公开(公告)号：US20130203257A1

公开(公告)日：2013-08-08

申请号：US13368144

申请日：2012-02-07

Applicant: Ho Wei De ,  Ming-Feng Shieh ,  Ching-Yu Chang

Inventor： Ho Wei De ,  Ming-Feng Shieh ,  Ching-Yu Chang

IPC: H01L21/302 ,  H01L31/18

CPC classification number: H01L21/845 ,  G03F1/00 ,  H01L21/823431

Abstract: A method for patterning a plurality of features in a non-rectangular pattern on an integrated circuit device includes providing a substrate including a surface with a first layer and a second layer, forming a plurality of elongated protrusions in a third layer above the first and second layers, and forming a first patterned layer over the plurality of elongated protrusions. The plurality of elongated protrusions are etched to form a first pattern of the elongated protrusions, the first pattern including at least one inside corner. The method also includes forming a second patterned layer over the first pattern of elongated protrusions and forming a third patterned layer over the first pattern of elongated protrusions. The plurality of elongated protrusions are etched using the second and third patterned layers to form a second pattern of the elongated protrusions, the second pattern including at least one inside corner.

Abstract translation: 一种用于在集成电路器件上以非矩形图案形成多个特征的方法包括提供包括具有第一层和第二层的表面的衬底，在第一和第二层上方的第三层中形成多个细长突起 层，并且在所述多个细长突起上形成第一图案化层。 多个细长突起被蚀刻以形成细长突起的第一图案，第一图案包括至少一个内角。 该方法还包括在细长突起的第一图案上方形成第二图案化层，并在第一图案的细长突起上形成第三图案化层。 使用第二和第三图案化层来蚀刻多个细长突起，以形成细长突起的第二图案，第二图案包括至少一个内角。

公开(公告)号：US20130164938A1

公开(公告)日：2013-06-27

申请号：US13335618

申请日：2011-12-22

Applicant: Ming-Feng Shieh ,  Ching-Yu Chang

Inventor： Ming-Feng Shieh ,  Ching-Yu Chang

IPC: H01L21/311 ,  G03F7/20

CPC classification number: H01L21/0337 ,  H01L21/0273

Abstract: A method includes forming a photo resist pattern, and performing a light-exposure on a first portion of the photo resist pattern, wherein a second portion of the photo resist pattern is not exposed to light. A photo-acid reactive material is coated on the first portion and the second portion of the photo resist pattern. The photo-acid reactive material reacts with the photo resist pattern to form a film. Portions of the photo-acid reactive material that do not react with the photo resist pattern are then removed, and the film is left on the photo resist pattern.

Abstract translation: 一种方法包括形成光致抗蚀剂图案，并对光致抗蚀剂图案的第一部分进行曝光，其中光致抗蚀剂图案的第二部分不暴露于光。 在光致抗蚀剂图案的第一部分和第二部分上涂覆光酸反应性材料。 光酸反应性材料与光致抗蚀剂图案反应形成膜。 然后除去与光致抗蚀剂图案不反应的光酸反应性材料的部分，并且将膜留在光致抗蚀剂图案上。

公开(公告)号：US08258056B2

公开(公告)日：2012-09-04

申请号：US12814172

申请日：2010-06-11

Applicant: Ching-Yu Chang

Inventor： Ching-Yu Chang

IPC: H01L21/00

CPC classification number: H01L21/76811 ,  H01L21/76807 ,  H01L21/76813 ,  H01L21/7684 ,  H01L23/522 ,  H01L23/5226 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method of lithography patterning includes forming a first material layer on a substrate; forming a first patterned resist layer including at least one opening therein on the first material layer; forming a second material layer on the first patterned resist layer and the first material layer; forming a second patterned resist layer including at least one opening therein on the second material layer; and etching the first and second material layers uncovered by the first and second patterned resist layers.

Abstract translation: 光刻图案的方法包括在基底上形成第一材料层; 在所述第一材料层上形成包括至少一个开口的第一图案化抗蚀剂层; 在所述第一图案化抗蚀剂层和所述第一材料层上形成第二材料层; 在所述第二材料层上形成包括其中的至少一个开口的第二图案化抗蚀剂层; 以及蚀刻由第一和第二图案化抗蚀剂层未覆盖的第一和第二材料层。

公开(公告)号：US08216767B2

公开(公告)日：2012-07-10

申请号：US12555145

申请日：2009-09-08

Applicant: Chien-Wei Wang ,  Ching-Yu Chang ,  Tsai-Sheng Gau ,  Burn Jeng Lin

Inventor： Chien-Wei Wang ,  Ching-Yu Chang ,  Tsai-Sheng Gau ,  Burn Jeng Lin

IPC: G03F7/00 ,  G03F7/004 ,  G03F7/40 ,  G03F7/028

CPC classification number: G03F7/0045 ,  Y10S430/106 ,  Y10S430/114 ,  Y10S430/12 ,  Y10S430/128

Abstract: A method for fabricating an integrated circuit device is disclosed. The method includes providing a substrate; forming a first material layer over the substrate; forming a second material layer over the first material layer, wherein the second material layer comprises a photodegradable base material; and exposing at least a portion of the second material layer.

Abstract translation: 公开了一种用于制造集成电路器件的方法。 该方法包括提供基板; 在所述衬底上形成第一材料层; 在所述第一材料层上形成第二材料层，其中所述第二材料层包含可光降解的基材; 并暴露第二材料层的至少一部分。

公开(公告)号：US08183162B2

公开(公告)日：2012-05-22

申请号：US12536805

申请日：2009-08-06

Applicant: Ching-Yu Chang

Inventor： Ching-Yu Chang

IPC: H01L21/302

CPC classification number: H01L21/32139 ,  H01L21/31111 ,  H01L21/31133

Abstract: The present disclosure provides a method for making a semiconductor device. The method includes forming a material layer on a substrate; forming a sacrificial layer on the material layer, where the material layer and sacrificial layer each as a thickness less than 100 angstrom; forming a patterned photoresist layer on the sacrificial layer; applying a first wet etching process to etch the sacrificial layer to form a patterned sacrificial layer using the patterned photoresist layer as a mask; applying a second wet etching process to etch the first material layer; and applying a third wet etching process to remove the patterned sacrificial layer.

Abstract translation: 本公开提供了制造半导体器件的方法。 该方法包括在基板上形成材料层; 在材料层上形成牺牲层，其中材料层和牺牲层各自的厚度小于100埃; 在所述牺牲层上形成图案化的光致抗蚀剂层; 施加第一湿蚀刻工艺以蚀刻牺牲层以使用图案化的光致抗蚀剂层作为掩模形成图案化的牺牲层; 施加第二湿蚀刻工艺以蚀刻第一材料层; 以及施加第三湿蚀刻工艺以去除图案化的牺牲层。

公开(公告)号：US08163655B2

公开(公告)日：2012-04-24

申请号：US12560164

申请日：2009-09-15

Applicant: Ching-Yu Chang

Inventor： Ching-Yu Chang

IPC: H01L21/302

CPC classification number: H01L21/28123 ,  H01L21/0271 ,  H01L21/28079 ,  H01L21/28088 ,  H01L21/31111 ,  H01L21/31133 ,  H01L21/32132 ,  H01L21/32139 ,  H01L29/517

Abstract: The present disclosure provides a method for making a semiconductor device. The method includes forming a first material layer on a substrate; forming a second material layer on the first material layer; forming a sacrificial layer on the second material layer; forming a patterned resist layer on the sacrificial layer; applying a first wet etching process using a first etch solution to the substrate to pattern the sacrificial layer using the patterned resist layer as a mask, resulting in a patterned sacrificial layer; applying an ammonia hydroxide-hydrogen peroxide-water mixture (APM) solution to the substrate to pattern the second material layer, resulting in a patterned second material layer; applying a second wet etching process using a second etch solution to the substrate to pattern the first material layer; and applying a third wet etching process using a third etch solution to remove the patterned sacrificial layer.

Abstract translation: 本公开提供了制造半导体器件的方法。 该方法包括在基底上形成第一材料层; 在所述第一材料层上形成第二材料层; 在所述第二材料层上形成牺牲层; 在所述牺牲层上形成图案化的抗蚀剂层; 将使用第一蚀刻溶液的第一湿蚀刻工艺应用于衬底，以使用图案化的抗蚀剂层作为掩模对牺牲层进行图案化，得到图案化的牺牲层; 将氨氢氧化物 - 过氧化氢 - 水混合物（APM）溶液施加到所述基底上以对所述第二材料层进行图案化，得到图案化的第二材料层; 使用第二蚀刻溶液将第二湿蚀刻工艺应用于所述衬底以对所述第一材料层进行图案化; 以及使用第三蚀刻溶液施加第三湿蚀刻工艺以去除图案化的牺牲层。

公开(公告)号：US08125611B2

公开(公告)日：2012-02-28

申请号：US11762651

申请日：2007-06-13

Applicant: Ching-Yu Chang ,  Tsai-Sheng Gau ,  Burn Jeng Lin

Inventor： Ching-Yu Chang ,  Tsai-Sheng Gau ,  Burn Jeng Lin

IPC: G03B27/42 ,  G03B27/52 ,  G03B27/58

CPC classification number: G03F7/70341

Abstract: Immersion lithography apparatus and method using a shield module are provided. An immersion lithography apparatus including a lens module having an imaging lens, a substrate table positioned beneath the lens module and configured for holding a substrate for processing, a fluid module for providing an immersion fluid to a space between the lens module and the substrate on the substrate table, and a shield module for covering an edge of the substrate during processing.

Abstract translation: 提供了使用屏蔽模块的浸渍光刻设备和方法。 一种浸没式光刻设备，包括具有成像透镜的透镜模块，位于透镜模块下方的被配置用于保持用于处理的基板的基板台，用于在透镜模块和基板之间的空间中提供浸没流体的流体模块 衬底台和用于在处理期间覆盖衬底的边缘的屏蔽模块。

公开(公告)号：US20120034558A1

公开(公告)日：2012-02-09

申请号：US12913191

申请日：2010-10-27

Applicant: Ching-Yu Chang

Inventor： Ching-Yu Chang

IPC: G03F7/004 ,  G03F7/20

CPC classification number: G03F7/0046 ,  G03F7/0382 ,  G03F7/0392 ,  G03F7/2041

Abstract: A photolithography material is provided. The photolithography material is a surface modifying material. The photolithography material includes a polymer (e.g., fluorine polymer) that includes less than approximately 80% hydroxyl groups. In an embodiment, the photolithography material includes less than approximately 80% fluoro-alcohol functional units. Methods of using the photolithography material include as an additive to a photoresist or topcoat layer. The photolithography material may be used in an immersion lithography process.

Abstract translation: 提供光刻材料。 光刻材料是表面改性材料。 光刻材料包括包含小于约80％羟基的聚合物（例如氟聚合物）。 在一个实施例中，光刻材料包括少于约80％的氟 - 醇官能单元。 使用光刻材料的方法包括作为光致抗蚀剂或顶涂层的添加剂。 光刻材料可以用于浸没式光刻工艺。

公开(公告)号：US08046860B2

公开(公告)日：2011-11-01

申请号：US12885630

申请日：2010-09-20

Applicant: Chen-Yuan Hsia ,  Chang-Cheng Hung ,  Chi-Lun Lu ,  Shih-Ming Chang ,  Wen-Chuan Wang ,  Yen-Bin Huang ,  Ching-Yu Chang ,  Chin-Hsiang Lin

Inventor： Chen-Yuan Hsia ,  Chang-Cheng Hung ,  Chi-Lun Lu ,  Shih-Ming Chang ,  Wen-Chuan Wang ,  Yen-Bin Huang ,  Ching-Yu Chang ,  Chin-Hsiang Lin

IPC: A47L13/40

CPC classification number: B08B6/00 ,  B08B5/00 ,  H01L21/02057 ,  H01L21/67017 ,  H01L21/67051

Abstract: A system for semiconductor wafer manufacturing, comprises a chamber process path for processing the wafer, and a device operable to remove particles from the wafer by electrostatic and electromagnetic methodologies wherein the device is installed in the chamber process path.

Abstract translation: 一种用于半导体晶片制造的系统，包括用于处理晶片的腔室处理路径，以及可操作以通过静电和电磁方法从晶片去除颗粒的装置，其中该装置安装在室过程路径中。

公开(公告)号：US07986395B2

公开(公告)日：2011-07-26

申请号：US11427421

申请日：2006-06-29

Applicant: Ching-Yu Chang ,  Burn Jeng Lin ,  Chin-Hsiang Lin

Inventor： Ching-Yu Chang ,  Burn Jeng Lin ,  Chin-Hsiang Lin

IPC: G03B27/42

CPC classification number: G03F7/70925 ,  G03F7/70341

Abstract: A lithography apparatus includes an imaging lens module; a substrate table positioned underlying the imaging lens module and configured to hold a substrate; and a cleaning module adapted to clean the lithography apparatus. The cleaning module is selected from the group consisting of an ultrasonic unit, a scrubber, a fluid jet, an electrostatic cleaner, and combinations thereof.

Abstract translation: 光刻设备包括成像透镜模块; 位于所述成像透镜模块下方且被配置为保持基板的基板台; 以及适于清洁光刻设备的清洁模块。 清洁模块选自超声波单元，洗涤器，流体射流，静电清洁器及其组合。