Process and apparatus for making air-filled cellular structures for use as resilient cushions
    91.
    发明授权
    Process and apparatus for making air-filled cellular structures for use as resilient cushions 有权
    用于制造用作弹性垫的充气蜂窝结构的方法和装置

    公开(公告)号:US08211263B2

    公开(公告)日:2012-07-03

    申请号:US12553834

    申请日:2009-09-03

    申请人: Daniel Kim

    发明人: Daniel Kim

    摘要: A method for fabricating an air-filled cellular structure for use as a resilient cushion. The method includes providing a molding structure including a shelf substantially surrounding a depression, and a platform that fits within the depression and is selectively movable between a plurality of positions relative to the shelf, moving the platform to a preselected position relative to the shelf, wherein the preselected position corresponds to a substantially predetermined amount of air to be contained by the air-filled cellular structure, and using a vacuum device to draw air from within the depression. The method further includes engaging a first portion of a first expanse of generally air-impermeable material with the shelf, whereby the vacuum device draws a second portion of the first expanse of material against the moveable platform, and bonding a first portion of a second expanse of generally air-impermeable material to the first portion of the first expanse, thereby enclosing a volume of air between the first and second expanses. The method may further include bonding a third portion of the first expanse to a second portion of the second expanse, thereby decreasing the volume of the air enclosed between the first and second expanses.

    摘要翻译: 一种用于制造用作弹性垫的充气蜂窝状结构的方法。 该方法包括提供一种模制结构,其包括基本上围绕凹陷的搁板和安装在凹陷内的平台,并且可相对于搁板在多个位置之间选择性地移动,将平台相对于搁架移动到预定位置,其中 预选位置对应于空气填充的细胞结构所包含的基本上预定量的空气,并且使用真空装置从凹陷内抽取空气。 该方法还包括将第一大体上不透气材料的第一部分与搁架接合,由此真空装置将第一部分材料的第二部分拉向可移动平台,并将第二部分的第一部分 通常为不透气的材料到第一穹顶的第一部分,从而在第一和第二膨胀之间包围一定体积的空气。 该方法可以进一步包括将第一穹顶的第三部分接合到第二exp的第二部分,从而减小在第一和第二扩展之间包围的空气的体积。

    MACHINE FOR SEALING VACUUM PACKS AND A CONTROL METHOD THEREFOR
    94.
    发明申请
    MACHINE FOR SEALING VACUUM PACKS AND A CONTROL METHOD THEREFOR 审中-公开
    密封真空包装机及其控制方法

    公开(公告)号:US20110289885A1

    公开(公告)日:2011-12-01

    申请号:US13114130

    申请日:2011-05-24

    IPC分类号: B65B31/04

    摘要: A machine for sealing vacuum packs, include a pump for aspirating air from inside a pack; an electric motor, the electric motor is powered by an electricity grid supply; at least a welding element that is placed in contact with the pack, for welding and sealing the pack; a supply circuit configured to connect the welding element to the electricity grid supply; a control unit that controls the supply circuit to supply energy to the welding element; and a measuring device for measuring a value of a parameter indicating the electrical energy supplied to the welding element. The measuring device is connected to the control unit, which is configured to determine the value of electrical energy supplied to the welding element from the start of the welding, and interrupts supply of the electrical energy to the welding element on reaching a predetermined value of the electrical energy.

    摘要翻译: 用于密封真空包装的机器包括用于从包装内吸出空气的泵; 电动马达,电动马达由电网供电; 至少一个焊接元件,其被放置成与所述包装物接触,用于焊接和密封所述包装; 电源电路,被配置为将焊接元件连接到电网电源; 控制单元,其控制所述供给回路向所述焊接元件供给能量; 以及用于测量表示提供给焊接元件的电能的参数的值的测量装置。 测量装置连接到控制单元,其被配置为从焊接开始确定供应给焊接元件的电能的值,并且在达到预定值的情况下中断向焊接元件的电能供应 电能。

    Adhesive injection process for Pi-joint assemblies
    95.
    发明申请
    Adhesive injection process for Pi-joint assemblies 有权
    用于Pi接头组件的粘合剂注射过程

    公开(公告)号:US20060243382A1

    公开(公告)日:2006-11-02

    申请号:US11111318

    申请日:2005-04-21

    IPC分类号: B29C65/00

    摘要: An adhesive injection process for a Pi-joint assembly comprises the steps of: machining at least two ports into a female part of a Pi-joint assembly; inserting a filler into a gap between a male part and the female part; applying a sealant above the filler; creating a vacuum with a vacuum pump at one port; injecting an adhesive through another port; and drawing the adhesive towards the vacuum pump until the gap under the filler is completely filled with the adhesive. The adhesive injection process incorporates lean technologies that enable increased productivity during the assembly of a Pi-joint design using adhesive bonding. The adhesive injection process is suitable for, but not limited to, applications in the aerospace industry, such as the aircraft airframe assembly. The adhesive injection process may be used for the bonding of upper and lower skins to airframe structure as well as for structure-to-structure bonding.

    摘要翻译: 用于Pi接头组件的粘合剂注射方法包括以下步骤:将至少两个端口加工到Pi接头组件的阴部分中; 将填料插入阳部件和阴部件之间的间隙中; 在填料上施加密封剂; 在一个端口用真空泵产生真空; 通过另一个端口注入粘合剂; 并将粘合剂拉向真空泵,直到填料下面的间隙完全被粘合剂填满。 粘合剂注射过程结合了精益技术,其在使用粘合剂粘合的Pi接头设计的组装期间能够提高生产率。 粘合剂注射方法适用于但不限于在航空航天工业中的应用,例如飞行器机身组件。 粘合剂注射方法可以用于将上皮和下皮粘合到机身结构以及结构 - 结构粘合。