane-based image encoding method and a block-based image encoding method respectively on bit planes based on the n-m most significant bits of an input image including n-bit pixel values and an image based on the m least significant bits of the input image.
Abstract:
Disclosed are a hinge unit which couples a first member and a second member, the hinge unit including: a conic shaft which is coupled to the first member, and comprises a hinge pivot, a conic unit of a truncated cone shape, the radius of which is extended in an end area of the hinge pivot, and a first rocking unit formed to an outer surface of the conic unit; and a conic sleeve which is coupled to the second member, and comprises a sleeve main body formed with a conic accommodating unit having a shape corresponding to the conic unit in an inner part of the conic accommodating unit, and a second rocking unit formed to an inner surface of the conic accommodating unit to be coupled with the first rocking unit.
Abstract:
Provided are methods of forming a phase change memory device. A semiconductor device having a lower electrode and an interlayer insulating layer may be prepared. The lower electrode may be surrounded by the interlayer insulating layer. Source gases, a reaction gas and a purge gas may be injected into a process chamber of a semiconductor fabrication device to form a phase change material layer on a semiconductor substrate. The source gases may be simultaneously injected into the process chamber. The phase change material layer may be in contact with the lower electrode through the interlayer insulating layer. The phase change material layer may be etched to form a phase change memory cell in the interlayer insulating layer. An upper electrode may be formed on the phase change memory cell.