Abstract:
A process for forming a silicon nitride layer on a gate oxide film as part of formation of a gate structure in a semiconductor device includes: forming a layer of silicon nitride on top of a gate oxide film on a semiconductor substrate by a nitridation process, heating the semiconductor substrate in an annealing chamber, exposing the semiconductor substrate to N2 in the annealing chamber, and exposing the semiconductor substrate to a mixture of N2 and N2O in the annealing chamber.
Abstract:
A fault detection system comprises a data server configured to collect parameters incoming from at least one apparatus, at least one fault-sensing module configured to generate an alarm signal if the parameter exceeds a predetermined specification, a monitoring module configured to restart the fault-sensing module if the fault-sensing module operates abnormally, and a remote controller configured to control the data server, the fault-sensing module, and the monitoring module. The method for managing the fault detection system comprises steps of storing parameters incoming from at least one apparatus in the data server; checking whether the parameter exceeds a predetermined specification by the fault-sensing module in a last-in first-out manner; generating an alarm signal if the parameter exceeds a predetermined specification by the fault-sensing module; checking whether the fault-sensing module operates abnormally by the monitoring module; and restarting the fault-sensing module by the monitoring module if the fault-sensing module operates abnormally.
Abstract:
A probing apparatus comprises a wafer chuck configured to receive a semiconductor wafer having a plurality of integrated circuit devices and test keys configured to monitor the fabrication quality of the integrated circuit devices, a carrier configured to receive a probe card having a plurality of probe needles configured to contact the test keys of the semiconductor wafer and collect electrical information of the integrated circuit devices, and an angular adjusting module configured to adjust the angle between the probe card and the semiconductor wafer by rotating the semiconductor wafer.
Abstract:
An exemplary hollow stylus-shaped structure is disclosed, including a hollow column spacer formed over a base layer and a hollow cone spacer stacked over the hollow column spacer, wherein the hollow cone spacer, the hollow column spacer, and the base layer form a space, and sidewalls of the hollow cone spacer and the hollow column spacer are made of silicon-containing organic or inorganic materials.
Abstract:
A method for forming a phase-change memory element. The method includes providing a substrate with an electrode formed thereon; sequentially forming a conductive layer and a first dielectric layer on the substrate; forming a patterned photoresist layer on the first dielectric layer; subjecting the patterned photoresist layer to a trimming process, remaining a photoresist pillar; etching the first dielectric layer with the photoresist pillar as etching mask, remaining a dielectric pillar; comformally forming a first phase-change material layer on the conductive layer and the dielectric pillar to cover the top surface and side walls of the dielectric pillar; forming a second dielectric layer to cover the first phase-change material layer; subjecting to the second dielectric layer and the first phase-change material layer to a planarization until exposing the top surface of the dielectric pillar; and forming a second phase-change material layer on the second dielectric layer.
Abstract:
A data programming circuit for storing a writing data into a memory cell is provided. The data programming circuit includes a control circuit and a current generating circuit. The control circuit generates a control signal according to the writing data. The current generating circuit provides a writing current to the memory cell to change a crystalline state of the memory cell. The writing current has a pulse width corresponding to the writing data, and the crystalline state corresponds to the writing data.
Abstract:
A multi-fin field effect transistor includes a substrate, an oxide layer, a conductive layer, a gate oxide layer, and a doped region. The substrate is surrounded by a trench, and there are at least two fin-type silicon layers formed in the substrate in a region prepared to form a gate thereon. The oxide layer is disposed in the trench and the top surface of the oxide layer is lower than that of the fin-type silicon layers. The conductive layer is disposed in the region prepared to form a gate. The top surface of the conductive layer is higher than that of the fin-type silicon layers. The gate oxide layer is disposed between the conductive layer and the fin-type silicon layers and disposed between the conductive layer and the substrate. The doped region is disposed in the substrate on both sides of the conductive layer.
Abstract:
Phase change memory devices and methods for fabricating the same are provided. A phase change memory device includes a first conductive electrode disposed in a first dielectric layer. A second dielectric layer is disposed over the first dielectric layer. A phase change material layer is disposed in the second dielectric layer and electrically connected to the first conductive electrode. A space is disposed in the second dielectric layer to at least isolate a sidewall of the phase change material layer and the second dielectric layer adjacent thereto. A second conductive electrode is disposed in the second dielectric layer and electrically connected to the phase change material layer.
Abstract:
Devices controlling a phase change storage element and methods for increasing reliability of a phase change storage element. The invention introduces a first operation mode and a second operation mode. A reference phase change storage element is forced a write current for an ideal conduction period in the first operation mode. In the second operation mode, the invention generates a proper conduction period based on the resistance of the reference phase change storage element, and forces the write current into the controlled phase change storage element for the proper conduction period.
Abstract:
A phase change memory device is disclosed. A second conductive spacer is under a first conductive spacer. A phase change layer comprises a first portion substantially parallel to the first and second conductive spacers and a second portion on top of the second conductive spacer, wherein the second conductive spacer is electrically connected to the first conductive spacer through the second portion of the phase change layer.