LIGHT EMITTING DEVICE
    91.
    发明公开

    公开(公告)号:US20240113499A1

    公开(公告)日:2024-04-04

    申请号:US18506391

    申请日:2023-11-10

    Abstract: A light emitting device includes a package, a cap, a joining member and at least one laser element. The package includes a metal film. The cap includes a light-transmissive member having a lower surface facing the package and an upper surface opposite to the lower surface, and a light blocking film arranged on the lower surface of the light-transmissive member and having a shape defining at least one opening. The joining member joins a part of the light blocking film and the metal film. The at least one laser element is positioned in a space bounded by the cap and the package such that a part of an edge of the at least one opening defined by the light blocking film is disposed directly above the at least one laser element.

    LIGHT SOURCE DEVICE
    92.
    发明公开
    LIGHT SOURCE DEVICE 审中-公开

    公开(公告)号:US20240106187A1

    公开(公告)日:2024-03-28

    申请号:US18475196

    申请日:2023-09-26

    CPC classification number: H01S5/02255 H01S5/0264

    Abstract: A light source device includes a substrate, an edge-emitting laser element, a surface-emitting laser element, and an optical member. The substrate has a supporting surface. The edge-emitting laser element is directly or indirectly supported by the supporting surface and configured to emit a first light beam in a first direction. The surface-emitting laser element is directly or indirectly supported by the supporting surface and configured to emit a second light beam in a second direction different from the first direction. The optical member is configured to receive the first light beam and the second light beam and to cause the first light beam and the second light beam to exit the optical member as light beams traveling along a same axis.

    LIGHT-EMITTING MODULE
    95.
    发明公开

    公开(公告)号:US20240039249A1

    公开(公告)日:2024-02-01

    申请号:US18360268

    申请日:2023-07-27

    CPC classification number: H01S5/4012 H01S5/4031 H01S5/02253 H01S5/02255

    Abstract: A light-emitting module includes: a support base having a plurality of placement surfaces arranged in a first direction; a plurality of semiconductor laser elements disposed on respective ones of the plurality of placement surfaces, each semiconductor laser element configured to emit laser beams; a plurality of first mirror members, each having a first reflective surface configured to reflect and change a traveling direction of the laser beams from a respective one of the semiconductor laser elements; and a plurality of second mirror members, each having a second reflective surface, at least a portion of the second reflective surface being positioned above at least a portion of a respective one of the first reflective surfaces, and the second reflective surface being configured to reflect, in a second direction intersecting the first direction, the laser beams reflected by the respective first reflective surface.

    Light emitting device and method of manufacturing light emitting device

    公开(公告)号:US11843220B2

    公开(公告)日:2023-12-12

    申请号:US17718857

    申请日:2022-04-12

    CPC classification number: H01S5/02255 H01S5/0236 H01S5/02325

    Abstract: A light emitting device includes: a first semiconductor laser element; a base portion including: a bottom portion including a first upper surface on which the first semiconductor laser element is disposed, and a frame portion surrounding the first semiconductor laser element, the frame portion including a second upper surface positioned above the first upper surface and a support portion positioned between the first upper surface and the second upper surface, the a support portion having a support area; a light reflecting member having a flat plate-shaped and contacting the support area, the light reflecting member being configured to reflect light from the first semiconductor laser element; and a lid portion bonded to the second upper surface.

    Diode laser package for bidirectionally emitting semiconductor laser devices

    公开(公告)号:US11824323B1

    公开(公告)日:2023-11-21

    申请号:US16693806

    申请日:2019-11-25

    Applicant: nLIGHT, Inc.

    Inventor: Manoj Kanskar

    Abstract: The disclosed diode laser packages include a carrier having an optics-mounting surface to which first and second sets of collimating and turning optics are mounted. The carrier includes a heatsink receptacle medially located between the first and second sets. A cooling plenum has a diode-mounting surface and includes heatsink material disposed in the heatsink receptacle. The cooling plenum further has an inlet, an outlet, and a coolant passageway defined between the inlet and the outlet. The coolant passageway is sized to receive the heatsink material disposed in heatsink receptacle. Multiple semiconductor laser diode devices are each mounted atop the diode-mounting surface and positioned for bidirectional emission toward the first and second sets of collimating and turning optics. The multiple semiconductor laser diode devices are thermally coupled to the heatsink material through which coolant is deliverable by the coolant passageway.

Patent Agency Ranking