Light emitting device
    94.
    发明授权
    Light emitting device 失效
    发光装置

    公开(公告)号:US5481558A

    公开(公告)日:1996-01-02

    申请号:US261150

    申请日:1994-06-14

    IPC分类号: H01S5/00 H01S5/327 H01S3/19

    CPC分类号: H01L33/0087 H01S5/327

    摘要: According to the present invention, a p-type ZnSe or p-type ZnSSe buffer layer is formed on a p-type GaAs substrate through at least single layer made of AlGaInP-based material and a II/VI-compound laser structure is formed on the p-type ZnSe or p-type ZnSSe buffer layer. Further, an AlGaAs-based buffer layer is provided between the substrate and the AlGaInP-based buffer layer. Further, the AlGaAs-based buffer layer has a composition expressed as Al.sub.0.5 Ga.sub.0.4 As and the AlGaInP-based buffer layer has a composition expressed as Al.sub.0.5 In.sub.0.5 P. Furthermore, a composition ratio x of Al in a buffer layer expressed as Al.sub.x Ga.sub.1-x As is modulated from 0 to 0.6 and a composition ratio y of Al in a buffer layer expressed as (Al.sub.y Ga.sub.1-y).sub.0.5 In.sub.0.5 P is modulated from 0 to 1. According to the present invention, an operation voltage of the II/VI-compound semiconductor laser can be reduced and the green or blue color semiconductor laser of low operation voltage can be obtained. This semiconductor laser can continuously be operated at room temperature and also operated with a long life span.

    摘要翻译: 根据本发明,通过至少由AlGaInP基材料制成的单层,在p型GaAs衬底上形成p型ZnSe或p型ZnSSe缓冲层,并且将II / VI复合激光器结构形成在 p型ZnSe或p型ZnSSe缓冲层。 此外,在基板和基于AlGaInP的缓冲层之间设置基于AlGaAs的缓冲层。 此外,基于AlGaAs的缓冲层具有以Al0.5Ga0.4As表示的组成,AlGaInP基缓冲层具有以Al 0.5 In 0.5 P表示的组成。 此外,以Al x Ga 1-x As表示的缓冲层中的Al的组成比x从0变为0.6,并且将表示为(AlyGa1-y)0.5In0.5P的缓冲层中的Al的组成比y从0调制为 根据本发明,可以降低II / VI化合物半导体激光器的工作电压,并且可以获得低操作电压的绿色或蓝色半导体激光器。 该半导体激光器可以在室温下连续工作,并且寿命长。

    Semiconductor laser
    96.
    发明授权

    公开(公告)号:US5095488A

    公开(公告)日:1992-03-10

    申请号:US675272

    申请日:1991-03-26

    摘要: A semiconductor laser formed into a double hetero junction structure comprising an n-type cladding layer and a p-type cladding layer with an active layer interposed therebetween. The p-type cladding layer has a laminated structure consisting of a first cladding layer of (Al.sub.x Ga.sub.1-x)InP disposed on one side adjacent to the active layer and a second cladding layer of Al.sub.y Ga.sub.1-y As disposed on the reverse side. A deterioration prevention layer of Al.sub.z Ga.sub.1-y As is included in the first cladding layer at a position spaced apart from the second cladding layer by a predetermined thickness. In addition, the second cladding layer is partially removed, and a current stricture layer is formed at the removed portion. Due to the above design, the semiconductor layer is capable of retaining high reliability with certainty.