公开(公告)号：US20210091532A1

公开(公告)日：2021-03-25

申请号：US17021855

申请日：2020-09-15

申请人： NICHIA CORPORATION

发明人： Tadaaki MIYATA ,  Yoshihiro KIMURA

IPC分类号： H01S5/022 ,  C03C4/00 ,  C03C27/06

摘要： A light source device includes: a laser diode; a substrate directly or indirectly supporting the laser diode; and a cap secured to the substrate and covering the laser diode. The cap includes a first glass portion configured to transmit laser light that is emitted from the laser diode, and a second glass portion. At least one of the first glass portion and the second glass portion includes an alkaline glass region.
The first glass portion and the second glass portion are bonded together via an electrically conductive layer that is in contact with the alkaline glass region.

公开(公告)号：US20230085464A1

公开(公告)日：2023-03-16

申请号：US17988848

申请日：2022-11-17

申请人： NICHIA CORPORATION

发明人： Tadaaki MIYATA ,  Yoshihiro KIMURA

IPC分类号： H01S5/02257 ,  C03C4/00 ,  C03C27/06 ,  H01S5/02216

摘要： A light source device includes: a plurality of laser diodes that includes a first laser diode for emitting laser light of red color, a second laser diode for emitting laser light of green color, and a third laser diode for emitting laser light of blue color; a substrate directly or indirectly supporting the plurality of laser diodes; and a cap secured to the substrate and covering the plurality of laser diodes. The cap includes: a first glass portion configured to transmit the laser light that is emitted from the plurality of laser diodes, and a second glass portion. At least one of the first glass portion and the second glass portion comprises an alkaline glass region. The first glass portion and the second glass portion are bonded together via an electrically conductive layer that is in contact with the alkaline glass region. The first glass portion is bonded to the substrate.

公开(公告)号：US20220013429A1

公开(公告)日：2022-01-13

申请号：US17368608

申请日：2021-07-06

申请人： NICHIA CORPORATION

发明人： Tadaaki MIYATA ,  Yoshihiro KIMURA ,  Masatoshi NAKAGAKI

IPC分类号： H01L23/367 ,  H01L23/498 ,  H01L23/373

摘要： A semiconductor device includes: a semiconductor element; a submount on which the semiconductor element is mounted, wherein the submount has a first surface on which the semiconductor element is mounted, a second surface located on a side opposite the first surface, and a lateral surface located between the first surface and the second surface, and wherein the submount comprises: a groove located at the second surface, a heat dissipation portion located at the second surface, and an electrode pattern located at the first surface; a package substrate on which the submount is mounted; a first joint member that physically joins the heat dissipation portion to the package substrate; and a connection portion located on the side surface, wherein the connection portion electrically connects the electrode pattern and the package substrate, and the connection portion comprises a second joint member.

公开(公告)号：US20220376466A1

公开(公告)日：2022-11-24

申请号：US17750732

申请日：2022-05-23

申请人： NICHIA CORPORATION

发明人： Masatoshi NAKAGAKI ,  Tadaaki MIYATA ,  Yoshihiro KIMURA

IPC分类号： H01S5/02315 ,  H01S5/02355 ,  H01S5/02345

摘要： A light emitting device includes: at least one semiconductor laser element; a submount; and a base portion having a mounting surface. The submount includes: a first lateral face being located at a side of an exiting lateral surface of the semiconductor laser element, the first lateral face intersecting the upper face of the submount, and the first lateral face being above and separated from the mounting surface; a lower face being set back inside of the submount relative to an edge at which the upper face and the first lateral face intersect in a top view; and a second lateral face being located at the same side as the first lateral face and intersecting the lower face. A portion of a bonding material protrudes from the lower face and extends outward of an edge at which the lower face and the second lateral face intersect.

公开(公告)号：US20210167576A1

公开(公告)日：2021-06-03

申请号：US17108872

申请日：2020-12-01

申请人： NICHIA CORPORATION

发明人： Yoshihiro KIMURA ,  Tadaaki MIYATA

IPC分类号： H01S5/0683 ,  H01S5/022 ,  H01S5/40

摘要： A light source device includes: first and second laser diodes; a reflector having: first and second reflecting faces configured to reflect a portion of light from the respective first and second laser diodes and to transmit a portion of the light from the respective first and second laser diodes, and first and second exit faces configured to allow the portions of the light transmitted through the respective first and second reflecting faces to exit; and a photodetector including: first and second light receiving element configured to receive light exiting the first and second exit faces, respectively. The reflector is configured such that the light transmitted through the first reflecting face is hindered from exiting the second exit face and the light transmitted through the second reflecting face is hindered from exiting the first exit face.

公开(公告)号：US20180366903A1

公开(公告)日：2018-12-20

申请号：US16007964

申请日：2018-06-13

申请人： NICHIA CORPORATION

发明人： Tadaaki MIYATA ,  Yoshihiro KIMURA

IPC分类号： H01S5/022

CPC分类号： H01S5/02292 ,  H01S5/0216 ,  H01S5/02216 ,  H01S5/02296

摘要： A light source device includes: a base member; a semiconductor laser mounted on an upper surface of the base member; a lateral wall portion having: a lower surface facing the upper surface of the base member and being a non-reflecting surface, and a reflecting surface that reflects light emitted from the semiconductor laser, is connected to the lower surface of the lateral wall portion at a lower end portion of the reflecting surface, and is inclined with respect to the upper surface of the base member; a first bonding film that is a metal film disposed in a region on the upper surface of the base member facing the lower surface of the lateral wall portion; a second bonding film that is a metal film disposed on the lower surface of the lateral wall portion; and a metal bonding member fuse-bonded to the first bonding film and the second bonding film to each other. An end portion of the first bonding film at a reflecting-surface side and an end portion of the second bonding film at the reflecting-surface side are located separately from the lower end portion of the reflecting surface. A distance between the end portion of the first bonding film at the reflecting-surface side and the lower end portion of the reflecting surface is different from a distance between the end portion of the second bonding film at the reflecting-surface side and the lower end portion of the reflecting surface.

公开(公告)号：US20180287334A1

公开(公告)日：2018-10-04

申请号：US15939219

申请日：2018-03-28

申请人： NICHIA CORPORATION

发明人： Tadaaki MIYATA ,  Yoshihiro KIMURA

IPC分类号： H01S5/022 ,  H01S5/40 ,  H01S5/22 ,  H01S5/02

CPC分类号： H01S5/02208 ,  H01S5/0071 ,  H01S5/0215 ,  H01S5/02216 ,  H01S5/02248 ,  H01S5/02276 ,  H01S5/02292 ,  H01S5/02296 ,  H01S5/221 ,  H01S5/4087

摘要： Provided is a light source device, including: a base member; a semiconductor laser disposed on the base member; a lateral wall portion formed so as to surround the semiconductor laser; a light-transmissive lid covering a gap surrounded by the base member and the lateral wall portion; and a connection member that airtightly connects an upper surface of the lateral wall portion and a lower surface of the lid over an entire perimeter of the lateral wall portion. The lateral wall portion has a reflecting surface which is an inside surface connected to an upper surface, the reflecting surface being inclined so that light emitted from the semiconductor laser is reflected toward the lid. A dielectric film is continuously formed on the reflecting surface and the upper surface. A height of the connection member is greater than a height of the dielectric film formed on the upper surface.