公开(公告)号：US20240128710A1

公开(公告)日：2024-04-18

申请号：US18487043

申请日：2023-10-14

Applicant: NICHIA CORPORATION

Inventor： Yoshihiro KIMURA ,  Tadaaki MIYATA

IPC: H01S5/02345 ,  H01S5/02315 ,  H01S5/42

CPC classification number: H01S5/02345 ,  H01S5/02315 ,  H01S5/423 ,  H01S5/18361

Abstract: A light-emitting device includes a substrate, a base disposed on the substrate, a light-emitting element disposed over the base, a frame body, and at least one of a functional element and a wire. The frame body includes an inner wall surface surrounding the base and the light-emitting element, an upper surface, and a lower surface connected to the substrate. At least one of the functional element and the wire is disposed on the substrate. At least a part of the at least one of the functional element and the wire is disposed below the light-emitting element. The inner wall surface includes an inclined surface that is inclined so that a distance between the inclined surface and the light-emitting element increases from an upper surface side toward a lower surface side. The at least one of the functional element and the wire is disposed between the inclined surface and the base.

公开(公告)号：US20240106187A1

公开(公告)日：2024-03-28

申请号：US18475196

申请日：2023-09-26

Applicant: NICHIA CORPORATION

Inventor： Yoshihiro KIMURA ,  Tadaaki MIYATA

IPC: H01S5/02255 ,  H01S5/026

CPC classification number: H01S5/02255 ,  H01S5/0264

Abstract: A light source device includes a substrate, an edge-emitting laser element, a surface-emitting laser element, and an optical member. The substrate has a supporting surface. The edge-emitting laser element is directly or indirectly supported by the supporting surface and configured to emit a first light beam in a first direction. The surface-emitting laser element is directly or indirectly supported by the supporting surface and configured to emit a second light beam in a second direction different from the first direction. The optical member is configured to receive the first light beam and the second light beam and to cause the first light beam and the second light beam to exit the optical member as light beams traveling along a same axis.

公开(公告)号：US20210091532A1

公开(公告)日：2021-03-25

申请号：US17021855

申请日：2020-09-15

Applicant: NICHIA CORPORATION

Inventor： Tadaaki MIYATA ,  Yoshihiro KIMURA

IPC: H01S5/022 ,  C03C4/00 ,  C03C27/06

Abstract: A light source device includes: a laser diode; a substrate directly or indirectly supporting the laser diode; and a cap secured to the substrate and covering the laser diode. The cap includes a first glass portion configured to transmit laser light that is emitted from the laser diode, and a second glass portion. At least one of the first glass portion and the second glass portion includes an alkaline glass region.
The first glass portion and the second glass portion are bonded together via an electrically conductive layer that is in contact with the alkaline glass region.

公开(公告)号：US20230170665A1

公开(公告)日：2023-06-01

申请号：US18059160

申请日：2022-11-28

Applicant: NICHIA CORPORATION

Inventor： Yoshihiro KIMURA ,  Tadaaki MIYATA

IPC: H01S5/02257 ,  H01S5/00 ,  H01S5/028

CPC classification number: H01S5/02257 ,  H01S5/0064 ,  H01S5/028

Abstract: A method includes providing a first plate for a front wall that defines a front surface of a recess to accommodate a laser diode, a second plate for a rear wall that defines a rear side of the recess, and a third plate for a main body that defines an upper side and lateral sides of the recess and is connected to the front wall and the rear wall. The third plate has through-holes arranged in a first direction and in a second directions orthogonal to the first direction. The plates are bonded together to produce a stacked body. The stacked body is cut along the first direction and the second direction to produce a plurality of caps from the stacked body. When cutting the stacked body along the first direction, a first incision is made along inner wall surfaces of through-holes adjacent along the first direction.

公开(公告)号：US20180287334A1

公开(公告)日：2018-10-04

申请号：US15939219

申请日：2018-03-28

Applicant: NICHIA CORPORATION

Inventor： Tadaaki MIYATA ,  Yoshihiro KIMURA

IPC: H01S5/022 ,  H01S5/40 ,  H01S5/22 ,  H01S5/02

CPC classification number: H01S5/02208 ,  H01S5/0071 ,  H01S5/0215 ,  H01S5/02216 ,  H01S5/02248 ,  H01S5/02276 ,  H01S5/02292 ,  H01S5/02296 ,  H01S5/221 ,  H01S5/4087

Abstract: Provided is a light source device, including: a base member; a semiconductor laser disposed on the base member; a lateral wall portion formed so as to surround the semiconductor laser; a light-transmissive lid covering a gap surrounded by the base member and the lateral wall portion; and a connection member that airtightly connects an upper surface of the lateral wall portion and a lower surface of the lid over an entire perimeter of the lateral wall portion. The lateral wall portion has a reflecting surface which is an inside surface connected to an upper surface, the reflecting surface being inclined so that light emitted from the semiconductor laser is reflected toward the lid. A dielectric film is continuously formed on the reflecting surface and the upper surface. A height of the connection member is greater than a height of the dielectric film formed on the upper surface.

公开(公告)号：US20240186207A1

公开(公告)日：2024-06-06

申请号：US18441658

申请日：2024-02-14

Applicant: NICHIA CORPORATION

Inventor： Tadaaki MIYATA ,  Yoshihiro KIMURA ,  Masatoshi NAKAGAKI

IPC: H01L23/367 ,  H01L23/373 ,  H01L23/498

CPC classification number: H01L23/367 ,  H01L23/3736 ,  H01L23/49811 ,  H01L23/49838

Abstract: A method for manufacturing a semiconductor device include: providing a submount that has a first surface, a second surface located on a side opposite the first surface, and at least one lateral surface located between the first surface and the second surface, the submount including: a groove located at the second surface, a heat dissipation portion located at the second surface, at least one end face through channel located at the at least one lateral surface, and an electrode pattern on the first surface; physically joining the heat dissipation portion to a package substrate by a first joint material; and after the step of physically joining the heat dissipation portion to the package substrate, disposing a second joint material inside the at least one end face through channel to electrically connect the electrode pattern and the package substrate.

公开(公告)号：US20230085464A1

公开(公告)日：2023-03-16

申请号：US17988848

申请日：2022-11-17

Applicant: NICHIA CORPORATION

Inventor： Tadaaki MIYATA ,  Yoshihiro KIMURA

IPC: H01S5/02257 ,  C03C4/00 ,  C03C27/06 ,  H01S5/02216

Abstract: A light source device includes: a plurality of laser diodes that includes a first laser diode for emitting laser light of red color, a second laser diode for emitting laser light of green color, and a third laser diode for emitting laser light of blue color; a substrate directly or indirectly supporting the plurality of laser diodes; and a cap secured to the substrate and covering the plurality of laser diodes. The cap includes: a first glass portion configured to transmit the laser light that is emitted from the plurality of laser diodes, and a second glass portion. At least one of the first glass portion and the second glass portion comprises an alkaline glass region. The first glass portion and the second glass portion are bonded together via an electrically conductive layer that is in contact with the alkaline glass region. The first glass portion is bonded to the substrate.

公开(公告)号：US20220013429A1

公开(公告)日：2022-01-13

申请号：US17368608

申请日：2021-07-06

Applicant: NICHIA CORPORATION

Inventor： Tadaaki MIYATA ,  Yoshihiro KIMURA ,  Masatoshi NAKAGAKI

IPC: H01L23/367 ,  H01L23/498 ,  H01L23/373

Abstract: A semiconductor device includes: a semiconductor element; a submount on which the semiconductor element is mounted, wherein the submount has a first surface on which the semiconductor element is mounted, a second surface located on a side opposite the first surface, and a lateral surface located between the first surface and the second surface, and wherein the submount comprises: a groove located at the second surface, a heat dissipation portion located at the second surface, and an electrode pattern located at the first surface; a package substrate on which the submount is mounted; a first joint member that physically joins the heat dissipation portion to the package substrate; and a connection portion located on the side surface, wherein the connection portion electrically connects the electrode pattern and the package substrate, and the connection portion comprises a second joint member.

公开(公告)号：US20230291172A1

公开(公告)日：2023-09-14

申请号：US18314590

申请日：2023-05-09

Applicant: NICHIA CORPORATION

Inventor： Tadaaki MIYATA ,  Yoshihiro KIMURA

IPC: H01S5/02257 ,  C03C4/00 ,  C03C27/06 ,  H01S5/02216

CPC classification number: H01S5/02257 ,  C03C4/0071 ,  C03C27/06 ,  H01S5/02216 ,  C03C2204/00

Abstract: A light source device includes: a laser diode configured to emit laser light; a substrate directly or indirectly supporting the laser diode; and a cap secured to the substrate and covering the laser diode, the cap including: a first portion configured to transmit the laser light that is emitted from the laser diode, and a second portion that is bonded to the first portion. The second portion includes: a pair of lateral wall portions that are located at lateral sides of the laser diode, the pair of lateral wall portions being bonded to the first portion, a cover portion that is located above the laser diode and connects the pair of lateral wall portions together, and a rear wall portion that faces the first portion with the laser diode disposed between the first portion and the rear wall portion of the second portion.

公开(公告)号：US20220376466A1

公开(公告)日：2022-11-24

申请号：US17750732

申请日：2022-05-23

Applicant: NICHIA CORPORATION

Inventor： Masatoshi NAKAGAKI ,  Tadaaki MIYATA ,  Yoshihiro KIMURA

IPC: H01S5/02315 ,  H01S5/02355 ,  H01S5/02345

Abstract: A light emitting device includes: at least one semiconductor laser element; a submount; and a base portion having a mounting surface. The submount includes: a first lateral face being located at a side of an exiting lateral surface of the semiconductor laser element, the first lateral face intersecting the upper face of the submount, and the first lateral face being above and separated from the mounting surface; a lower face being set back inside of the submount relative to an edge at which the upper face and the first lateral face intersect in a top view; and a second lateral face being located at the same side as the first lateral face and intersecting the lower face. A portion of a bonding material protrudes from the lower face and extends outward of an edge at which the lower face and the second lateral face intersect.