Photoacid generators, chemically amplified resist compositions, and patterning process
    92.
    发明授权
    Photoacid generators, chemically amplified resist compositions, and patterning process 有权
    光酸发生剂,化学放大抗蚀剂组合物和图案化工艺

    公开(公告)号:US07494760B2

    公开(公告)日:2009-02-24

    申请号:US11806626

    申请日:2007-06-01

    摘要: A photoacid generator has formula (1) wherein R is H, F, Cl, nitro, alkyl or alkoxy, n is 0 or 1, m is 1 or 2, r is an integer of 0-4, and r′ is an integer of 0-5. A chemically amplified resist composition comprising the photoacid generator has advantages including a high resolution, focus latitude, long-term PED dimensional stability, and a satisfactory pattern profile shape. When the photoacid generator is combined with a resin having acid labile groups other than those of the acetal type, resolution and top loss are improved. The composition is suited for deep UV lithography.

    摘要翻译: 光酸产生剂具有式(1)其中R为H,F,Cl,硝基,烷基或烷氧基,n为0或1,m为1或2,r为0-4的整数,r'为整数 的0-5。 包含光致酸发生器的化学放大抗蚀剂组合物具有包括高分辨率,聚焦纬度,长期PED尺寸稳定性和令人满意的图案轮廓形状的优点。 当光酸产生剂与具有不同于缩醛类型的酸不稳定基团的树脂组合时,分辨率和顶部损失得到改善。 该组合物适用于深紫外光刻。

    Chemically amplified positive resist composition and patterning process
    93.
    发明授权
    Chemically amplified positive resist composition and patterning process 有权
    化学扩增正性抗蚀剂组成和图案化工艺

    公开(公告)号:US07335458B2

    公开(公告)日:2008-02-26

    申请号:US11354204

    申请日:2006-02-15

    IPC分类号: G03F7/004 G03F7/30

    摘要: A chemically amplified positive resist composition is provided comprising (A) a resin containing acid labile groups other than acetal type which changes its solubility in an alkaline developer as a result of the acid labile groups being eliminated under the action of acid and (B) specific sulfonium salts as a photoacid generator.The composition is improved in resolution and focus latitude, minimized in line width variation and profile degradation even on prolonged PED, improved in pattern profile after development, minimized in pattern feature size variation within the wafer plane by uneven development and thus best suited in the deep-UV lithography.

    摘要翻译: 提供一种化学放大正性抗蚀剂组合物,其包含(A)除了缩醛型以外的酸不稳定基团的树脂,其在酸性作用下由于酸不稳定基团被消除而改变其在碱性显影剂中的溶解度,(B)具体 锍盐作为光致酸发生剂。 组合物在分辨率和对焦纬度方面得到改善,即使在长时间的PED下也减少了线宽变化和轮廓退化,改善了显影后的图案轮廓,通过不平坦的发展使晶片平面内的图案特征尺寸变化最小化,因此最适合于深度 -UV光刻。

    Photoacid generating compounds, chemically amplified positive resist materials, and pattern forming method
    94.
    发明授权
    Photoacid generating compounds, chemically amplified positive resist materials, and pattern forming method 有权
    光生酸化合物,化学放大阳性抗蚀剂材料和图案形成方法

    公开(公告)号:US07303852B2

    公开(公告)日:2007-12-04

    申请号:US10375773

    申请日:2003-02-27

    IPC分类号: G03F7/00 G03F7/004

    摘要: The invention provides a high-resolution resist material comprising an acid generator that has high sensitivity and high resolution with respect to high-energy rays of 300 nm or less, has small line-edge roughness, and is superior in heat stability and in shelf stability, and provides a pattern forming method that uses this resist material. The invention further provides a chemically amplified positive resist material comprising a base resin, an acid generator and a solvent in which the acid generator generates an alkylimidic acid containing a fluorine group, and provides a pattern forming method comprising a step of applying the resist material to the substrate, a step of performing exposure to a high-energy ray of a wavelength of 300 nm or less through a photomask following heat treatment, and a step of performing development by a developing solution following heat treatment.

    摘要翻译: 本发明提供了一种高分辨率抗蚀剂材料,其包括相对于300nm以下的高能量射线具有高灵敏度和高分辨率的酸发生剂,具有小的线边缘粗糙度,并且具有优异的热稳定性和储存稳定性 ,并提供使用该抗蚀剂材料的图案形成方法。 本发明还提供了一种化学放大正性抗蚀剂材料,其包括基础树脂,酸产生剂和其中酸产生剂产生含氟基团的亚烷基亚胺酸的溶剂,并且提供了图案形成方法,包括将抗蚀剂材料施加到 基板,通过热处理后的光掩模进行曝光于波长为300nm以下的高能射线的工序,以及通过热处理后的显影液进行显影的工序。

    Photoacid generators, chemically amplified resist compositions, and patterning process
    95.
    发明授权
    Photoacid generators, chemically amplified resist compositions, and patterning process 有权
    光酸发生剂,化学放大抗蚀剂组合物和图案化工艺

    公开(公告)号:US07235343B2

    公开(公告)日:2007-06-26

    申请号:US10842719

    申请日:2004-05-11

    IPC分类号: G03F7/031

    摘要: Photoacid generators have formula (1) wherein R1 and R2 are alkyl, or R1 and R2, taken together, may form a C4–C6 ring structure with sulfur, R is hydrogen or alkyl, R′ is hydrogen, alkyl, alkoxyl or nitro, n is 1 to 6, and Y− is alkylsulfonate, arylsulfonate, bisalkylsulfonylimide or trisalkylsulfonylmethide. Chemically amplified resist compositions comprising the same have improved resolution, thermal stability, storage stability and minimized line edge roughness

    摘要翻译: 光酸产生剂具有式(1),其中R 1和R 2是烷基,或R 1和R 2, 一起可以与硫形成C 4 -C 6 -C 6环结构,R是氢或烷基,R'是氢,烷基,烷氧基或硝基,n是 1至6,Y - 是烷基磺酸酯,芳基磺酸酯,双烷基磺酰亚胺或三烷基磺酰基甲基。 包含该化合物的抗蚀剂组合物具有改进的分辨率,热稳定性,储存稳定性和最小化线边缘粗糙度

    Resist compositions and patterning process
    98.
    发明授权
    Resist compositions and patterning process 有权
    抗蚀剂组合物和图案化工艺

    公开(公告)号:US06541179B2

    公开(公告)日:2003-04-01

    申请号:US09811695

    申请日:2001-03-20

    IPC分类号: G03F7004

    摘要: A resist composition contains a base resin, a photoacid generator, and a solvent. The photoacid generator is a sulfonium salt of formula (1). R1 is a monovalent cyclic or bridgedring C3-20, hydrocarbon group, R2 is hydroxyl, nitro, halogen, or a straight, branched or cyclic monovalent C1-15 hydrocarbon group which may contain O, N, S or halogen atom, K− is a non-nucleophilic counter ion, x is equal to 1 or 2, and y is an integer of 0-3. The resist composition is sensitive to ArF excimer laser light, has good sensitivity and resolution, and forms a thick film which is advantageous in etching.

    摘要翻译: 抗蚀剂组合物含有基础树脂,光致酸产生剂和溶剂。 光致酸产生剂是式(1)的锍盐,R1是一价环状或桥连的C3-20,烃基,R2是羟基,硝基,卤素或直链,支链或环状的一价C1-15烃基,其可以 含有O,N,S或卤原子,K-是非亲核反离子,x等于1或2,y是0-3的整数。 抗蚀剂组合物对ArF准分子激光敏感,具有良好的灵敏度和分辨率,并形成有利于蚀刻的厚膜。

    RESIST COMPOSITION AND PATTERNING PROCESS USING THE SAME
    100.
    发明申请
    RESIST COMPOSITION AND PATTERNING PROCESS USING THE SAME 审中-公开
    使用它的耐腐蚀组合物和图案处理方法

    公开(公告)号:US20120214100A1

    公开(公告)日:2012-08-23

    申请号:US13396081

    申请日:2012-02-14

    IPC分类号: G03F7/20 G03F7/027

    摘要: There is disclosed a resist composition, wherein the composition is used in a lithography and comprises at least: a polymer (A) that becomes a base resin whose alkaline-solubility changes by an acid, a photo acid generator (B) generating a sulfonic acid represented by the following general formula (1) by responding to a high energy beam, and a polymer additive (C) represented by the following general formula (2). There can be provided a resist composition showing not only excellent lithography properties but also a high receding contact angle, and in addition, being capable of suppressing a blob defect in both the immersion exposures using and not using a top coat; and a patterning process using the same.

    摘要翻译: 公开了一种抗蚀剂组合物,其中该组合物用于光刻,并且至少包括:成为其酸溶性变化的碱性树脂的聚合物(A),产生磺酸的光酸产生剂(B) 由高能束响应的以下通式(1)表示,和由以下通式(2)表示的聚合物添加剂(C)。 可以提供抗蚀剂组合物,其不仅显示出优异的光刻性能,而且还具有高的后退接触角,此外,还能够使用并不使用顶涂层来抑制浸没曝光中的斑点缺陷; 以及使用其的图案化处理。