公开(公告)号：US20060166477A1

公开(公告)日：2006-07-27

申请号：US11041952

申请日：2005-01-26

Applicant: Bily Wang ,  Jonnie Chuang ,  Chuan-Fa Lin ,  Chi-Wen Hung

Inventor： Bily Wang ,  Jonnie Chuang ,  Chuan-Fa Lin ,  Chi-Wen Hung

IPC: H01L21/44

CPC classification number: H01L23/60 ,  H01L23/544 ,  H01L24/48 ,  H01L25/167 ,  H01L27/0248 ,  H01L2223/54493 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A wafer-level electro-optical semiconductor fabrication mechanism and method for the same which improves upon traditional electro-optical semiconductor grain packaging methods. The present invention electrically connects semiconductor grains to the grains on a top surface of a wafer. this is done by either screen-printing or steel board-printing solder or silver paste onto the wafer. After that, the wafer is processed using the following steps: processing the devices, bonding with wire, packaging the wafer and finally cutting the wafer. Using this method raises the production yield while production times and costs are reduced. The wafer-level electro-optical semiconductor fabrication mechanism comprises: a wafer, an electro-optical semiconductor grain and conductive materials.

Abstract translation: 一种用于改进传统电光半导体晶粒封装方法的晶片级电光半导体制造机构及其方法。 本发明将半导体晶粒与晶片的顶表面上的晶粒电连接。 这可以通过丝网印刷或钢板印刷焊料或银浆在晶片上完成。 之后，使用以下步骤处理晶片：处理器件，用导线接合，封装晶片并最终切割晶片。 使用这种方法提高了生产率，同时降低了生产时间和成本。 晶片级电光半导体制造机构包括：晶片，电光半导体晶粒和导电材料。

公开(公告)号：US20060071328A1

公开(公告)日：2006-04-06

申请号：US11240405

申请日：2005-10-03

Applicant: Bily Wang ,  Jonnie Chuang ,  Shih-Yu Wu

Inventor： Bily Wang ,  Jonnie Chuang ,  Shih-Yu Wu

IPC: H01L23/34

CPC classification number: H01L23/3735 ,  H01L23/13 ,  H01L33/641 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

Abstract: A semiconductor substrate structure with a highly heat-conductive advantage increases packaging good rate and quality. Using semiconductor chip packaging, an electronic chip is easily made highly heat-conductive, and compared with the prior art, the present invention has superior good rate for substrate structure. The improved heat-conductive structure avoids the semiconductor chip overheating and affects the life of electronic device by directly connecting the chip to the heat-conductive base plate.

Abstract translation: 具有高导热性的半导体衬底结构增加了封装的良好率和质量。 使用半导体芯片封装，电子芯片容易制成高导热性，与现有技术相比，本发明具有优异的基板结构优良率。 改进的导热结构避免了半导体芯片过热，并通过将芯片直接连接到导热基板来影响电子器件的使用寿命。

公开(公告)号：US20060044796A1

公开(公告)日：2006-03-02

申请号：US10923687

申请日：2004-08-24

Applicant: Bily Wang ,  Jonnie Chuang ,  John Lin

Inventor： Bily Wang ,  Jonnie Chuang ,  John Lin

IPC: F21S13/14 ,  F21V21/00

CPC classification number: G09F9/33

Abstract: A mixing light board which shows specific pattern is described. The present invention have some advantages, including simple construction, easy production, thinness and cheapness. The mixing light board has a body with a front surface and a back surface. A plurality of conducting material is set on the front surface of the body. A plurality of LEDs is mounted by SMT on the front surface of the body, and the plurality of LEDs is arranged to form a specific pattern. The mixing light board can be made to fit demands.

Abstract translation: 描述具有特定图案的混合灯板。 本发明具有结构简单，生产方便，薄度小廉价等优点。 混合灯板具有前表面和后表面的主体。 多个导电材料设置在主体的前表面上。 多个LED通过SMT安装在主体的前表面上，并且多个LED被布置成形成特定图案。 混合灯板可以满足需求。

公开(公告)号：US20060034085A1

公开(公告)日：2006-02-16

申请号：US10915539

申请日：2004-08-11

Applicant: Bily Wang ,  Jonnie Chuang ,  Heng-Yen Lee

Inventor： Bily Wang ,  Jonnie Chuang ,  Heng-Yen Lee

IPC: F21V29/00

CPC classification number: F21V29/76 ,  F21K9/00 ,  F21V29/74 ,  F21Y2105/10 ,  F21Y2115/10

Abstract: A water-cooling heat dissipation device adopted for a lighting module that includes a plurality of LEDs modulized together, and includes a heat dissipation plate, at least one curved canal recessed inside the heat dissipation plate, at least one inlet formed on one of the sides of the heat dissipation plate selectively, and at least one outlet formed on one of the sides of the heat dissipation plate selectively. The curved canal created as a part of the heat dissipation plate runs laterally and includes at least one bending portion arranged thereon. The inlet and the outlet communicate with the bending portion and a free end of the curved canal in alternative manners, respectively. The lighting module contacts a top of the heat dissipation device directly.

Abstract translation: 一种用于照明模块的水冷散热装置，其包括模块化的多个LED，并且包括散热板，在散热板内凹入的至少一个弯曲槽，形成在所述散热板的一侧上的至少一个入口 选择性地形成散热片，以及至少一个出口选择性地形成在散热片的一侧上。 作为散热板的一部分产生的弯曲的管道横向延伸并且包括布置在其上的至少一个弯曲部分。 入口和出口分别与弯曲部分和弯曲管道的自由端分别连通。 照明模块直接接触散热装置的顶部。

公开(公告)号：USD509195S1

公开(公告)日：2005-09-06

申请号：US29179243

申请日：2003-04-08

Applicant: Bily Wang ,  Jonnie Chuang ,  Yann Lee

Designer： Bily Wang ,  Jonnie Chuang ,  Yann Lee

公开(公告)号：US06919584B2

公开(公告)日：2005-07-19

申请号：US10677783

申请日：2003-10-03

Applicant: Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin

Inventor： Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin

IPC: H01L25/075 ,  H01L33/50 ,  H01L29/06

CPC classification number: H01L25/0753 ,  F21Y2113/17 ,  F21Y2115/10 ,  H01L33/504 ,  H01L2924/0002 ,  Y10S257/918 ,  H01L2924/00

Abstract: A colorless light approaching that of white light in nature, is produced by using a blue color LEDs and a green color LED are covered with a red color phosphorescent glue and a yellow phosphorescent glue in separate layers or a mixed layer.

Abstract translation: 通过使用蓝色LED产生白色光的无色光，绿色LED由分开的层或混合层中的红色磷光胶和黄色磷光胶覆盖。

公开(公告)号：US20050128767A1

公开(公告)日：2005-06-16

申请号：US10731097

申请日：2003-12-10

Applicant: Bily Wang ,  Jonnie Chuang ,  Chi-Wen Hung

Inventor： Bily Wang ,  Jonnie Chuang ,  Chi-Wen Hung

IPC: F21V7/04 ,  H01L25/075 ,  H01L25/16

CPC classification number: H01L25/167 ,  H01L25/0753 ,  H01L2224/48137

Abstract: A light source structure for a light emitting diode (LED) has a high modulating flexibility and a low manufacturing cost. The LED light source is a white light source for an electrical device. The LED light source structure is used to meet the illumination requirement of the electrical device and the benefit from the light source structure of LED is more modulating ability with a small volume. The Led light source structure has an electrical circuit substrate, a red light LED chip, a green light LED chip, a blue light LED chip, a controlling integral circuit chip and a certain shape of packaging material.

Abstract translation: 用于发光二极管（LED）的光源结构具有高调制灵活性和低制造成本。 LED光源是用于电气设备的白色光源。 LED光源结构用于满足电气设备的照明要求，LED的光源结构受益于较小的体积调制能力。 LED光源结构具有电路基板，红光LED芯片，绿光LED芯片，蓝光LED芯片，控制集成电路芯片和一定形状的封装材料。

公开(公告)号：US06841934B2

公开(公告)日：2005-01-11

申请号：US10372848

申请日：2003-02-26

Applicant: Bily Wang ,  Jonnie Chuang ,  Yann Lee

Inventor： Bily Wang ,  Jonnie Chuang ,  Yann Lee

IPC: H01J1/62 ,  H01L33/50 ,  H01L33/54 ,  H01L33/62 ,  H05B33/00 ,  H05B33/04

CPC classification number: H01L33/505 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48247 ,  H05B33/04 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A white light source is obtained by converting short wavelength color light emitted from a light emitting diode (LED). The conversion is achieved by covering the LED chip with a fluorescent glue. The LED chip is mounted on a split substrate, and the outer ends of the substrate serve as terminals for the LED. A wall may be erected around the LED chip to contain the fluorescent glue, and another transparent glue may be used to cover the fluorescent glue for protection.

Abstract translation: 通过转换从发光二极管（LED）发射的短波长颜色光获得白色光源。 通过用荧光胶覆盖LED芯片来实现转换。 LED芯片安装在分离的基板上，并且基板的外端用作LED的端子。 可以在LED芯片周围竖起一个墙壁以容纳荧光胶，另外透明胶可以用来覆盖荧光胶以进行保护。

公开(公告)号：US06574254B1

公开(公告)日：2003-06-03

申请号：US10068531

申请日：2002-02-08

Applicant: Bily Wang

Inventor： Bily Wang

IPC: H01S304

CPC classification number: H01S5/02248 ,  H01L2224/48091 ,  H01S5/02216 ,  H01S5/02228 ,  H01S5/0683 ,  H01L2924/00014

Abstract: Thick metal plates are used both as leads and substrate of a laser diode package. The laser diode and the metal plate are covered with a sealing glue up to the outside end of the laser diode to form a unitary structure. The thick metal plates serve as a heat sink. The outside end of the laser diode is not covered with glue so that the emitted is not attenuated. A photo diode is used to monitor the emitted light intensity. The photo diode can share a common electrode with the laser diode by mounting the photo diode on a step-down metal plate, so that the light emitted from the inside end of the laser diode is only partially blocked.

Abstract translation: 厚金属板既用作激光二极管封装的引线和衬底。 激光二极管和金属板被密封胶覆盖直到激光二极管的外端，以形成一体的结构。 厚金属板作为散热片。 激光二极管的外端没有被胶水覆盖，使得发射的光不被衰减。 光二极管用于监测发射光强度。 光电二极管可以通过将光电二极管安装在降压金属板上而与激光二极管共享公共电极，使得从激光二极管的内部端发射的光仅部分被阻挡。

公开(公告)号：US06307479B1

公开(公告)日：2001-10-23

申请号：US09633772

申请日：2000-08-07

Applicant: Bily Wang

Inventor： Bily Wang

IPC: G08B2100

CPC classification number: H01L23/495 ,  G01R19/15 ,  G01R31/2884 ,  H01L23/50 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/10161 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: A light emitting diode (LED) is connected in series with the power supply input pad of an integrated circuit chip. The LED lights up when the power supply is turned on as an indicator that the IC is operating properly.

Abstract translation: 发光二极管（LED）与集成电路芯片的电源输入焊盘串联连接。 当电源打开时，LED指示灯亮起，作为IC正常工作的指示灯。