Abstract:
A semiconductor device for protection from electrostatic discharge includes a number of modules for protection from electrostatic discharge. Each module includes a thyristor having terminals and a gate, and a diode coupled in antiparallel to the terminals of the thyristor. Each module is sized to share a saturation current with neighboring modules when an electrostatic discharge current is received. A resistive network couples modules between two terminals. A triggering circuit includes a common triggering output that is coupled to the gate of the thyristor of each module and a common buried semiconductor layer contacts each module.
Abstract:
A semiconductor electro-optical phase shifter may include a substrate, an optical waveguide segment (12) formed on the substrate, and first and second zones of opposite conductivity types configured to form a first bipolar junction perpendicular to the substrate. The phase shifter may also include a dynamic control structure configured to reverse bias the first junction and a static control structure configured to direct a quiescent current in the second zone, parallel to the first junction.
Abstract:
A delay circuit includes first and second transistors and a biasing circuit. The first transistor has a control node coupled to an input node of the delay circuit, a first main current node coupled to a first supply voltage, and a second main current node coupled to an output node of the delay circuit. A second transistor has a control node coupled to the input node, a first main current node coupled to a second supply voltage, and a second main current node coupled to the output node. The biasing circuit is configured to generate first and second differential control voltages, to apply the first differential control voltage to a further control node of the first transistor and to apply the second differential control voltage to a further control node of the second transistor.
Abstract:
A three-dimensional integrated structure may include two assembled integrated circuits respectively including two metallic lines, and at least two cavities passing through one of the integrated circuits and opening onto two locations respectively in electrical contact with the two metallic lines. The cavities may be sized to place a measuring apparatus at the bottom of the cavities, and in electrical contact with the two locations.
Abstract:
A device includes integrated circuit chips mounted on one another. At least one component for protecting elements of a first one of the chips is formed in a second one of the chips. Preferably, the chips are of SOI type, the second chip includes an SOI layer having a first thickness sufficient to support the component for protecting elements. The first chip also includes an SOI layer but having a second thickness smaller than the first thickness that is insufficient to support the component for protecting elements. The SOI layer of the second chip may be an optical waveguide layer.
Abstract:
A multiple phase oscillator includes a master oscillator that injection locks a first ring oscillator. The free-running frequency of the first ring oscillator is adjustable through a control signal. A second ring oscillator has a same structure as the first ring oscillator and is connected to operate in a free-running mode. The free-running frequency of the second ring oscillator is adjustable through the control signal. A control loop senses the output of the second ring oscillator and adjusts the control signal so that the free-running frequency of the second ring oscillator matches a desired value.
Abstract:
An electro-optical phase shifter to be located in an optical waveguide may include a rib of a semiconductor material extending along a length of the optical waveguide and a control structure configured to modify a concentration of carriers in the rib according to a control voltage present between first and second control terminals of the phase shifter. The control structure may include a conductive layer covering a portion of the rib and electrically connected to a first of the control terminals. An insulating layer may be configured to electrically isolate the conductive layer from the rib.
Abstract:
A semiconductor device for protection from electrostatic discharge includes a number of modules for protection from electrostatic discharge. Each module includes a thyristor having terminals and a gate, and a diode coupled in antiparallel to the terminals of the thyristor. Each module is sized to share a saturation current with neighboring modules when an electrostatic discharge current is received. A resistive network couples modules between two terminals. A triggering circuit includes a common triggering output that is coupled to the gate of the thyristor of each module and a common buried semiconductor layer contacts each module.
Abstract:
Method for fabricating a transistor comprising the steps consisting of: forming sacrificial zones in a semi-conductor layer, either side of a transistor channel zone, forming insulating spacers on said sacrificial zones against the sides of the gate of said transistor, removing said sacrificial zones so as to form cavities, with the cavities extending on either side of said channel zone and penetrating under said spacers, forming doped semi-conductor material in said cavities, with said semi-conductor material penetrating under said spacers.
Abstract:
An optical modulator uses an optoelectronic phase comparator configured to provide, in the form of an electrical signal, a measure of a phase difference between two optical waves. The phase comparator includes an optical directional coupler having two coupled channels respectively defining two optical inputs for receiving the two optical waves to be compared. Two photodiodes are configured to respectively receive the optical output powers of the two channels of the directional coupler. An electrical circuit is configured to supply, as a measure of the optical phase shift, an electrical signal proportional to the difference between the electrical signals produced by the two photodiodes.