公开(公告)号：US10969574B2

公开(公告)日：2021-04-06

申请号：US16072157

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Sasha N. Oster ,  Feras Eid ,  Johanna M. Swan ,  Shawna M. Liff ,  Aleksandar Aleksov ,  Thomas L. Sounart ,  Baris Bicen ,  Valluri R. Rao

IPC: G02B26/00 ,  G02B26/08 ,  H01L41/047 ,  H01L41/27 ,  H01L41/314 ,  H01L41/332

Abstract: Embodiments of the invention include a piezo-electric mirror in an microelectronic package and methods of forming the package. According to an embodiment the microelectronic package may include an organic substrate with a cavity formed in the organic substrate. In some embodiments, an actuator is anchored to the organic substrate and extends over the cavity. For example, the actuator may include a first electrode and a piezo-electric layer formed on the first electrode. A second electrode may be formed on the piezo-electric layer. Additionally, a mirror may be formed on the actuator. Embodiments allow for the piezo-electric layer to be formed on an organic package substrate by using low temperature crystallization processes. For example, the piezo-electric layer may be deposited in an amorphous state. Thereafter, a laser annealing process that includes a pulsed laser may be used to crystallize the piezo-electric layer.

公开(公告)号：US10959633B2

公开(公告)日：2021-03-30

申请号：US15837508

申请日：2017-12-11

Applicant: Intel Corporation

Inventor： Amit Baxi ,  Adel Elsherbini ,  Vincent Mageshkumar ,  Sasha Oster ,  Aleksandar Aleksov ,  Feras Eid

IPC: A61B5/0408 ,  A61B5/01 ,  A61B5/026 ,  A61B5/0205 ,  A61B5/021 ,  A61B5/08 ,  A61B5/00

Abstract: Sensing patch systems are disclosed herein. A sensing patch system includes a flexible substrate and a sensor node. The flexible substrate includes one or more substrate sensors configured to provide sensor data, one or more substrate conductors electrically coupled to a corresponding substrate sensor to conduct the sensor data provided by the corresponding substrate sensor, and a node interface. The sensor node includes a substrate interface configured to receive the node interface of the flexible substrate. The sensor node is configured to receive the sensor data provided by the substrate sensors, process the sensor data, and communicate the processed sensor data to a remote device.

公开(公告)号：US20210044030A1

公开(公告)日：2021-02-11

申请号：US16534820

申请日：2019-08-07

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Feras Eid ,  Georgios Dogiamis ,  Telesphor Kamgaing ,  Johanna M. Swan

IPC: H01Q23/00 ,  H01Q1/52 ,  H01Q1/02

Abstract: Embodiments may relate to a radio frequency (RF) multi-chip module that includes a first RF die and a second RF die. The first and second RF dies may be coupled with a package substrate at an inactive side of the respective dies. A bridge may be coupled with an active side of the first and second RF dies die such that the first and second RF dies are communicatively coupled through the bridge, and such that the first and second RF dies are at least partially between the package substrate and the bridge. Other embodiments may be described or claimed.

公开(公告)号：US10897238B2

公开(公告)日：2021-01-19

申请号：US15088987

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Feras Eid ,  Georgios C. Dogiamis ,  Valluri R. Rao ,  Adel A. Elsherbini ,  Johanna M. Swan ,  Telesphor Kamgaing ,  Vijay K. Nair

IPC: H03H9/54 ,  H03H9/05 ,  H03H9/17 ,  H03H9/15 ,  H03H9/02 ,  H03H9/24

Abstract: Embodiments of the invention include a filtering device that includes a first electrode, a piezoelectric material in contact with the first electrode, and a second electrode in contact with the piezoelectric material. The piezoelectric filtering device expands and contracts laterally in a plane of an organic substrate in response to application of an electrical signal between the first and second electrodes.

公开(公告)号：US20200098669A1

公开(公告)日：2020-03-26

申请号：US16141746

申请日：2018-09-25

Applicant: Intel Corporation

Inventor： Adel Elsherbini ,  Feras Eid ,  Johanna Swan

IPC: H01L23/473 ,  H01L23/498 ,  H01L21/48 ,  H01L23/427

Abstract: An integrated circuit structure may be formed having a substrate, at least one integrated circuit device embedded in and electrically attached to the substrate, and at least one heat transfer fluid conduit extending through the substrate, wherein the heat transfer fluid conduit is electrically attached to the at least one integrated circuit device. In one embodiment, the at least one heat transfer fluid conduit is a power transfer route for the at least one integrated circuit device.

公开(公告)号：US10594294B2

公开(公告)日：2020-03-17

申请号：US15088830

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Adel A. Elsherbini ,  Feras Eid ,  Baris Bicen ,  Telesphor Kamgaing ,  Vijay K. Nair ,  Georgios C. Dogiamis ,  Johanna M. Swan ,  Valluri R. Rao

IPC: H03H9/13 ,  H03H9/36

Abstract: Embodiments of the invention include a waveguide structure that includes a first piezoelectric transducer that is positioned in proximity to a first end of a cavity of an organic substrate. The first piezoelectric transducer receives an input electrical signal and generates an acoustic wave to be transmitted with a transmission medium. A second piezoelectric transducer is positioned in proximity to a second end of the cavity. The second piezoelectric transducer receives the acoustic wave from the transmission medium and generates an output electrical signal.

公开(公告)号：US20200083135A1

公开(公告)日：2020-03-12

申请号：US16129243

申请日：2018-09-12

Applicant: Intel Corporation

Inventor： Johanna Swan ,  Feras Eid ,  Adel Eisherbini

IPC: H01L23/367 ,  H01L23/498 ,  H01L23/42 ,  H01L21/48 ,  H01L23/00

Abstract: An integrated circuit structure may be formed having a substrate, at least one integrated circuit device embedded in and electrically attached to the substrate, and a heat dissipation device in thermal contact with the integrated circuit device, wherein a first portion of the heat dissipation device extends into the substrate and wherein a second portion of the heat dissipation device extends over the substrate. In one embodiment, the heat dissipation device may comprise the first portion of the heat dissipation device formed from metallization within the substrate.

公开(公告)号：US20190311980A1

公开(公告)日：2019-10-10

申请号：US15948803

申请日：2018-04-09

Applicant: Intel Corporation

Inventor： Feras Eid ,  Shawna M. Liff ,  Thomas Sounart ,  Johanna M. Swan

IPC: H01L23/498 ,  H01L23/14 ,  H01G4/008 ,  H05K1/16 ,  H01G4/30 ,  H01L21/48 ,  H05K1/18 ,  H01L41/047 ,  H01G4/12 ,  H01L41/187 ,  H01L41/053 ,  H01L41/29 ,  H01L41/314 ,  H01L29/16

Abstract: Disclosed herein are microelectronic assemblies with integrated perovskite layers, and related devices and methods. For example, in some embodiments, a microelectronic assembly may include an organic package substrate portion having a surface with a conductive layer, and a perovskite conductive layer on the conductive layer. In some embodiments, a microelectronic assembly may include an organic package substrate portion having a surface with a conductive layer, a perovskite conductive layer having a first crystalline structure on the conductive layer, and a perovskite dielectric layer having a second crystalline structure on the perovskite conductive layer. In some embodiments, the first and second crystalline structures have a same orientation.

公开(公告)号：US10418605B2

公开(公告)日：2019-09-17

申请号：US15475751

申请日：2017-03-31

Applicant: INTEL CORPORATION

Inventor： Veronica A. Strong ,  Sasha N. Oster ,  Feras Eid ,  Aranzazu Maestre Caro

IPC: H01M2/10 ,  H01M4/04 ,  C23C18/38 ,  C23C18/16 ,  B32B5/24 ,  G06F1/16 ,  H01L23/538 ,  C23C18/20 ,  C23C18/30 ,  H01M4/66 ,  H01M10/04 ,  A41D1/00 ,  A61B5/00 ,  H05K1/03 ,  A61B5/01 ,  A61B5/024 ,  A61B5/145

Abstract: An apparatus system is provided which comprises: a fabric; a self-assembled monolayer (SAM) material formed on the fabric; and a battery cell formed on the fabric, wherein a current collector of the battery cell is at least in part formed on the SAM material.

公开(公告)号：US10381291B2

公开(公告)日：2019-08-13

申请号：US15745701

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Adel A. Elsherbini ,  Henning Braunisch ,  Brandon M. Rawlings ,  Aleksandar Aleksov ,  Feras Eid ,  Javier Soto

IPC: H01L23/48 ,  H01L21/48 ,  H01L21/768 ,  H01L23/522 ,  H01L23/532

Abstract: Embodiments of the invention include conductive vias and methods for forming the conductive vias. In one embodiment, a via pad is formed over a first dielectric layer and a photoresist layer is formed over the first dielectric layer and the via pad. Embodiments may then include patterning the photoresist layer to form a via opening over the via pad and depositing a conductive material into the via opening to form a via over the via pad. Embodiments may then includeremoving the photoresist layer and forming a second dielectric layer over the first dielectric layer, the via pad, and the via. For example a top surface of the second dielectric layer is formed above a top surface of the via in some embodiments. Embodiments may then include recessing the second dielectric layer to expose a top portion of the via.