公开(公告)号：US06916873B2

公开(公告)日：2005-07-12

申请号：US10284304

申请日：2002-10-31

申请人： Rieko Yamamoto ,  Norio Kimura ,  Kyoichi Yoda ,  Yasukazu Watanabe

发明人： Rieko Yamamoto ,  Norio Kimura ,  Kyoichi Yoda ,  Yasukazu Watanabe

IPC分类号： C08G59/50 ,  C08G59/68 ,  C08G63/00 ,  C08L63/00 ,  H05K1/09 ,  H05K3/00 ,  H05K3/40 ,  H05K3/46 ,  C08L3/34

CPC分类号： C08L63/00 ,  C08G59/5086 ,  H05K1/095 ,  H05K3/0094 ,  H05K3/4069 ,  H05K3/4602 ,  H05K2201/0209 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2203/1461 ,  Y10T428/249985

摘要： A liquid thermosetting resin composition comprises (A) an epoxy resin, (B) a curing catalyst, and (C) a filler and is characterized by exhibiting a viscosity at 25° C. of not more than 1,500 dPa.s, a gel time of not less than 300 seconds at a temperature at which the composition exhibits a melt viscosity of not more than 10 dPa.s, and a gel time at 130° C. of not more than 600 seconds. In the production of a printed wiring board by superposing an interlaminar resin insulating layer and a conductive circuit on the surface of the wiring board having a conductive circuit pattern including hole parts, a hole filling process is performed by filling the hole parts mentioned above with the composition mentioned above, effecting precure of the composition by heating, then polishing and removing parts of the precured composition protruding from a surface defining the hole parts, and further heating the precured composition till final curing.

摘要翻译： 液体热固性树脂组合物包含（A）环氧树脂，（B）固化催化剂和（C）填料，其特征在于在25℃下显示不超过1,500dPa.s的粘度，凝胶时间 在组合物显示熔体粘度不大于10dPa.s的温度下，不低于300秒，凝胶时间在130℃下不超过600秒。 在通过在具有包括孔部分的导电电路图案的布线板的表面上叠加层间树脂绝缘层和导电电路来制造印刷线路板的过程中，通过填充上述孔部件 组合物，通过加热预处理组合物，然后抛光和除去从限定孔部的表面突出的部分预固化组合物，并进一步加热预固化组合物直至最终固化。

公开(公告)号：US06752692B2

公开(公告)日：2004-06-22

申请号：US09932987

申请日：2001-08-21

申请人： Yutaka Wada ,  Hirokuni Hiyama ,  Norio Kimura

发明人： Yutaka Wada ,  Hirokuni Hiyama ,  Norio Kimura

IPC分类号： B24B4900

CPC分类号： B24B37/345 ,  B08B3/08 ,  B24B53/017 ,  H01L21/67051 ,  Y10S134/902

摘要： A method is suitable for cleaning substrates, after polishing, that require a high degree of cleanliness, such as semiconductor wafers, glass substrates, or liquid crystal displays. The method includes polishing a substrate using an abrasive liquid containing abrasive particles, and cleaning a polished surface of the substrate by supplying a cleaning liquid having substantially the same pH as the abrasive liquid or similar pH to the abrasive liquid so that a pH of the abrasive liquid attached to the polished surface of the substrate is not rapidly changed.

摘要翻译： 一种方法适用于清洗需要高度清洁度的基板，如半导体晶片，玻璃基板或液晶显示器。 该方法包括使用含磨料颗粒的磨料液研磨衬底，以及通过向研磨液中提供与磨料液体或类似pH具有基本上相同pH值的清洗液体来清洗衬底的抛光表面，使磨料的pH值 附着于基板抛光面的液体不会迅速变化。

公开(公告)号：US06689257B2

公开(公告)日：2004-02-10

申请号：US09864210

申请日：2001-05-25

申请人： Koji Mishima ,  Junji Kunisawa ,  Natsuki Makino ,  Norio Kimura ,  Hiroaki Inoue ,  Kenji Nakamura ,  Moriji Matsumoto ,  Takahiro Nanjo ,  Mitsuko Odagaki

发明人： Koji Mishima ,  Junji Kunisawa ,  Natsuki Makino ,  Norio Kimura ,  Hiroaki Inoue ,  Kenji Nakamura ,  Moriji Matsumoto ,  Takahiro Nanjo ,  Mitsuko Odagaki

IPC分类号： C25D1700

CPC分类号： H01L21/67109 ,  C25D7/123 ,  C25D17/001 ,  H01L21/2885 ,  H01L21/67778 ,  H01L21/681

摘要： A substrate processing apparatus fills a metal such as copper or the like in fine interconnection patterns or trenches defined in a semiconductor substrate. The substrate processing apparatus has a loading/unloading unit for placing a substrate cassette to allow a substrate to be loaded and unloaded, a substrate treating unit for treating a substrate, and a transfer robot for transferring a substrate between the loading/unloading unit and the substrate treating unit. The loading/unloading unit, the substrate treating unit, and the transfer robot are installed in a single facility. The loading/unloading unit has a rotary table which is horizontally rotatable for positioning the substrate cassette in a position to detect the substrate cassette placed in the loading/unloading unit and to remove the substrate from the substrate cassette with the transfer robot.

公开(公告)号：US06667238B1

公开(公告)日：2003-12-23

申请号：US09545504

申请日：2000-04-07

申请人： Norio Kimura ,  Mitsuhiko Shirakashi ,  Katsuhiko Tokushige ,  Masao Asami ,  Naoto Miyashita ,  Masako Kodera ,  Yoshitaka Matsui ,  Soichi Nadahara ,  Hiroshi Tomita

发明人： Norio Kimura ,  Mitsuhiko Shirakashi ,  Katsuhiko Tokushige ,  Masao Asami ,  Naoto Miyashita ,  Masako Kodera ,  Yoshitaka Matsui ,  Soichi Nadahara ,  Hiroshi Tomita

IPC分类号： H01L2100

CPC分类号： B24B37/345

摘要： A polishing apparatus is used for chemical mechanical polishing a copper (Cu) layer formed on a substrate such as a semiconductor wafer and then cleaning the polished substrate. The polishing apparatus has a polishing section having a turntable with a polishing surface and a top ring for holding a substrate and pressing the substrate against the polishing surface to polish a surface having a semiconductor device thereon, and a cleaning section for cleaning the substrate which has been polished. The cleaning section has an electrolyzed water supply device for supplying electrolyzed water to the substrate to clean the polished surface of the substrate while supplying electrolyzed water to the substrate.

摘要翻译： 抛光装置用于化学机械抛光形成在诸如半导体晶片的基板上的铜（Cu）层，然后清洁抛光的基板。 抛光装置具有研磨部，该研磨部具有带有抛光面的转盘和用于保持基板的顶环，并将基板按压在研磨面上，以对其上具有半导体器件的表面进行抛光;以及清洗部， 被抛光 清洗部具有电解供水装置，用于向基板供给电解水，以清洗基板的抛光表面，同时向基板供应电解水。

公开(公告)号：US06663469B2

公开(公告)日：2003-12-16

申请号：US09870479

申请日：2001-06-01

申请人： Norio Kimura ,  Tatsuya Kohama

发明人： Norio Kimura ,  Tatsuya Kohama

IPC分类号： B24B719

CPC分类号： H01L21/7684 ,  B24B37/013 ,  B24B37/042 ,  B24B49/12 ,  H01L21/02074 ,  H01L21/3212

摘要： A semiconductor substrate having a Cu layer formed so as to fill wiring grooves formed in the substrate surface and to cover regions of the substrate surface where no wiring groove is formed is brought into sliding contact with a polishing surface on a turntable to carry out polishing until the Cu layer is polished to a predetermined thickness. Then, the semiconductor substrate is brought into sliding contact with a polishing surface on a turntable to carry out polishing until the Cu layer on the substrate surface is removed, except for portions of the Cu layer formed to fill the wiring grooves, and a barrier metal layer is also removed. Thus, the Cu layer on the substrate surface can be removed uniformly, and the Cu wiring portions formed in the wiring grooves can be planarly and uniformly polished without giving rise to problems of over-polishing such as dishing or erosion.

公开(公告)号：US06632335B2

公开(公告)日：2003-10-14

申请号：US09742110

申请日：2000-12-22

申请人： Junji Kunisawa ,  Mitsuko Odagaki ,  Natsuki Makino ,  Koji Mishima ,  Kenji Nakamura ,  Hiroaki Inoue ,  Norio Kimura ,  Tetsuo Matsuda ,  Hisashi Kaneko ,  Nobuo Hayasaka ,  Katsuya Okumura ,  Manabu Tsujimura ,  Toshiyuki Morita

发明人： Junji Kunisawa ,  Mitsuko Odagaki ,  Natsuki Makino ,  Koji Mishima ,  Kenji Nakamura ,  Hiroaki Inoue ,  Norio Kimura ,  Tetsuo Matsuda ,  Hisashi Kaneko ,  Nobuo Hayasaka ,  Katsuya Okumura ,  Manabu Tsujimura ,  Toshiyuki Morita

IPC分类号： C25D2112

CPC分类号： H01L21/6719 ,  C25D7/123 ,  C25D17/001 ,  C25D17/12 ,  C25D17/14 ,  H01L21/2885 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/6715 ,  H01L21/6723 ,  H01L21/76877 ,  H01L21/76879 ,  H01L2924/0002 ,  H05K3/423 ,  H01L2924/00

摘要： A plating method and apparatus for a substrate fills a metal, e.g., copper, into a fine interconnection pattern formed in a semiconductor substrate. The apparatus has a substrate holding portion 36 horizontally holding and rotating a substrate with its surface to be plated facing upward. A seal material 90 contacts a peripheral edge portion of the surface, sealing the portion in a watertight manner. A cathode electrode 88 passes an electric current upon contact with the substrate. A cathode portion 38 rotates integrally with the substrate holding portion 36. An electrode arm portion 30 is above the cathode portion 38 and movable horizontally and vertically and has an anode 98 face-down. Plating liquid is poured into a space between the surface to be plated and the anode 98 brought close to the surface to be plated. Thus, plating treatment and treatments incidental thereto can be performed by a single unit.

摘要翻译： 用于衬底的电镀方法和装置将诸如铜的金属填充到形成在半导体衬底中的精细互连图案中。 该装置具有将待镀表面向上水平保持并旋转的衬底的衬底保持部分 36 。 密封材料 90 接触表面的外围边缘部分，以水密的方式密封该部分。 当与基板接触时，阴极电极 88 通过电流。 阴极部分 38 与衬底保持部分 36 整体旋转。 电极臂部分 30 在阴极部分 38 之上，水平和垂直移动并具有阳极 PDAT> 98 面朝下。 将电镀液倒入要被镀表面和靠近待镀表面的阳极 98 之间的空间中。 因此，电镀处理和附带的处理可以通过单个单元执行

公开(公告)号：US06558239B2

公开(公告)日：2003-05-06

申请号：US10036384

申请日：2002-01-07

申请人： Junji Kunisawa ,  Norio Kimura

发明人： Junji Kunisawa ,  Norio Kimura

IPC分类号： B24B2100

CPC分类号： B24B9/065 ,  B24B21/08 ,  B24B37/04 ,  B24B49/12 ,  B24B49/16

摘要： A polishing apparatus has a feed reel for feeding a polishing tape wound thereon and having a polishing surface, a take-up reel for reeling up the polishing tape from the feed reel, a presser for pressing the polishing tape between the feed reel and the take-up reel against a surface, to be polished, of a workpiece, and a motor for rotating the take-up reel. The feed reel, the take-up reel, and the presser are housed in a cartridge, which is detachably held by a cartridge holder.

公开(公告)号：US06443821B1

公开(公告)日：2002-09-03

申请号：US09712155

申请日：2000-11-15

申请人： Norio Kimura ,  Hozumi Yasuda

发明人： Norio Kimura ,  Hozumi Yasuda

IPC分类号： B24B100

CPC分类号： B24B37/30 ,  B24B37/32

摘要： A workpiece carrier holds a workpiece such as a semiconductor wafer and presses the workpiece against a polishing surface on a polishing table. The workpiece carrier has a top ring body for holding the workpiece, and a retainer ring for holding an outer circumferential edge of the workpiece. A fluid chamber which is supplied with a pressurized fluid such as a compressed air is provided in the top ring body and covered by a resilient membrane. A plurality of pressing members are fixed to the resilient membrane for applying a pressing force through the resilient membrane to the workpiece under the pressure of the fluid in the fluid chamber.

摘要翻译： 工件载体保持诸如半导体晶片的工件，并将工件压靠在抛光台上的抛光表面上。 工件载体具有用于保持工件的顶环体和用于保持工件的外周边缘的保持环。 提供有加压流体例如压缩空气的流体室设置在顶环体中并被弹性膜覆盖。 多个按压构件被固定到弹性膜上，用于在流体室内的流体的压力下通过弹性膜将压力施加到工件。

公开(公告)号：US06406364B1

公开(公告)日：2002-06-18

申请号：US09355895

申请日：1999-10-25

申请人： Norio Kimura ,  Hirokuni Hiyama ,  Yutaka Wada ,  Kiyotaka Kawashima ,  Manabu Tsujimura ,  Takayoshi Kawamoto

发明人： Norio Kimura ,  Hirokuni Hiyama ,  Yutaka Wada ,  Kiyotaka Kawashima ,  Manabu Tsujimura ,  Takayoshi Kawamoto

IPC分类号： B24B5700

CPC分类号： B24B37/04 ,  B24B57/02 ,  Y10S451/91

摘要： The object of the present invention is to provide a polishing apparatus that can supply a polishing solution having a non-varying distribution of abrading particles sizes at a steady rate. An apparatus (20) for delivering a polishing solution to a polishing apparatus (22) is disclosed. The apparatus (20) comprises: a solution passage for transporting the polishing solution; and an ultrasonic vibrator (72) being provided in at least one location of the solution passage.

摘要翻译： 本发明的目的是提供一种抛光装置，其能够以稳定的速度供给研磨粒子尺寸不变的抛光液。 公开了一种用于将抛光溶液输送到抛光装置（22）的装置（20）。 装置（20）包括：用于输送抛光溶液的溶液通道; 和超声波振动器（72）设置在溶液通道的至少一个位置。

公开(公告)号：US06350346B1

公开(公告)日：2002-02-26

申请号：US09288768

申请日：1999-04-09

申请人： Masamichi Nakashiba ,  Norio Kimura ,  Isamu Watanabe ,  Yoko Hasegawa

发明人： Masamichi Nakashiba ,  Norio Kimura ,  Isamu Watanabe ,  Yoko Hasegawa

IPC分类号： C23C1600

CPC分类号： B24B37/30 ,  B24B37/32

摘要： A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with an abrasive cloth mounted on an upper surface thereof, and a top ring for holding a workpiece and pressing the workpiece against the abrasive cloth under a first pressing force to polish the workpiece. The top ring has a recess defined therein for accommodating the workpiece therein. A presser ring is vertically movably disposed around the top ring, and pressed against the abrasive cloth under a variable second pressing force. The first and second pressing forces are variable independently of each other, and the second pressing force is determined based on the first pressing force.

摘要翻译： 用于抛光诸如半导体晶片的工件的抛光装置具有安装在其上表面上的研磨布的转台和用于保持工件的顶环，并且在第一按压力下将工件压靠在研磨布上以抛光 工件。 顶环具有限定在其中的凹部，用于在其中容纳工件。 压环围绕顶环垂直移动，并以可变的第二按压力压在研磨布上。 第一和第二按压力彼此独立地变化，并且基于第一按压力来确定第二按压力。