公开(公告)号：US09922715B2

公开(公告)日：2018-03-20

申请号：US14506433

申请日：2014-10-03

Applicant: Silicon Storage Technology, Inc.

Inventor： Hieu Van Tran ,  Hung Quoc Nguyen ,  Nhan Do

IPC: G11C16/14 ,  G11C16/24 ,  G11C16/04 ,  G11C16/26 ,  G11C16/12 ,  G11C16/10

CPC classification number: G11C16/24 ,  G11C16/0408 ,  G11C16/0425 ,  G11C16/10 ,  G11C16/12 ,  G11C16/14 ,  G11C16/26

Abstract: A non-volatile memory device that a semiconductor substrate of a first conductivity type. An array of non-volatile memory cells is in the semiconductor substrate arranged in a plurality of rows and columns. Each memory cell comprises a first region on a surface of the semiconductor substrate of a second conductivity type, and a second region on the surface of the semiconductor substrate of the second conductivity type. A channel region is between the first region and the second region. A word line overlies a first portion of the channel region and is insulated therefrom, and adjacent to the first region and having little or no overlap with the first region. A floating gate overlies a second portion of the channel region, is adjacent to the first portion, and is insulated therefrom and is adjacent to the second region. A coupling gate overlies the floating gate. A bit line is connected to the first region. A negative charge pump circuit generates a first negative voltage. A control circuit receives a command signal and generates a plurality of control signals, in response thereto and applies the first negative voltage to the word line of the unselected memory cells. During the operations of program, read or erase, a negative voltage can be applied to the word lines of the unselected memory cells.

公开(公告)号：US20170338330A1

公开(公告)日：2017-11-23

申请号：US15494499

申请日：2017-04-22

Applicant: Silicon Storage Technology, Inc.

Inventor： Chunming Wang ,  Leo Xing ,  Andy Liu ,  Melvin Diao ,  Xian Liu ,  Nhan Do

IPC: H01L29/66 ,  H01L27/11521 ,  H01L21/3213

CPC classification number: H01L29/66825 ,  H01L21/32133 ,  H01L27/11521 ,  H01L29/42328

Abstract: A method of forming a non-volatile memory cell on a substrate having memory cell and logic circuit regions by forming a pair of conductive floating gates in the memory cell region, forming a first source region in the substrate between the pair of floating gates, forming a polysilicon layer in both regions, forming an oxide layer over the polysilicon layer in the logic circuit region, performing a chemical-mechanical polish of the polysilicon layer in the memory cell area leaving a first block of the polysilicon layer between the floating gates that is separated from remaining portions of the polysilicon layer, and selectively etching portions of the polysilicon layer to result in: second and third blocks of the polysilicon layer disposed in outer regions of the memory cell area, and a fourth block of the polysilicon layer in the logic circuit region.

公开(公告)号：US20170337980A1

公开(公告)日：2017-11-23

申请号：US15374588

申请日：2016-12-09

Applicant: Silicon Storage Technology, Inc. ,  The Regents of the University of California

Inventor： Xinjie Guo ,  Farnood Merrikh Bayat ,  Dmitri Strukov ,  Nhan Do ,  Hieu Van Tran ,  Vipin Tiwari

IPC: G11C16/34 ,  G11C16/26 ,  G11C16/10 ,  G11C16/14 ,  H01L27/11558 ,  H01L27/11521

CPC classification number: G11C16/3431 ,  G11C7/18 ,  G11C8/14 ,  G11C16/0483 ,  G11C16/10 ,  G11C16/14 ,  G11C16/26 ,  G11C16/3427 ,  H01L27/11521 ,  H01L27/11524 ,  H01L27/11558 ,  H01L29/7881

Abstract: A memory device that provides individual memory cell read, write and erase. In an array of memory cells arranged in rows and columns, each column of memory cells includes a column bit line, a first column control gate line for even row cells and a second column control gate line for odd row cells. Each row of memory cells includes a row source line. In another embodiment, each column of memory cells includes a column bit line and a column source line. Each row of memory cells includes a row control gate line. In yet another embodiment, each column of memory cells includes a column bit line and a column erase gate line. Each row of memory cells includes a row source line, a row control gate line, and a row select gate line.

公开(公告)号：US20170317093A1

公开(公告)日：2017-11-02

申请号：US15476663

申请日：2017-03-31

Applicant: Silicon Storage Technology, Inc.

Inventor： Chunming Wang ,  Nhan Do

IPC: H01L27/11521 ,  G11C16/10 ,  G11C16/16 ,  H01L29/423

CPC classification number: H01L27/11521 ,  G11C16/0433 ,  G11C16/10 ,  G11C16/16 ,  H01L21/28273 ,  H01L27/11524 ,  H01L29/42328

Abstract: A memory device that includes a substrate of semiconductor material of a first conductivity type, first and second regions spaced apart in the substrate and having a second conductivity type different than the first conductivity type, with a continuous channel region in the substrate extending between the first and second regions. A first floating gate is disposed over and insulated from a first portion of the channel region adjacent to the first region. A second floating gate is disposed over and insulated from a second portion of the channel region adjacent to the second region. A word line gate is disposed over and insulated from a third portion of the channel region between the first and second channel region portions. A first erase gate disposed over and insulated from the first region. A second erase gate disposed is over and insulated from the second region.

公开(公告)号：US09793279B2

公开(公告)日：2017-10-17

申请号：US15182527

申请日：2016-06-14

Applicant: Silicon Storage Technology, Inc.

Inventor： Jeng-Wei Yang ,  Man-Tang Wu ,  Chun-Ming Chen ,  Mandana Tadayoni ,  Chien-Sheng Su ,  Nhan Do

IPC: H01L27/115 ,  H01L27/11524 ,  H01L29/423 ,  H01L21/28 ,  H01L29/788 ,  H01L29/66 ,  G11C16/26 ,  H01L27/11521

CPC classification number: H01L27/11524 ,  G11C16/26 ,  H01L21/28273 ,  H01L27/11521 ,  H01L29/42328 ,  H01L29/66825 ,  H01L29/7881 ,  H01L29/7883

Abstract: A memory device including a silicon semiconductor substrate, spaced apart source and drain regions formed in the substrate with a channel region there between, and a conductive floating gate disposed over a first portion of the channel region and a first portion of the source region. An erase gate includes a first portion that is laterally adjacent to the floating gate and over the source region, and a second portion that extends up and over the floating gate. A conductive word line gate is disposed over a second portion of the channel region. The word line gate is disposed laterally adjacent to the floating gate and includes no portion disposed over the floating gate. The thickness of insulation separating the word line gate from the second portion of the channel region is less than that of insulation separating the floating gate from the erase gate.

公开(公告)号：US20170012049A1

公开(公告)日：2017-01-12

申请号：US15182527

申请日：2016-06-14

Applicant: Silicon Storage Technology, Inc.

Inventor： Jeng-Wei Yang ,  Man-Tang Wu ,  Chun-Ming Chen ,  Mandana Tadayoni ,  Chien-Sheng Su ,  Nhan Do

IPC: H01L27/115 ,  G11C16/26 ,  H01L29/788 ,  H01L29/66 ,  H01L29/423 ,  H01L21/28

CPC classification number: H01L27/11524 ,  G11C16/26 ,  H01L21/28273 ,  H01L27/11521 ,  H01L29/42328 ,  H01L29/66825 ,  H01L29/7881 ,  H01L29/7883

Abstract: A memory device including a silicon semiconductor substrate, spaced apart source and drain regions formed in the substrate with a channel region there between, and a conductive floating gate disposed over a first portion of the channel region and a first portion of the source region. An erase gate includes a first portion that is laterally adjacent to the floating gate and over the source region, and a second portion that extends up and over the floating gate. A conductive word line gate is disposed over a second portion of the channel region. The word line gate is disposed laterally adjacent to the floating gate and includes no portion disposed over the floating gate. The thickness of insulation separating the word line gate from the second portion of the channel region is less than that of insulation separating the floating gate from the erase gate.

Abstract translation: 一种存储器件，包括硅半导体衬底，形成在衬底中的间隔开的源极和漏极区域，其间具有沟道区域，以及布置在沟道区域的第一部分和源极区域的第一部分之间的导电浮动栅极。 擦除栅极包括横向邻近浮动栅极并在源极区域上方的第一部分，以及在浮动栅极上方和上方延伸的第二部分。 导电字线栅极设置在沟道区域的第二部分上。 字线栅极横向地布置在浮动栅极附近，并且不包括设置在浮动栅极上的部分。 将字线栅极与沟道区域的第二部分分开的绝缘层的厚度小于将浮栅与擦除栅极分开的绝缘层的厚度。

公开(公告)号：US20160254269A1

公开(公告)日：2016-09-01

申请号：US14639063

申请日：2015-03-04

Applicant: Silicon Storage Technology, Inc.

Inventor： Jinho Kim ,  Vipin Tiwari ,  Nhan Do ,  Xian Liu ,  Xiaozhou Qian ,  Ning Bai ,  Kai Man Yue

IPC: H01L27/115 ,  H01L29/788 ,  H01L29/423

CPC classification number: H01L27/11524 ,  H01L23/57 ,  H01L27/11226 ,  H01L27/11233 ,  H01L27/11253 ,  H01L27/11519 ,  H01L29/42328 ,  H01L29/788 ,  H01L29/7881

Abstract: A memory device that includes a plurality of ROM cells each having spaced apart source and drain regions formed in a substrate with a channel region therebetween, a first gate disposed over and insulated from a first portion of the channel region, a second gate disposed over and insulated from a second portion of the channel region, and a conductive line extending over the plurality of ROM cells. The conductive line is electrically coupled to the drain regions of a first subgroup of the ROM cells, and is not electrically coupled to the drain regions of a second subgroup of the ROM cells. Alternately, a first subgroup of the ROM cells each includes a higher voltage threshold implant region in the channel region, whereas a second subgroup of the ROM cells each lack any higher voltage threshold implant region in the channel region.

Abstract translation: 一种存储器件，其包括多个ROM单元，每个ROM单元具有形成在衬底中的间隔开的源极和漏极区域，其间具有沟道区域，设置在沟道区域的第一部分上方并与沟道区域的第一部分绝缘的第一栅极， 与沟道区的第二部分绝缘，以及在多个ROM单元上延伸的导电线。 导电线电耦合到ROM单元的第一子组的漏极区域，并且不电耦合到ROM单元的第二子组的漏极区域。 或者，ROM单元的第一子组各自包括沟道区域中的较高电压阈值注入区域，而ROM单元的第二子组每个在沟道区域中都缺少任何较高电压阈值注入区域。

公开(公告)号：US20160217849A1

公开(公告)日：2016-07-28

申请号：US15002302

申请日：2016-01-20

Applicant: Silicon Storage Technology, Inc.

Inventor： Nhan Do ,  Xian Liu ,  Vipin Tiwari ,  Hieu Van Tran

IPC: G11C11/419 ,  G11C16/14 ,  H01L29/66 ,  H01L29/423 ,  H01L29/788

CPC classification number: G11C11/419 ,  G11C16/0458 ,  G11C16/14 ,  H01L27/11521 ,  H01L29/40114 ,  H01L29/42328 ,  H01L29/66825 ,  H01L29/7887

Abstract: A method of forming a memory device that includes forming on a substrate, a first insulation layer, a first conductive layer, a second insulation layer, a second conductive layer, a third insulation layer. First trenches are formed through third insulation layer, the second conductive layer, the second insulation layer and the first conductive layer, leaving side portions of the first conductive layer exposed. A fourth insulation layer is formed at the bottom of the first trenches that extends along the exposed portions of the first conductive layer. The first trenches are filled with conductive material. Second trenches are formed through the third insulation layer, the second conductive layer, the second insulation layer and the first conductive layer. Drain regions are formed in the substrate under the second trenches. A pair of memory cells results, with a single continuous channel region extending between drain regions for the pair of memory cells.

Abstract translation: 一种形成存储器件的方法，包括在衬底上形成第一绝缘层，第一导电层，第二绝缘层，第二导电层，第三绝缘层。 第一沟槽通过第三绝缘层，第二导电层，第二绝缘层和第一导电层形成，从而使第一导电层的侧面部分露出。 第一绝缘层形成在沿第一导电层的暴露部分延伸的第一沟槽的底部。 第一个沟槽填充有导电材料。 第二沟槽通过第三绝缘层，第二导电层，第二绝缘层和第一导电层形成。 在第二沟槽下的衬底中形成漏区。 导致一对存储单元，其中单个连续沟道区域在用于该对存储单元的漏极区域之间延伸。

公开(公告)号：US20160086962A1

公开(公告)日：2016-03-24

申请号：US14491596

申请日：2014-09-19

Applicant: Silicon Storage Technology, Inc.

Inventor： Chien-Sheng Su ,  Hieu Van Tran ,  Mandana Tadayoni ,  Nhan Do ,  Jeng-Wei Yang

IPC: H01L27/115 ,  H01L21/762 ,  H01L29/423 ,  H01L21/306 ,  H01L29/66 ,  H01L29/06

CPC classification number: H01L27/11531 ,  H01L21/28273 ,  H01L21/30604 ,  H01L21/76224 ,  H01L21/7624 ,  H01L27/11521 ,  H01L27/11534 ,  H01L27/1207 ,  H01L29/0649 ,  H01L29/42328 ,  H01L29/66825

Abstract: A method of forming a semiconductor device starts with a substrate of silicon, a first insulation layer on the silicon, and a silicon layer on the first insulation layer. The silicon layer and the insulation layer are removed just from a second substrate area. A second insulation layer is formed over the silicon layer in the substrate first area and over the silicon in the second substrate area. A first plurality of trenches is formed in the first substrate area that each extends through all the layers and into the silicon. A second plurality of trenches is formed in the second substrate area that each extends through the second insulation layer and into the silicon. An insulation material is formed in the first and second trenches. Logic devices are formed in the first substrate area, and memory cells are formed in the second substrate area.

Abstract translation: 形成半导体器件的方法从硅衬底，硅上的第一绝缘层和第一绝缘层上的硅层开始。 仅从第二衬底区域去除硅层和绝缘层。 第二绝缘层形成在衬底第一区域中的硅层之上并且在第二衬底区域中的硅上方。 第一多个沟槽形成在第一衬底区域中，每个沟槽延伸穿过所有层并进入硅中。 第二多个沟槽形成在第二衬底区域中，每个沟槽延伸穿过第二绝缘层并进入硅中。 绝缘材料形成在第一和第二沟槽中。 逻辑器件形成在第一衬底区域中，并且存储器单元形成在第二衬底区域中。

公开(公告)号：US09293204B2

公开(公告)日：2016-03-22

申请号：US14252929

申请日：2014-04-15

Applicant: Silicon Storage Technology, Inc.

Inventor： Nhan Do ,  Jinho Kim ,  Xian Liu

IPC: H01L29/788 ,  H01L27/115 ,  G11C16/04 ,  G11C16/14 ,  H01L29/66 ,  H01L29/423

CPC classification number: G11C16/14 ,  G11C16/0416 ,  H01L27/11521 ,  H01L27/11553 ,  H01L29/42328 ,  H01L29/42336 ,  H01L29/66825 ,  H01L29/7881 ,  H01L29/7889

Abstract: A memory device, and method of making the same, in which a trench is formed into a substrate of semiconductor material. The source region is formed under the trench, and the channel region between the source and drain regions includes a first portion that extends substantially along a sidewall of the trench and a second portion that extends substantially along the surface of the substrate. The floating gate is disposed in the trench, and is insulated from the channel region first portion for controlling its conductivity. A control gate is disposed over and insulated from the channel region second portion, for controlling its conductivity. An erase gate is disposed at least partially over and insulated from the floating gate. An electrically conductive coupling gate is disposed in the trench, adjacent to and insulated from the floating gate, and over and insulated from the source region.

Abstract translation: 存储器件及其制造方法，其中将沟槽形成为半导体材料的衬底。 源极区形成在沟槽下方，并且源极和漏极区域之间的沟道区域包括基本上沿着沟槽的侧壁延伸的第一部分和基本上沿着衬底的表面延伸的第二部分。 浮栅设置在沟槽中，与沟道区第一部分绝缘，用于控制其导电性。 控制栅极设置在沟道区第二部分之上并与沟道区第二部分绝缘，以控制其导电性。 擦除栅极至少部分地布置在浮栅上并与浮栅绝缘。 导电耦合栅极设置在沟槽中，与浮动栅极相邻并与其隔离，并且与源极区域隔离并且绝缘。