摘要:
A manufacturing method of a silicon carbide semiconductor device includes: forming a drift layer on a silicon carbide substrate; forming a base layer on or in a surface portion of the drift layer; forming a source region in a surface portion of the base layer; forming a trench to penetrate the base layer and to reach the drift layer; forming a gate electrode on a gate insulation film in the trench; forming a source electrode electrically connected to the source region and the base layer; and forming a drain electrode on a back surface of the substrate. The forming of the trench includes: flattening a substrate surface; and etching to form the trench after flattening.
摘要:
The silicon carbide semiconductor device includes a substrate, a drift layer, a base region, a source region, a trench, a gate insulating layer, a gate electrode, a source electrode, a drain electrode, and a deep layer. The deep layer is disposed under the base region and is located to a depth deeper than the trench. The deep layer is divided into a plurality of portions in a direction that crosses a longitudinal direction of the trench. The portions include a group of portions disposed at positions corresponding to the trench and arranged at equal intervals in the longitudinal direction of the trench. The group of portions surrounds corners of a bottom of the trench.
摘要:
An SiC semiconductor device includes a substrate, a drift layer, a base region, a source region, a trench, a gate oxide film, a gate electrode, a source electrode and a drain electrode. The substrate has a Si-face as a main surface. The source region has the Si-face. The trench is provided from a surface of the source region to a portion deeper than the base region and extends longitudinally in one direction and has a Si-face bottom. The trench has an inverse tapered shape, which has a smaller width at an entrance portion than at a bottom, at least at a portion that is in contact with the base region.
摘要:
A semiconductor device includes a semiconductor substrate and an electric field terminal part. The semiconductor substrate includes a substrate, a drift layer disposed on a surface of the substrate, and a base layer disposed on a surface of the drift layer. The semiconductor substrate is divided into a cell region in which a semiconductor element is disposed and a peripheral region that surrounds the cell region. The base region has a bottom face located on a same plane throughout the cell region and the peripheral region and provides an electric field relaxing layer located in the peripheral region. The electric field terminal part surrounds the cell region and a portion of the electric field relaxing layer and penetrates the electric field relaxing layer from a surface of the electric field relaxing layer to the drift layer.
摘要:
A SiC semiconductor device having a Schottky barrier diode includes: a substrate made of SiC and having a first conductive type, wherein the substrate includes a main surface and a rear surface; a drift layer made of SiC and having the first conductive type, wherein the drift layer is disposed on the main surface of the substrate and has an impurity concentration lower than the substrate; a Schottky electrode disposed on the drift layer and has a Schottky contact with a surface of the drift layer; and an ohmic electrode disposed on the rear surface of the substrate. The Schottky electrode directly contacts the drift layer in such a manner that a lattice of the Schottky electrode is matched with a lattice of the drift layer.
摘要:
An electronic apparatus includes an input unit and a controller. The input unit is configured to detect a user operation and output a signal corresponding to the user operation. The controller is configured to cause a data icon to be displayed on a screen of a display unit, judge a drag operation with respect to the data icon based on the signal from the input unit, and cause an icon to be displayed on the screen according to the drag operation, the icon indicating a state of an access authority of data related to the data icon.
摘要:
There is provided a communication device including a determination unit for determining whether authentication information presented to a user of another communication device is consistent with comparison information transmitted from the other communication device capable of obtaining and transmitting the authentication information, and an authentication unit, when it is determined that the authentication information is consistent with the comparison information, for authenticating the other communication device as an opposite communication party.
摘要:
A SiC semiconductor device having a Schottky barrier diode includes: a substrate made of SiC and having a first conductive type, wherein the substrate includes a main surface and a rear surface; a drift layer made of SiC and having the first conductive type, wherein the drift layer is disposed on the main surface of the substrate and has an impurity concentration lower than the substrate; a Schottky electrode disposed on the drift layer and has a Schottky contact with a surface of the drift layer; and an ohmic electrode disposed on the rear surface of the substrate. The Schottky electrode directly contacts the drift layer in such a manner that a lattice of the Schottky electrode is matched with a lattice of the drift layer.
摘要:
A cold roll forming method for reducing a diameter of a metal pipe and a metal pipe product having a diameter reduced by such a method are disclosed, wherein the method includes: passing a raw metal pipe through a set of pre-forming rolls so that it can be pre-formed into an intermediate metal pipe having an elliptical, elongated circular or rectangular cross-sectional shape; and then passing the intermediate metal pipe through a set of diameter-reducing rolls disposed on a downstream side of the set of pre-forming rolls so that it can have its outer circumferential length reduced to be smaller than an outer peripheral length of the raw metal pipe, while at the same time being re-formed into a circular cross-sectional shape or any other cross-sectional shape different from the cross-sectional shape of the intermediate metal pipe.
摘要:
Cell culture carriers that allow cells to efficiently adhere thereto and sufficiently grow thereon and from which the grown cells can be easily removed or detached, a method for manufacturing cell culture carriers that enables to easily and reliably manufacture such cell culture carriers and a method for culturing cells using such cell culture carriers are disclosed. The cell culture carrier includes a base material having a granular shape and a coating layer that is provided so as to cover the surface of the base material, the coating layer is mainly made of calcium phosphate-based apatite in which a part of calcium is deficient. Such cell culture carriers are utilized in cell culture in which cells adhere to and grow on the surface of cell culture carriers, particularly in three-dimensional high-density culture (suspension culture). The Ca deficiency rate in the calcium phosphate-based apatite in which a part of calcium is deficient is preferably in the range of 1 to 30 mol %.