Abstract:
The testing of a RAM memory circuit containing a multiplicity of memory cells can in each case be selected in groups of n≧1 memory cells by using an applied address information item in order to write in or read out groups of in each case n data. According to the invention, in a test write cycle, a plurality i=j*m of the memory cell groups are selected, where j and m are in each case integers ≧2, and the same datum is written into all the memory cells of in each case m selected memory cell groups. In a subsequent read cycle, the i memory cell groups selected in the write cycle are selected and read in a sequence such that the read-out data groups from in each case m memory cell groups at which the same datum was written in are provided simultaneously or in direct succession as a read data block comprising m*n data. Each time a read data block is provided, a compressed test result is determined and provided; the result indicates if all m*n data of the read data block provided correspond to the datum written therein.
Abstract:
The invention provides an integrated device comprising a plurality of non-individually-encapsulated chip arrangements, each of which having a plurality of contact elements for contacting a contact pad, wherein the plurality of chip arrangements are stacked on each other such that the respective contact elements provide electrical connections to the respective chip arrangement, and a common integral mold arranged to encapsulate the plurality of stacked chip arrangements.
Abstract:
The invention relates to a Measuring probe for a device for the measurement of the thickness of thin layers, with a housing (14) comprising at least one sensor element (17), which is accepted along a longitudinal axis (16) of the housing (14) at least slightly movable to the housing (14) and with a contact spherical cap (21) assigned to the at least one sensor element (17) for setting the measuring probe (11) onto a surface of a measuring object, whereby in that the at least one sensor element (17) is accepted by a holding element (18)—along the longitudinal axis (16) of the housing (14)—which is designed spring-loaded resiliently and which is fastened on the housing (14).
Abstract:
The invention relates to a calibration standard, especially for the calibration of devices for the non-destructive measurement of the thickness of thin layers, with a carrier layer (12) consisting of a basic material and a standard (17) applied on the carrier layer (12), said standard having the thickness of the layer to be measured at which the device is to be calibrated, with the carrier layer (12) comprising a plane-parallel measuring surface (16) to its bearing surface (14), that the standard (17) comprises a bearing surface (18) plane-parallel with its measuring surface (19) for bearing on the measuring surface (16) of the carrier layer (12), and that the standard (17) is permanently provided on the carrier layer (12) by means of plating by rubbing.
Abstract:
In the method for modifying a default time duration between an execution instant of a second operation and an earlier execution instant of a first operation executed earlier in a memory element, wherein the memory element is operable in a test operation mode and a normal operation mode, at first a real time duration in the memory element is determined and provided during the test operation mode, wherein the real time duration is chosen so that a performance parameter of the memory element, when using the real time duration between the execution instants of the first and second operations, improves over a situation in which the default time duration between the execution instants of the first and second operations is used. Then, the default time duration is changed in direction of the real time duration during the test operation mode to obtain a modified default time duration. Then information on the modified default time duration or on the ascertained real time duration are stored in the memory element during the test operation mode, wherein the second operation is executed offset by the modified default time duration after the execution instant of the first operation during the normal operation mode.
Abstract:
A digital memory circuit has at least two pairs of adjacent memory banks. Each of the banks has n parallel terminals for n read/write data lines. Each bank pair has only two bundles of n/2 read/write data lines. A first bundle is assigned to the first half of a first bank and to a second half of a second bank and the second bundle is assigned to a second half of the first bank and to a first half of the second bank. Data are input/output in parallel to n/2 input/output lines with the timing of successive half-periods of a clock signal. A changeover device is changeable between different switching states for connecting a bundle of n/2 input/output lines to the read/write data lines of the bank pair containing the addressed bank, depending on whether the data are assigned to the first or second half-period of the clock signal.
Abstract:
An integrated circuit has a voltage divider that is configured to save current. The circuit includes a capacitor that is inventively connected to a potential sink or potential source by way of a charge branch even when the voltage divider is inactive. The capacitor is thus held at a charge state that corresponds to the charge state given an active voltage divider. The voltage divider thus becomes functional in a shorter time following activation, because the capacitor does not require recharging.
Abstract:
One embodiment of the invention provides a method for producing an integrated memory module containing a command decoding device that responds to external operation commands to set operating states of the memory module for carrying out operations in accordance with a predetermined specification of the memory module. The command decoding device is formed with a decision memory containing memory locations Mi,j, the storage capacity of which suffices to receive, for an arbitrary specification from a plurality of different specifications, a decision information item specifying whether or how the second operation command of selected pairs of two directly successive operation commands is to be executed. After integration of the command decoding device thus formed, the decision information items demanded in the case of the predetermined specification are written to the memory locations of the decision memory.
Abstract:
An integrated semiconductor memory can include a plurality of subcircuit blocks arranged on nonoverlapping area sections. The subcircuit blocks each have a block supply line and a block ground line, which supply individual switching elements of the subcircuit blocks with a voltage. Each block supply line and block ground line is connected to a chip supply line and a chip ground line, which run outside the area sections of the subcircuit blocks. At least one connection between the chip supply line and the block supply line of at least one subcircuit block or between the chip ground line and the block ground line of at least one subcircuit block can be isolated by a switching device. Furthermore, a method for reducing leakage currents in a semiconductor memory, which, depending on the operating state of the semiconductor memory, isolates or connects individual subcircuit blocks of the semiconductor memory from or to a voltage supply.
Abstract:
In the method for modifying a default time duration between an execution instant of a second operation and an earlier execution instant of a first operation executed earlier in a memory element, wherein the memory element is operable in a test operation mode and a normal operation mode, at first a real time duration in the memory element is determined and provided during the test operation mode, wherein the real time duration is chosen so that a performance parameter of the memory element, when using the real time duration between the execution instants of the first and second operations, improves over a situation in which the default time duration between the execution instants of the first and second operations is used. Then, the default time duration is changed in direction of the real time duration during the test operation mode to obtain a modified default time duration. Then information on the modified default time duration or on the ascertained real time duration are stored in the memory element during the test operation mode, wherein the second operation is executed offset by the modified default time duration after the execution instant of the first operation during the normal operation mode.