公开(公告)号：US20050110123A1

公开(公告)日：2005-05-26

申请号：US10957927

申请日：2004-10-04

申请人： Gunther Waitl ,  Herbert Brunner

发明人： Gunther Waitl ,  Herbert Brunner

IPC分类号： H01L31/02 ,  H01L31/0203 ,  H01L33/48 ,  H01L33/62 ,  H01L29/22

CPC分类号： H01L33/486 ,  H01L24/45 ,  H01L31/0203 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

摘要： A housing accommodating a semiconductor chip is set out. The housing and chip may be used for sending and/or receiving radiation. Popular applications of the housing may be in light emitting diodes. The housing includes a conductor strip that is punched into two electrically isolated portions. The housing further includes a cavity extending inwards from the top of the housing. The conductor portions include respective areas that are exposed at the bottom of the cavity. The semiconductor chip is bonded to one of the exposed areas and a wire bonds the chip to the second exposed area. The conductor portions also terminate in exposed electrodes, which allow for electrical connection of the chip with external devices. A window is formed in the cavity and the walls of the housing that form the cavity may be made of a reflective material. The electrodes remain unexposed to the window but for any residual areas about the chip and bonding wire within the first and second exposed areas. By minimizing the area of the conductor exposed to the window, delamination brought about by the different thermal expansions of the window and conductor are minimized and/or eliminated. Likewise, with a reflective housing covering the base of the cavity that accommodates the window, internal radiation reflection is increased over that which was achieved with an exposed conductor.

公开(公告)号：US06897490B2

公开(公告)日：2005-05-24

申请号：US10281263

申请日：2002-10-28

申请人： Herbert Brunner ,  Alexandra Debray ,  Harald Jāger ,  Günther Waitl

发明人： Herbert Brunner ,  Alexandra Debray ,  Harald Jāger ,  Günther Waitl

IPC分类号： H01L33/48 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L29/22

CPC分类号： H01L33/486 ,  H01L33/505 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00012 ,  H01L2224/4554

摘要： The invention describes a radiation-emitting semiconductor component with a luminescent conversion element, at which the semiconductor body is placed in a recess of the base body. A cup-like area is molded inside of the recess around the semiconductor body, which contains the luminescent conversion element and coats the semiconductor body. The cup-like portion is formed as indentation inside of the recess or as annular border on the base of the recess.

公开(公告)号：US06858879B2

公开(公告)日：2005-02-22

申请号：US10616070

申请日：2003-07-09

申请人： Gunther Waitl ,  Herbert Brunner

发明人： Gunther Waitl ,  Herbert Brunner

IPC分类号： H01L31/02 ,  H01L31/0203 ,  H01L33/48 ,  H01L33/62 ,  H01L33/00

CPC分类号： H01L33/486 ,  H01L24/45 ,  H01L31/0203 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

摘要： A housing accommodating a semiconductor chip is set out. The housing and chip may be used for sending and/or receiving radiation. Popular applications of the housing may be in light emitting diodes. The housing includes a conductor strip that is punched into two electrically isolated portions. The housing further includes a cavity extending inwards from the top of the housing. The conductor portions include respective areas that are exposed at the bottom of the cavity. The semiconductor chip is bonded to one of the exposed areas and a wire bonds the chip to the second exposed area. The conductor portions also terminate in exposed electrodes, which allow for electrical connection of the chip with external devices. A window is formed in the cavity and the walls of the housing that form the cavity may be made of a reflective material. The electrodes remain unexposed to the window but for any residual areas about the chip and bonding wire within the first and second exposed areas. By minimizing the area of the conductor exposed to the window, delamination brought about by the different thermal expansions of the window and conductor are minimized and/or eliminated. Likewise, with a reflective housing covering the base of the cavity that accommodates the window, internal radiation reflection is increased over that which was achieved with an exposed conductor.

摘要翻译： 设置容纳半导体芯片的壳体。 外壳和芯片可用于发送和/或接收辐射。 外壳的热门应用可能在发光二极管中。 壳体包括被冲压成两个电隔离部分的导体条。 壳体还包括从壳体的顶部向内延伸的腔体。 导体部分包括暴露在空腔底部的相应区域。 半导体芯片被接合到一个暴露区域，并且引线将芯片连接到第二暴露区域。 导体部分也终止在暴露的电极中，这允许芯片与外部装置的电连接。 在空腔中形成窗口，并且形成空腔的壳体的壁可以由反射材料制成。 电极保持未暴露于窗口，但是对于芯片周围的任何残留区域以及在第一和第二暴露区域内的接合线。 通过使暴露于窗户的导体的面积最小化，窗口和导体的不同热膨胀引起的分层被最小化和/或消除。 类似地，通过覆盖容纳窗口的空腔的底部的反射壳体，内部辐射反射增加超过用暴露的导体实现的反射。

公开(公告)号：US06716673B2

公开(公告)日：2004-04-06

申请号：US10147672

申请日：2002-05-15

申请人： Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

发明人： Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

IPC分类号： H01L2348

CPC分类号： H01L33/486 ,  H01L31/0203 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K3/3426 ,  H05K2201/10454 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/613 ,  H01L2924/00014

摘要： In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip is encapsulated as a solder terminal. No trimming or shaping process is required and the housing is tight and is capable of further miniaturization. The solder terminals as punched parts of the leadframe are conducted projecting laterally from the housing sidewalls residing opposite one another at least up to the housing floor which forms the components' mounting surface. The chip mounting surface and the components' mounting surface form a right angle with one another.

摘要翻译： 在用于半导体部件的引线框架技术的两极SMT微型外壳中，半导体芯片安装在一个引线框架部分上并与另外的引线框部分接触。 另外的引线框架部分被从芯片封装的壳体中导出，作为焊接端子。 不需要修整或成形工艺，并且外壳紧凑并且能够进一步小型化。 作为引线框架的冲压部分的焊接端子从彼此相对的壳体侧壁横向突出，至少直到形成部件安装表面的壳体底板。 芯片安装表面和部件的安装表面彼此成直角。

公开(公告)号：USRE37554E1

公开(公告)日：2002-02-19

申请号：US09776462

申请日：2000-10-25

申请人： Herbert Brunner ,  Heinz Haas ,  Günter Waitl

发明人： Herbert Brunner ,  Heinz Haas ,  Günter Waitl

IPC分类号： H01L2144

CPC分类号： H01L33/483 ,  H01L31/0203 ,  H01L33/58 ,  H01L2224/48247 ,  H01L2224/48091 ,  H01L2924/00014

摘要： The optoelectronic semiconductor component has an optoelectronic semiconductor chip disposed on a chip carrier with an approximately planar chip carrier surface. The semiconductor chip is fastened with predetermined alignment of its optical axis. A plastic base part supports the chip carrier. The semiconductor chip is electrically conductively connected to at least two electrode terminals routed through the base part, and a lens is disposed above the semiconductor chip on top of the base part. The lens is formed with an independently configured cap produced from plastic material. The cap is mechanically form-locked to a support of the base part. When the cap is placed onto the base part, a holder of the cap and the support engage with one another. The holder and the support are configured such that when the cap is placed onto the base part, the two parts are automatically positioned with respect to one another in such a way that the optical axes of the lens and of the semiconductor chip coincide.

摘要翻译： 光电子半导体部件具有设置在具有大致平坦的芯片载体表面的芯片载体上的光电子半导体芯片。 半导体芯片以其光轴的预定对准被紧固。 塑料底座部分支撑芯片载体。 半导体芯片导电地连接到穿过基底部分的至少两个电极端子，并且在半导体芯片的上方设置透镜，在基部的顶部。 透镜形成有由塑料材料制成的独立构造的盖。 盖被机械地锁定到基部的支撑件上。 当盖子放置在基座部分上时，帽子和支架的支架彼此接合。 保持器和支撑件被构造成使得当帽被放置在基部上时，两个部分相对于彼此自动定位，使得透镜和半导体芯片的光轴重合。

公开(公告)号：US4472298A

公开(公告)日：1984-09-18

申请号：US263704

申请日：1981-05-14

申请人： Herbert Brunner ,  Horst Vietzke

发明人： Herbert Brunner ,  Horst Vietzke

IPC分类号： G21F9/34 ,  G21F9/16

CPC分类号： G21F9/34

摘要： Radioactive, particularly tritium containing, waste must be stored in such manner that the environment is not endangered. This is done by conditioning the waste and embedding it in concrete whereby a central temperature of the product of 90.degree.-95.degree. C. must not be exceeded and therewith a dilution is necessary. These difficulties are overcome by inserting the waste in a metal matrix so that the waste is pressed with a metal powder at room temperature to molded bodies.

摘要翻译： 必须以不会危及环境的方式储存放射性物质，特别是含氚的废物。 这是通过调节废物并将其包埋在混凝土中，由此不得超过90°-95℃的产品的中心温度，因此需要稀释。 通过将废物插入金属基体中以使废物在室温下用金属粉末压制成成型体来克服这些困难。

公开(公告)号：US08816375B2

公开(公告)日：2014-08-26

申请号：US13698302

申请日：2011-06-08

申请人： Herbert Brunner ,  Patrick Ninz

发明人： Herbert Brunner ,  Patrick Ninz

IPC分类号： H01L33/00

CPC分类号： H01L33/40 ,  H01L24/73 ,  H01L33/0079 ,  H01L33/387 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/12036 ,  H01L2924/12042 ,  H05K2201/10106 ,  H05K2201/10969 ,  H01L2924/00014 ,  H01L2924/00

摘要： A radiation-emitting semiconductor body is provided which, besides an epitaxial semiconductor layer sequence having an active zone that is suitable for generating electromagnetic radiation, has a carrier layer that is intended to mechanically stabilize the epitaxial semiconductor layer sequence. The semiconductor body furthermore has contact structures for electrical contacting of the semiconductor body, which respectively have a volume region and a surface bonding region. The surface bonding region is formed from a material which is different from the material of the volume region.

摘要翻译： 提供一种辐射发射半导体本体，除了具有适于产生电磁辐射的有源区的外延半导体层序列之外，还具有旨在使外延半导体层序列机械稳定的载体层。 半导体本体还具有用于半导体主体的电接触的接触结构，该接触结构分别具有体积区域和表面结合区域。 表面结合区域由与体积区域的材料不同的材料形成。

公开(公告)号：US08735930B2

公开(公告)日：2014-05-27

申请号：US10593794

申请日：2005-03-09

申请人： Herbert Brunner ,  Matthias Winter ,  Markus Zeiler ,  Georg Bogner ,  Thomas Höfer

发明人： Herbert Brunner ,  Matthias Winter ,  Markus Zeiler ,  Georg Bogner ,  Thomas Höfer

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/486 ,  H01L33/54 ,  H01L2924/0002 ,  H01S5/02228 ,  H01S5/02244 ,  H01S5/02292 ,  H01L2924/00

摘要： An optoelectronic component (1) is proposed that comprises a housing body (2) and at least one semiconductor chip (8) disposed thereon, said housing body having a base part (13) comprising a connector body (16), on which a connecting conductor material (6, 7) is disposed, and said housing body having a reflector part (14) comprising a reflector body (23), on which a reflector material (9) is disposed, wherein said connector body and said reflector body are preformed separately from each other and said reflector body is disposed on said connector body in the form of a reflector top.

摘要翻译： 提出了一种光电子部件（1），其包括壳体（2）和设置在其上的至少一个半导体芯片（8），所述壳体具有包括连接器主体（16）的基部（13） 导体材料（6,7）被布置，并且所述壳体具有包括反射体（23）的反射器部分（14），反射器材料（9）设置在所述反射器部分上，其中所述连接器主体和所述反射器体被预成型 彼此分开，并且所述反射器主体以反射器顶部的形式设置在所述连接器主体上。

公开(公告)号：US08723198B2

公开(公告)日：2014-05-13

申请号：US11917789

申请日：2006-06-07

申请人： Herbert Brunner ,  Klaus Höhn

发明人： Herbert Brunner ,  Klaus Höhn

IPC分类号： H01L33/00

CPC分类号： C09K11/7701 ,  C09K11/7706 ,  C09K11/7721 ,  H01L33/502 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48472 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/12044 ,  H01L2924/181 ,  Y10T428/2982 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Disclosed is a wavelength-converting converter material comprising at least one wavelength-converting phosphor comprising phosphor particles, wherein a portion of said phosphor or all of said phosphor is present in the form of nanoparticles. Also disclosed is a light-emitting optical component comprising such a converter material and a method for producing such components.

摘要翻译： 公开了一种波长转换转换器材料，其包括至少一种包含磷光体颗粒的波长转换磷光体，其中所述磷光体的一部分或所有所述磷光体以纳米颗粒的形式存在。 还公开了包括这种转换器材料的发光光学部件和用于制造这种部件的方法。

公开(公告)号：US08690629B2

公开(公告)日：2014-04-08

申请号：US13033370

申请日：2011-02-23

申请人： Daniel Becker ,  Herbert Brunner ,  Tim Fiedler ,  Jörg Strauβ ,  Martin Zachau

发明人： Daniel Becker ,  Herbert Brunner ,  Tim Fiedler ,  Jörg Strauβ ,  Martin Zachau

IPC分类号： H01J9/22

CPC分类号： H01L33/505 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： A luminescence conversion LED having a radiation emitting chip that is connected to electrical connections and is surrounded by a housing that comprises at least a basic body and a cap, the chip being seated on the basic body, in particular in a cutout of the basic body, and the primary radiation of the chip being converted at least partially into longer wave radiation by a conversion element, wherein the cap is formed by a vitreous body, the conversion means being contained in the vitreous body, the refractive index of the vitreous body being higher than 1.6, preferably at least n=1.7.

摘要翻译： 一种发光转换LED，其具有连接到电连接的辐射发射芯片，并且被包括至少包括基体和盖的壳体包围，所述芯片位于基体上，特别是在基体的切口中 并且所述芯片的主要辐射通过转换元件至少部分地转换成更长的波长辐射，其中所述盖由玻璃体形成，所述转换装置包含在所述玻璃体中，所述玻璃体的折射率为 高于1.6，优选至少n = 1.7。