公开(公告)号：US20120087171A1

公开(公告)日：2012-04-12

申请号：US12899912

申请日：2010-10-07

Applicant: Seung Hyun LEE

Inventor： Seung Hyun LEE

IPC: G11C11/00 ,  H01L21/02

CPC classification number: H01L27/2463 ,  H01L27/222 ,  H01L45/04 ,  H01L45/06 ,  H01L45/1233

Abstract: A semiconductor memory device with a variable resistance element includes a plurality of active areas isolated from one another by an isolation layer formed in a substrate, a plurality of word lines crossing over the plurality of active areas, an auxiliary source line disposed between two selected word lines and commonly connected to at least two active areas among the plurality of active areas between the two selected word lines, and a plurality of contact plugs each connected to a corresponding active area.

Abstract translation: 具有可变电阻元件的半导体存储器件包括通过形成在衬底中的隔离层彼此隔离的多个有源区域，跨越多个有源区域的多个字线，设置在两个选择字之间的辅助源极线 并且通常连接到两个所选字线之间的多个有效区域中的至少两个有效区域，以及各自连接到相应的有效区域的多个接触插塞。

公开(公告)号：US20110287584A1

公开(公告)日：2011-11-24

申请号：US13197249

申请日：2011-08-03

Applicant: Min Suk SUH ,  Seung Taek YANG ,  Seung Hyun LEE ,  Jong Hoon KIM

Inventor： Min Suk SUH ,  Seung Taek YANG ,  Seung Hyun LEE ,  Jong Hoon KIM

IPC: H01L21/78

CPC classification number: H01L23/4334 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/525 ,  H01L24/19 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/15311

Abstract: A semiconductor package includes a semiconductor chip having an upper surface, side surfaces connected with the upper surface, and bonding pads formed on the upper surface. A first insulation layer pattern is formed to cover the upper surface and the side surfaces of the semiconductor chip and expose the bonding pads. Re-distribution lines are placed on the first insulation layer pattern and include first re-distribution line parts and second re-distribution line parts. The first re-distribution line parts have an end connected with the bonding pads and correspond to the upper surface of the semiconductor chip and the second re-distribution line parts extend from the first re-distribution line parts beyond the side surfaces of the semiconductor chip. A second insulation layer pattern is formed over the semiconductor chip and exposes portions of the first re-distribution line parts and the second re-distribution line parts.

Abstract translation: 半导体封装包括具有上表面的半导体芯片，与上表面连接的侧表面，以及形成在上表面上的焊盘。 形成第一绝缘层图案以覆盖半导体芯片的上表面和侧表面并且暴露接合焊盘。 再分配线路放置在第一绝缘层图案上，并且包括第一再分配线部分和第二再分配线部分。 第一再分配线部分具有与接合焊盘连接的端部并且对应于半导体芯片的上表面，并且第二再分配线部分从第一再分配线部分延伸超过半导体芯片的侧表面 。 在半导体芯片上形成第二绝缘层图案，并且暴露出第一再分配线部分和第二再分配线部分的部分。

公开(公告)号：US20110274068A1

公开(公告)日：2011-11-10

申请号：US13142769

申请日：2009-12-28

Applicant: Seung-Hyun Lee ,  Hyung-Joon Jeon ,  Kuk-Jin Song

Inventor： Seung-Hyun Lee ,  Hyung-Joon Jeon ,  Kuk-Jin Song

IPC: H04W72/04

CPC classification number: H04W72/04 ,  H04L1/0003 ,  H04L1/0009 ,  H04L1/0017 ,  H04L5/003 ,  H04L27/0008 ,  H04W52/262 ,  H04W52/286 ,  H04W52/367 ,  H04W52/50 ,  H04W72/00 ,  H04W72/12

Abstract: The present invention relates to a method and to an apparatus for controlling the scheduling in a radio communication system, which comprise calculating a first resource value for a first data packet using packet information of the first data packet, determining an MCS level and a transmission power density for the first data packet and a second data packet using a resource allocation parameter for the first data packet and packet information of the second data packet, calculating a second resource value for the first data packet and the second data packet using the MCS level and the transmission power density determined in the previous step, and allocating the second resource value for the first data packet and the second data packet as an uplink resource if the second resource value is not greater than the total number of allocable resources of an uplink frame.

Abstract translation: 本发明涉及用于控制无线电通信系统中的调度的方法和装置，其包括使用第一数据分组的分组信息来计算第一数据分组的第一资源值，确定MCS级别和传输功率 使用第一数据分组的资源分配参数和第二数据分组的分组信息的第二数据分组，使用MCS级别计算第一数据分组和第二数据分组的第二资源值，以及 如果所述第二资源值不大于上行链路帧的可分配资源的总数，则将所述第一数据分组和所述第二数据分组的所述第二资源值分配为上行链路资源。

公开(公告)号：US20110233795A1

公开(公告)日：2011-09-29

申请号：US13158813

申请日：2011-06-13

Applicant: Jong Hoon KIM ,  Min Suk SUH ,  Seung Taek YANG ,  Seung Hyun LEE ,  Tae Min KANG

Inventor： Jong Hoon KIM ,  Min Suk SUH ,  Seung Taek YANG ,  Seung Hyun LEE ,  Tae Min KANG

IPC: H01L23/488

CPC classification number: H01L25/0652 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3114 ,  H01L24/19 ,  H01L24/82 ,  H01L24/96 ,  H01L24/97 ,  H01L25/50 ,  H01L2221/68345 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/19 ,  H01L2224/32145 ,  H01L2224/73217 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2225/06562 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01059 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/18161 ,  H01L2924/18162 ,  H01L2224/82 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/83005

Abstract: A stacked wafer level package includes a first semiconductor chip having a first bonding pad and a second semiconductor chip having a second bonding pad. Both bonding pads of the semiconductor chips face the same direction. The second semiconductor chip is disposed in parallel to the first semiconductor chip. A third semiconductor chip is disposed over the first and second semiconductor chips acting as a supporting substrate. The third semiconductor chip has a third bonding pad that is exposed between the first and the second semiconductor chips upon attachment. Finally, a redistribution structure is electrically connected to the first, second, and third bonding pads.

Abstract translation: 堆叠的晶片级封装包括具有第一焊盘的第一半导体芯片和具有第二焊盘的第二半导体芯片。 半导体芯片的两个接合焊盘面向相同的方向。 第二半导体芯片与第一半导体芯片平行设置。 第三半导体芯片设置在用作支撑衬底的第一和第二半导体芯片上。 第三半导体芯片具有在附接时在第一和第二半导体芯片之间露出的第三焊盘。 最后，再分布结构电连接到第一，第二和第三键合焊盘。

公开(公告)号：US07978640B2

公开(公告)日：2011-07-12

申请号：US12019432

申请日：2008-01-24

Applicant: Seung-Hyun Lee ,  Jin-Young Oh

Inventor： Seung-Hyun Lee ,  Jin-Young Oh

IPC: H04Q7/00 ,  H04L12/28 ,  H04J3/24

CPC classification number: H04W28/06 ,  H04L47/10 ,  H04L69/22

Abstract: Disclosed is a method and an apparatus for transmitting and receiving data via a MAC protocol in a mobile communication system. The method includes inputting at least one Service Data Unit (SDU) containing transmission data through a corresponding logical channel and generating at least one first Protocol Data Unit (PDU) that includes said at least one SDU without including multiplexing information for identification of the logical channel, by a first transmission entity; acquiring the first PDU and generating a second PDU including the first PDU in a payload of the second PDU, by a second transmission entity that operates between the first transmission entity and a physical layer; inserting the multiplexing information for identification of the logical channel corresponding to said at least one first PDU into header information of the second PDU; and transmitting the second PDU through the physical layer. The method can reduce load due to additional processing, such as a bit operation or memory copying, in a receiver requiring high speed data transmission.

Abstract translation: 公开了一种用于在移动通信系统中通过MAC协议发送和接收数据的方法和装置。 该方法包括通过相应的逻辑信道输入包含传输数据的至少一个服务数据单元（SDU），并且生成包括所述至少一个SDU的至少一个第一协议数据单元（PDU），而不包括用于识别逻辑信道的复用信息 ，由第一传输实体; 通过在所述第一传输实体和物理层之间操作的第二传输实体获取所述第一PDU并在所述第二PDU的有效载荷中生成包括所述第一PDU的第二PDU; 将用于识别对应于所述至少一个第一PDU的逻辑信道的复用信息插入到第二PDU的报头信息中; 以及通过所述物理层发送所述第二PDU。 该方法可以在需要高速数据传输的接收机中由于诸如位操作或存储器复制的附加处理而减少负载。

公开(公告)号：US20100221894A1

公开(公告)日：2010-09-02

申请号：US12064861

申请日：2006-12-28

Applicant: Woo Young Lee ,  Jin Hee Ham ,  Woo Young Shim ,  Jong Wook Roh ,  Seung Hyun Lee ,  Kye Jin Jeong

Inventor： Woo Young Lee ,  Jin Hee Ham ,  Woo Young Shim ,  Jong Wook Roh ,  Seung Hyun Lee ,  Kye Jin Jeong

IPC: H01L21/20

CPC classification number: C23C14/14 ,  B82Y30/00 ,  B82Y40/00 ,  C30B1/12 ,  C30B29/02 ,  C30B29/60

Abstract: Provided is a method for manufacturing a nanowire using stress-induced growth. The method includes: providing a substrate with an intermediate layer formed thereon; forming thin film on the intermediate layer, wherein the thin film made of material having more than 2×10−6/° C. of thermal expansion coefficient difference from the intermediate layer; inducing tensile stress due to the thermal expansion coefficient difference between the thin film and the substrate by performing a heat treatment on the substrate with the thin film formed; and growing single-crystalline nanowire of the material by inducing compressive stress at the thin film through cooling of the substrate.

Abstract translation: 提供了使用应力诱导生长制造纳米线的方法。 该方法包括：向基板提供其上形成的中间层; 在中间层上形成薄膜，其中由与中间层的热膨胀系数差大于2×10 -6 /℃的材料制成的薄膜; 通过对形成有薄膜的基板进行热处理，引起由于薄膜和基板之间的热膨胀系数差引起的拉伸应力; 并通过冷却衬底在薄膜处诱导压应力来增长材料的单晶纳米线。

公开(公告)号：US07752540B2

公开(公告)日：2010-07-06

申请号：US11148907

申请日：2005-06-09

Applicant: Sang Yup Lee ,  Hong Seok Yun ,  Dong Yup Lee ,  Seung Hyun Lee ,  Joon Woo Jeong ,  Tae Yong Kim

Inventor： Sang Yup Lee ,  Hong Seok Yun ,  Dong Yup Lee ,  Seung Hyun Lee ,  Joon Woo Jeong ,  Tae Yong Kim

IPC: G06F17/00

CPC classification number: G06F19/26 ,  G06F19/12

Abstract: The present invention relates to an MFA (Metabolic Flux Analysis) information system using an XML (eXtensible Markup Language) and an operating method thereof. More specifically, the invention relates to an MFA information system and an operating method thereof, which generates, edits, stores and visualizes an MFA model feature and an MFA object using XML, and edits, stores and visualizes the result obtained by performing MFA based on the object. The present invention provides the MFA information system and method capable of generating, editing, storing and visualizing MFA model features and MFA objects using XML. Accordingly, MFA can be easily performed by utilizing advantages of XML, such as transplantation, reusability, deciphering, scalability, flexibility and effective data exchange, and thus the present invention can be applied to cell improvement using metabolic engineering.

Abstract translation: 本发明涉及使用XML（可扩展标记语言）的MFA（代谢通量分析）信息系统及其操作方法。 更具体地，本发明涉及一种MFA信息系统及其操作方法，其使用XML生成，编辑，存储和可视化MFA模型特征和MFA对象，并且通过执行MFA获得的结果进行编辑，存储和可视化 物体。 本发明提供了能够使用XML来生成，编辑，存储和可视化MFA模型特征和MFA对象的MFA信息系统和方法。 因此，通过利用移植，可重用性，解密，可扩展性，灵活性和有效的数据交换等XML的优点，可以容易地实现MFA，因此本发明可以应用于使用代谢工程的细胞改良。

公开(公告)号：US20100054183A1

公开(公告)日：2010-03-04

申请号：US12325441

申请日：2008-12-01

Applicant: Dong-Ryeol Shin ,  Choon-Sung Nam ,  Hee-Jin Jeong ,  Yoe-Jin Yoon ,  Gun-Ha Lee ,  Sung-Jun Na ,  Jong-Wan Yoon ,  Sang-Min Lee ,  Dong-Guen Kim ,  Seung-Hyun Lee ,  Kee-Hyun Choi ,  Yi-Seok Jeong ,  Hyun-Chul Kim ,  Sang-Hwan Ryu

Inventor： Dong-Ryeol Shin ,  Choon-Sung Nam ,  Hee-Jin Jeong ,  Yoe-Jin Yoon ,  Gun-Ha Lee ,  Sung-Jun Na ,  Jong-Wan Yoon ,  Sang-Min Lee ,  Dong-Guen Kim ,  Seung-Hyun Lee ,  Kee-Hyun Choi ,  Yi-Seok Jeong ,  Hyun-Chul Kim ,  Sang-Hwan Ryu

IPC: H04W40/02

CPC classification number: H04W40/26 ,  H04L45/02 ,  H04L45/122

Abstract: Disclosed herein are a sensor network control method for data path establishment and recovery and a sensor network therefor. The sensor network control method includes the steps of (a) the sink node or a first sensor node creating an interest message, including information about a hop count between itself and the sink node, and transmitting the interest message to one or more neighboring nodes; (b) a second sensor node, which has received the interest message, creating a routing table using the hop count information of the interest message and information about the node having transmitted the interest message, (c) the second sensor node determining a data transmission path for data transmission to the sink node using the routing table; and (d) the second sensor node transmitting an interest message, including information about a hop count between itself and the sink node to at least one neighboring node.

Abstract translation: 本文公开了一种用于数据路径建立和恢复的传感器网络控制方法及其传感器网络。 传感器网络控制方法包括以下步骤：（a）汇聚节点或创建兴趣消息的第一传感器节点，包括关于其自身与汇聚节点之间的跳数的信息，以及将兴趣消息发送到一个或多个相邻节点; （b）已经接收到兴趣消息的第二传感器节点，使用兴趣消息的跳数信息和关于已经发送了兴趣消息的节点的信息来创建路由表，（c）第二传感器节点确定数据传输 使用路由表向数据节点传输数据的路径; 以及（d）所述第二传感器节点向至少一个相邻节点发送包括关于其与所述宿节点之间的跳数的信息的兴趣消息。

公开(公告)号：US20100040017A1

公开(公告)日：2010-02-18

申请号：US12362617

申请日：2009-01-30

Applicant: Dong-Ryeol Shin ,  Dong-Guen Kim ,  Sang-Min Lee ,  Yoe-Jin Yoon ,  Seung-Hyun Lee ,  Kee-Hyun Choi ,  Gun-Ha Lee ,  Jong-Wan Yoon ,  Choon-Sung Nam ,  Hee-Jin Jeong ,  Ho-Jin Shin ,  Sang-Hwan Ryu

Inventor： Dong-Ryeol Shin ,  Dong-Guen Kim ,  Sang-Min Lee ,  Yoe-Jin Yoon ,  Seung-Hyun Lee ,  Kee-Hyun Choi ,  Gun-Ha Lee ,  Jong-Wan Yoon ,  Choon-Sung Nam ,  Hee-Jin Jeong ,  Ho-Jin Shin ,  Sang-Hwan Ryu

IPC: H04W36/00

CPC classification number: H04W36/0011 ,  H04W8/085 ,  H04W80/04

Abstract: Disclosed herein are a method of controlling Hierarchical Mobile IPv6 (HMIPv6) network-based handover and an Access Router (AR) and Mobile Node (MN) therefor. The method include the steps of a first AR, to which a MN is connected, receiving an L3 handover initiation message, including a Media Access Control (MAC) address of the MN and the ID of a target Base Station (BS); the first AR creating a Local Care-of Address (LCoA) based on the MAC address of the MN and the ID of the target BS, and performing Binding Update (BU) on a Mobility Anchor Point (MAP) using the created LCoA; when an L2 handover completion message is received from the target BS of the MN, a second AR creating an LCoA and transmitting the LCoA to the MN; and the MN receiving the LCoA from the second AR and configuring the received LCoA as its own LCoA.

Abstract translation: 本文公开了一种控制分层移动IPv6（HMIPv6）基于网络的切换以及用于其的接入路由器（AR）和移动节点（MN）的方法。 该方法包括MN连接的第一AR的步骤，接收L3切换发起消息，包括MN的媒体接入控制（MAC）地址和目标基站（BS）的ID; 第一AR基于MN的MAC地址和目标BS的ID创建本地转交地址（LCoA），并使用所创建的LCoA在移动锚点（MAP）上执行绑定更新（BU）; 当从MN的目标BS接收到L2切换完成消息时，创建LCoA并向MN发送LCoA的第二AR; 并且MN从第二AR接收LCoA，并将接收的LCoA配置为其自身的LCoA。

公开(公告)号：US20090230565A1

公开(公告)日：2009-09-17

申请号：US12244322

申请日：2008-10-02

Applicant: Seung Taek YANG ,  Min Suk SUH ,  Seung Hyun LEE ,  Jong Hoon KIM

Inventor： Seung Taek YANG ,  Min Suk SUH ,  Seung Hyun LEE ,  Jong Hoon KIM

IPC: H01L23/52 ,  H01L21/00

CPC classification number: H01L23/481 ,  H01L23/3128 ,  H01L25/0657 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2224/05099

Abstract: A stacked semiconductor package and a method for manufacturing the same are presented which exhibit a reduced electrical resistance and an increased junction force. The semiconductor package includes at least two semiconductor chips stacked upon each other. Each semiconductor chip has a plurality of bonding pads formed on upper surfaces and has via-holes. First wiring lines are located on the upper surfaces of the semiconductor chips, on the surfaces of the via-holes, and respectively connected onto their respective bonding pads. Second wiring lines are located on lower surfaces of the semiconductor chips and on the surfaces of the respective via-holes which connect to their respective first wiring lines. The semiconductor chips are stacked so that the first wiring lines on an upper surface of an upwardly positioned semiconductor chip are respectively joined with corresponding second wiring lines formed on a lower surface of a downwardly positioned semiconductor chip.

Abstract translation: 本发明提供一种叠层半导体封装及其制造方法，其具有降低的电阻和增加的接合力。 半导体封装包括彼此堆叠的至少两个半导体芯片。 每个半导体芯片具有形成在上表面上并具有通孔的多个接合焊盘。 第一布线位于半导体芯片的上表面上，位于通孔的表面上，分别连接到它们各自的焊盘上。 第二布线位于半导体芯片的下表面和连接到它们各自的第一布线的相应通孔的表面上。 半导体芯片被堆叠，使得位于向上定位的半导体芯片的上表面上的第一布线分别与形成在向下定位的半导体芯片的下表面上的对应的第二布线接合。