公开(公告)号：US20100255027A1

公开(公告)日：2010-10-07

申请号：US11784626

申请日：2007-04-09

申请人： Liang Qiao ,  Wei Shi ,  Yujun Huang ,  Jianzhong Liu

发明人： Liang Qiao ,  Wei Shi ,  Yujun Huang ,  Jianzhong Liu

IPC分类号： A61K39/12 ,  A61P31/12

CPC分类号： C12N7/00 ,  A61K2039/525 ,  C12N2710/20023 ,  C12N2710/20061

摘要： The invention involves a papilloma pseudovirus that can induce immune response after oral intake as well as its preparation. It is characterized in that HPV or BPV pseudovirus are made by disrupting HPV-VLP or BPV-VLP, mixing them with plasmids (plasmids or DNA vaccine), and reassembling them into the pseudoviruses (VLPs with plasmids inside). Oral administration of the pseudoviruses will result in delivery to mucosal and systemic lymphoid tissues and induce immune responses for disease prevention and treatment. The pseudovirus induces stronger immune response than DNA vaccines. Additionally, the pseudovirus can be applied in gene therapy by bringing the therapeutic genes into lymphoid tissues in the human body.

摘要翻译： 本发明涉及一种乳头状假性假病毒，可在口服摄入后诱导免疫反应及其制备。 其特征在于HPV或BPV假病毒通过破坏HPV-VLP或BPV-VLP，与质粒（质粒或DNA疫苗）混合并将其重新组装成假病毒（其中具有质粒的VLP）而制备。 假性病毒的口服给药将导致输送到粘膜和系统性淋巴组织，并诱导用于疾病预防和治疗的免疫应答。 假DNA病毒诱导比DNA疫苗更强的免疫应答。 此外，假病毒可以通过将治疗基因引入人体的淋巴组织来应用于基因治疗。

公开(公告)号：US20100213486A1

公开(公告)日：2010-08-26

申请号：US12700556

申请日：2010-02-04

申请人： Wei Shi

发明人： Wei Shi

IPC分类号： H01L33/00 ,  H01L21/60 ,  F28F7/00

CPC分类号： H01L33/644 ,  H01L25/0753 ,  H01L33/38 ,  H01L33/507 ,  H01L33/58 ,  H01L33/62 ,  H01L33/642 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat spreader for an LED can include a thermally conductive and optically transparent member. The bottom side of the heat spreader can be configured to attach to a light emitting side of the LED. The top and/or bottom surface of the heat spreader can have a phosphor layer formed thereon. The heat spreader can be configured to conduct heat from the LED to a package. The heat spreader can be configured to conduct heat from the phosphors to the package. By facilitating the removal of heat from the LED and phosphors, more current can be used to drive the LED. The use of more current facilitates the construction of a brighter LED, which can be used in applications such as flashlights, displays, and general illumination. By facilitating the removal of heat from the phosphors, desired colors can be better provided.

摘要翻译： 用于LED的散热器可以包括导热和光学透明构件。 散热器的底侧可以被配置为附着到LED的发光侧。 散热器的顶表面和/或底表面可以在其上形成荧光体层。 散热器可以被配置为将热量从LED传导到包装。 散热器可以被配置为将热量从磷光体传导到封装。 通过促进从LED和磷光体去除热量，可以使用更多的电流来驱动LED。 使用更多的电流有助于构建更亮的LED，其可以用于诸如手电筒，显示器和一般照明的应用中。 通过促进从磷光体去除热量，可以更好地提供所需的颜色。

公开(公告)号：US20100078661A1

公开(公告)日：2010-04-01

申请号：US12239470

申请日：2008-09-26

申请人： Wei Shi ,  Alex Shaikevitch ,  Michael Solomensky

发明人： Wei Shi ,  Alex Shaikevitch ,  Michael Solomensky

IPC分类号： H01L33/00 ,  H01L21/00

CPC分类号： H01L33/483 ,  H01L25/0753 ,  H01L33/46 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2924/00 ,  H01L2924/00014

摘要： A substrate for an LED assembly can have a plurality of cups formed therein. At least one cup can be formed within another cup. The cups can be co-axial with respect to one another, for example. A machined surface of the substrate can enhance reflectivity of the LED assembly. A transparent and/or non-global solder mask can enhance reflectivity of the LED assembly. A transparent ring can enhance reflectivity of the LED assembly. By enhancing reflectivity of the LED assembly, the brightness of the LED assembly can be increased. Brighter LED assemblies can be used in applications such as flashlights, displays, and general illumination.

摘要翻译： 用于LED组件的基板可以具有形成在其中的多个杯。 至少一杯可以在另一杯内形成。 例如，杯可以相对于彼此共轴。 衬底的加工表面可以增强LED组件的反射率。 透明和/或非全局焊接掩模可以增强LED组件的反射率。 透明环可以增强LED组件的反射率。 通过提高LED组件的反射率，可以提高LED组件的亮度。 较亮的LED组件可用于手电筒，显示屏和一般照明等应用中。

公开(公告)号：US07551652B1

公开(公告)日：2009-06-23

申请号：US11588933

申请日：2006-10-27

申请人： Shibin Jiang ,  Wei Shi ,  Matthew A. Leigh ,  Jie Zong

发明人： Shibin Jiang ,  Wei Shi ,  Matthew A. Leigh ,  Jie Zong

IPC分类号： H01S3/115

CPC分类号： H01S3/0675 ,  H01S3/0057 ,  H01S3/06704 ,  H01S3/06712 ,  H01S3/102 ,  H01S3/121 ,  H01S3/2383

摘要： A shared modulator applies radial stress to the polarization-dependent fiber chains to induce birefringence and simultaneously Q-switch two or more fiber lasers. Multiple temporally overlapping pulsed beams can be generated with pulses

摘要翻译： 共享调制器将偏振相关纤维链施加径向应力以引起双折射，同时Q开关两个或更多个光纤激光器。 多个时间重叠的脉冲光束可以产生脉冲<100 ns甚至<30 ns，重复率从50 Hz到650 KHz。 一对稍微不同波长的Q开关光纤激光器非常适合通过非线性光学材料通过差分频率产生（DFG）提供低频光源。

公开(公告)号：US07439617B2

公开(公告)日：2008-10-21

申请号：US11479577

申请日：2006-06-30

申请人： Carl Deppisch ,  Tom Fitzgerald ,  Fay Hua ,  Wei Shi ,  Mike Gasparek

发明人： Carl Deppisch ,  Tom Fitzgerald ,  Fay Hua ,  Wei Shi ,  Mike Gasparek

IPC分类号： H01L23/10 ,  H01L23/24

CPC分类号： H01L23/42 ,  H01L21/563 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/1617

摘要： A cooling device including a thermally conductive body with a first mating surface, a first solder wettable material disposed in a pattern at a portion of the first mating surface, and a reflowable solder material disposed at the first mating surface. A portion of the solder material is configured to be capable of contacting an adjacently disposed second mating surface, and when melted, to form a single flow front through a bond line gap between the first mating surface of the cooling device and the second mating surface of, for example, a thermal component.A mating surface of the cooling device is positioned adjacent to a mating surface of a thermal component and the solder material is heated at least to its melting point. The solder material is maintained in a molten state until it has flowed into and substantially filled a bond line gap between the mating surface of the cooling device and the mating surface of the thermal component, and then cooled below its melting point, physically and/or thermally coupling the cooling device and the thermal component.

公开(公告)号：US20080017975A1

公开(公告)日：2008-01-24

申请号：US11479577

申请日：2006-06-30

申请人： Carl Deppisch ,  Tom Fitzgerald ,  Fay Hua ,  Wei Shi ,  Mike Gasparek

发明人： Carl Deppisch ,  Tom Fitzgerald ,  Fay Hua ,  Wei Shi ,  Mike Gasparek

IPC分类号： H01L23/34 ,  H01L23/10

CPC分类号： H01L23/42 ,  H01L21/563 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/1617

摘要： A cooling device including a thermally conductive body with a first mating surface, a first solder wettable material disposed in a pattern at a portion of the first mating surface, and a reflowable solder material disposed at the first mating surface. A portion of the solder material is configured to be capable of contacting an adjacently disposed second mating surface, and when melted, to form a single flow front through a bond line gap between the first mating surface of the cooling device and the second mating surface of, for example, a thermal component.A mating surface of the cooling device is positioned adjacent to a mating surface of a thermal component and the solder material is heated at least to its melting point. The solder material is maintained in a molten state until it has flowed into and substantially filled a bond line gap between the mating surface of the cooling device and the mating surface of the thermal component, and then cooled below its melting point, physically and/or thermally coupling the cooling device and the thermal component.

摘要翻译： 一种冷却装置，包括具有第一配合表面的导热体，在第一配合表面的一部分处以图案设置的第一焊料可润湿材料，以及设置在第一配合表面处的可回流焊料。 焊料材料的一部分被构造成能够接触相邻设置的第二配合表面，并且当熔化时，通过冷却装置的第一配合表面和第二配合表面之间的接合线间隙形成单个流动前沿 ，例如，热成分。 冷却装置的配合表面邻近热部件的配合表面定位，焊料材料至少加热至其熔点。 焊料材料保持在熔融状态，直到其流入并基本上填充冷却装置的配合表面与热部件的配合表面之间的接合线间隙，然后冷却到其熔点以下物理和/或 热耦合冷却装置和热部件。

公开(公告)号：US20070126103A1

公开(公告)日：2007-06-07

申请号：US11292608

申请日：2005-12-01

申请人： Wei Shi

发明人： Wei Shi

IPC分类号： H01L23/02

CPC分类号： H01L21/6835 ,  H01L23/473 ,  H01L25/0657 ,  H01L25/18 ,  H01L2221/6834 ,  H01L2221/68354 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2225/06551 ,  H01L2225/06589 ,  H01L2924/19041 ,  H01L2924/30105

摘要： An IC chip, a three dimensional microelectronic package including the IC chip, a system including the microelectronic package, and a method of forming the package. The microelectronic package comprises: a bonding substrate comprising external circuitry; a plurality of IC chips secured in a stack, the plurality comprising a bottom IC chip electrically interconnected to the bonding substrate; the stack further defining a passage therein having a passage inlet and a passage outlet and at least one via configured to guide cooling fluid from one surface of at least one of the IC chips to an opposing surface of the at least one of the IC chips, the passage further being configured to guide a cooling fluid from the passage inlet to the passage outlet. The package further includes electrical interconnects electrically interconnecting respective ones of the IC chips.

摘要翻译： IC芯片，包括IC芯片的三维微电子封装，包括微电子封装的系统以及形成封装的方法。 微电子封装包括：包括外部电路的接合衬底; 固定在堆叠中的多个IC芯片，所述多个IC芯片包括与所述接合基板电连接的底部IC芯片; 所述堆叠进一步限定其中具有通道入口和通道出口的通道，以及至少一个通孔，该至少一个通孔构造成将冷却流体从至少一个所述IC芯片的一个表面引导到所述至少一个所述IC芯片的相对表面， 该通道还被构造成将冷却流体从通道入口引导到通道出口。 该封装还包括将互连IC芯片中的相应IC芯片电连接的电互连。